JP5224782B2 - Method for manufacturing liquid discharge head - Google Patents

Description

The present invention relates to a manufacturing method of the liquid discharge heads for discharging liquid from the discharge port.

  Conventionally, an inkjet head is most widely known as a liquid ejection head that ejects liquid from an ejection port.

  As a method of manufacturing this ink jet head, a method of forming an ink supply port by anisotropic etching as described in Patent Document 1 is known.

  Furthermore, as a method of forming a high-density and high-precision flow path and discharge port, methods described in Patent Document 2 and Patent Document 3 are known, and ink supply ports are combined by anisotropic etching. The method is also described in Patent Document 1.

  In addition, in an ink jet head that discharges ink in a direction opposite to the heat generating surface of the heating resistor, the electrical connection between the electrode for supplying electricity to the heating resistor on the substrate and the external wiring board is open to the discharge port of the substrate. The connection is made in the vicinity of the surface (discharge port forming surface). At this time, as described in Japanese Patent Application Laid-Open No. H10-228707, the electrical joint portion enters between the discharge port and the paper, so that the recording performance is affected. However, providing the electrical connection portion on the discharge port forming surface side of the substrate always forms a protruding portion, and accordingly, the interval between the paper and the discharge port is increased.

  Therefore, in order to eliminate the protruding portion, it has been considered to perform electrical bonding on the surface of the substrate opposite to the discharge port forming surface. Specifically, as described in Patent Document 5, a through electrode is provided on the surface on the opposite side from the discharge port forming surface side of the substrate, and is bonded to the external wiring board on the surface on the opposite side from the discharge port of the substrate. It is a method.

  Here, FIG. 6 shows an example of an inkjet head provided with a through electrode. FIG. 6A is a schematic plan view of such an ink jet head. The through electrode 305 is not shown here. 6B is a schematic cross-sectional view taken along line X3-Y3 shown in FIG. 6A.

The ink supply port 302 that penetrates the substrate 301 is penetrated in a rectangular shape in the column direction of the heating resistors, that is, in the recording width direction. Here, in order to improve the recording speed, there is a demand to increase the recording width by one head scan.
JP 10-13849 A JP-A-5-330066 JP-A-6-286149 Japanese Patent Publication No. 8-25272 JP 2006-321222 A

  However, increasing the recording width means lengthening the ejection port array, and as a result, the ink supply port 302 becomes longer. When the ink supply port 302 becomes larger, the deformation of the central portion of the ink supply port 302 becomes larger, and the flow path forming member formed on the surface of the substrate 301 is peeled off from the substrate 301 or the substrate 301 itself is cracked. was there.

The present invention aims to provide a manufacturing method of the liquid discharge heads in which the deformation of the central portion is suppressed in the liquid supply port of the substrate of the liquid discharge head having a through electrode.

To achieve the above object, the present invention provides a first member including a member having a discharge port for discharging liquid, discharge energy generating means for generating discharge energy for discharging liquid from the discharge port, and a liquid supply port. In the method of manufacturing a liquid discharge head having a substrate, a step of forming a member on the surface of the first wafer, a step of forming a plurality of liquid supply ports through the first wafer, Forming a first through electrode through the first wafer for supplying electric power to the discharge energy generating means, and penetrating the second wafer through the second wafer, A step of forming a second through electrode, a step of forming a second through electrode through the second wafer, a back surface of the first wafer, and a surface of the second wafer, The liquid supply port and the opening communicate with each other, and the first through electrode and the second electrode A step in which the through electrode is joined so as to be electrically conductive, a first wafer and a second wafer joined in the step of the bonding, the member is not provided, around the outside of said member By cutting the first wafer, the member is formed on the front surface and the second wafer formed on the second wafer and having the second through electrode and the opening is bonded to the back surface. A step of cutting a plurality of first substrates formed and having first through electrodes and liquid supply ports.

  According to the present invention, since the second through electrode penetrates to the back surface of the reinforcing plate, an external electrode for supplying electric power for driving the thermal energy generating means is joined to the second through electrode. Is possible.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  In the following description, an inkjet head is used as an embodiment of the liquid discharge head of the present invention. Accordingly, the inkjet head is an embodiment of a liquid ejection head, and the inkjet head substrate is an embodiment of a liquid ejection head substrate. Similarly, the ink is a liquid, the ink discharge port is a liquid discharge port, the ink supply port is a liquid supply port, and the ink supply member is a liquid supply member. The liquid discharge head of the present invention can be used as a device that discharges liquid fuel, cosmetic liquid, chemical liquid, and the like in addition to ink.

  FIG. 1A is a schematic plan view showing an inkjet head according to an embodiment of the present invention. The first through electrode 105 is not shown here. 1B is a schematic cross-sectional view taken along line X1-Y1 shown in FIG. 1A of the ink jet head according to the embodiment of the present invention. FIG. 1C is a schematic cross-sectional view taken along line X2-Y2 shown in FIG. 1A of the inkjet head according to the embodiment of the present invention.

  The ink jet head of the present embodiment is reinforced on the back side of the substrate in order to prevent deformation of the opening of the ink supply port 102 and the like penetrating the substrate surface on which the flow path forming member 104 and the like are formed and the back surface on the opposite side. A reinforcing plate 106 as a member is provided. Furthermore, in this embodiment, in order to obtain electrical connection between the first through electrode 105 provided on the substrate 101 and the outside of the substrate, the second through the reinforcing plate 106 electrically connected to the first through electrode 105. A through electrode 109 is provided.

  Here, when the reinforcing plate not provided with the second through electrode 109 (the reinforcing plate without the through electrode) is joined to the back surface of the substrate 101 provided with the first through electrode 105, the first through electrode The external electrode cannot be joined to the outside by bonding the external electrode to 105. On the other hand, it is also conceivable to directly attach an external extraction wiring to the first through electrode 105 before joining the reinforcing plate without the through electrode to the back surface of the substrate 101. However, for that purpose, a reinforcing plate without a through electrode is bonded to the chip after the substrate 101 is cut out from the silicon wafer 100a, and this makes the meaning of reinforcement disappear.

  Therefore, in the manufacturing process of the inkjet head according to the embodiment of the present invention, the reinforcing plate 109 corresponding to each substrate 101 is provided on the back surface of the substrate 101 provided with the first through electrode 105, which is configured in large numbers on the silicon wafer 100a. A large number of silicon wafers 100b are bonded. At this time, each reinforcing plate 109 includes a second through electrode 109 corresponding to each substrate 101 and provided to be electrically conductive with the first through electrode 105 of each substrate 101. Further, the ink supply port 102 of each substrate 101 is formed before joining the reinforcing plate, and the opening 106c of the reinforcing plate 109 is formed after joining the reinforcing plate.

  Hereinafter, the ink jet head according to this embodiment will be described in detail.

  The flow path forming member 104 is formed on the surface 101a of the substrate 101 formed on the surface of the silicon wafer 100a. The flow path forming member 104 is formed with a plurality of ink discharge ports 103 for discharging ink and a flow channel 104 a communicating with each ink discharge port 103.

  A rectangular ink supply port 102 for supplying ink to the flow path 104 a of the flow path forming member 104 is formed on the substrate 101. Further, the surface 101 a of the substrate 101 is provided with ejection energy generating means for generating ejection energy for ejecting ink from the ink ejection port 103 at a position corresponding to the ink ejection port 103. As the discharge energy generating means, a heating resistor 110 for generating thermal energy as discharge energy is provided. Further, the substrate 101 is provided with a first through electrode 105 penetrating from the front surface 101a side to the back surface 101b side. The first through electrode 105 serves as a path for supplying power for generating heat from the heating resistor 110.

  The reinforcing plate 106 as a reinforcing member of the substrate 101 is for suppressing deformation of the substrate 101 on which the ink supply port 102 is formed, and is disposed on the back surface 101 b side of the substrate 101. An opening 106 c corresponding to the ink supply port 102 is formed in the reinforcing plate 106. The beams 107 are arranged in parallel at a predetermined interval in the longitudinal direction of the opening 106c of the reinforcing plate 106. Further, the reinforcing plate 106 is provided with a second through electrode 109 penetrating from the front surface 106a side to the back surface 106b side.

  The wiring 108 is formed on the surface 106 a of the reinforcing plate 106, and electrically connects the first through electrode 105 and the second through electrode 109 by bonding the substrate 101 and the reinforcing plate 106. That is, the first through electrode 105 and the second through electrode 109 are electrically connected via the wiring 108.

  Next, a method for manufacturing the ink jet head according to this embodiment will be described.

  First, the manufacturing process of the substrate 101 will be described.

  A TaN layer as a heating resistor layer and an Al layer as an electrode layer are formed on a substrate of a silicon wafer 100a having a thickness of 300 μm by sputtering, and the heating resistor 110 and the electrode are formed by using a photolithography technique. The size of the heating resistor 110 is 30 μm × 30 μm. If necessary, a protective layer may be provided thereon. Next, in order to form through electrodes corresponding to the respective substrates 101 in the silicon wafer 100a, through holes having a diameter of 50 μm are formed by dry etching. Then, a plating seed layer is formed in the through hole, and the through hole is filled with gold by electrolytic plating to form the first through electrode 105 by gold plating. In this way, the substrate 101 with the heating resistor 110 on which the first through electrode 105 is formed is completed. A large number of such substrates 101 are formed in a lattice pattern on the silicon wafer 100a.

  Next, as a mold for forming the ink flow path 104a from the ink supply port 102 to the ink discharge port 103, a thick positive resist is applied to the surface 101a of the substrate 101 by 15 μm, and is exposed and developed. A desired pattern is formed and configured. Then, a photosensitive negative epoxy 30 μm serving as the flow path forming member 104 is applied so as to cover the positive resist mold formed on the surface 101a. Thereafter, negative type epoxy is exposed and developed to form an ink ejection port 103 having a diameter of 25 μm.

  Next, a resin is applied thereon as a protective material, a mask material serving as an etching mask is formed and patterned on the back surface 101b, and the entire substrate 101 is then immersed and etched in an anisotropic etchant. As a result, each ink supply port 102 is formed on each substrate 101. Finally, the resin as the protective material applied to the surface of the flow path forming member 104 and the positive resist that is the mold material of the flow path 104a are removed.

  In this way, the substrate 101 with the heating resistor 110 in which the ink discharge port 103 and the flow path 104a are formed is completed. A large number of such substrates 101 are formed in a lattice pattern on the silicon wafer 100a.

  FIG. 2A is a schematic view of a silicon wafer 100a formed by arranging the substrates 101 thus completed in a lattice pattern. FIG. 2B shows an enlarged view of one of the completed substrates 101 formed on the silicon wafer 100a.

  Next, the manufacturing process of the reinforcing plate 106 will be described.

  First, a through hole having a diameter of 50 μm is formed by dry etching on a substrate of a silicon wafer 100b having a thickness of 300 μm. Then, a plating seed layer is formed in the through hole, and the through hole is filled with gold by electrolytic plating to form the second through electrode 109 by gold plating. At that time, since wiring can be formed on the front and back surfaces of the silicon substrate at the same time, the wiring 108 is formed on the front surface 106a by gold plating. Note that a wiring can be formed on the back surface 106b as necessary.

  Next, the opening 106c provided with the beam 107 is formed by dry etching. In this way, the reinforcing plate 106 in which the wiring 108 and the second through electrode 109 are formed is completed. FIG. 3A is a schematic plan view of a silicon wafer 100b in which the reinforcing plates 106 thus completed are arranged in a lattice pattern. FIG. 3B shows an enlarged view of one of the completed reinforcing plates 106 formed on the silicon wafer 100b.

  The substrate 101 and the reinforcing plate 106 formed as described above are still in the form of a 6-inch (152.4 mm) wafer. Next, the silicon wafers 100 a and 100 b are set such that the back surface 101 b of the substrate 101 and the surface 106 a of the reinforcement 106 face each other. Further, the ink supply port 102 and the opening 106c communicate with each other, and the first through electrode 105 and the second through electrode 109 are positioned and fixed so as to be electrically conductive. And it press-bonds and joins by applying a pressure on 200 degreeC temperature conditions. As a result, the first through electrode 105 of the substrate 101 and the wiring 108 of the reinforcing plate 106 are electrically joined by Au—Au bonding, and the electrical wiring between the first through electrode 105 and the second through electrode 109 is completed. To do. As a result, the heating resistor 110 formed on the surface 101a of the substrate 101 and the second through electrode 109 are electrically connected.

  FIG. 4A is a schematic plan view showing a state where the back surface of the silicon wafer 100a and the front surface of the silicon wafer 100b are joined in this manner. FIG. 4B shows an enlarged view of one of the substrates 101 with the reinforcing plate 106 in a state where the two wafers are bonded.

  Next, by cutting the bonded silicon wafer, the substrate 101 to which the reinforcing plate 106 is bonded in the wafer state is formed into chips. The substrate 101 formed into a chip is sealed with a sealing material at an electrical junction or an ink supply junction. Thereafter, the inkjet head is completed through a mounting process of the external wiring board and an adhesion process of the ink supply member.

  As described above, according to the present embodiment, by providing the second through electrode 109 on the reinforcing plate 106, the external electrode can be joined on the back surface 106 b side of the reinforcing plate 106. In the case of the present embodiment, the reinforcing plate 106 is bonded to the substrate 101 in a wafer state. For this reason, since the deformation of the ink supply port 102 can be suppressed by the reinforcing plate 106 even if the chip is formed, it is possible to prevent the flow path forming member 104 from peeling off or cracking. Further, by providing the reinforcing plate 106, it can withstand the generation of stress due to heat in the mounting process of the external wiring board and the bonding process of the ink supply member, and the deformation of the ink supply port 102 is suppressed. By suppressing the deformation of the ink supply port 102 in the chip state as described above, it is possible to cope with an increase in the recording width for improving the recording speed without any problem.

  Further, in the case of the present embodiment, since it is not necessary to provide an external electrode on the surface 106a side of the substrate on which the ink discharge ports 103 are provided, electrical mounting on the surface 101a of the substrate 101 is eliminated. For this reason, the interval between the ink jet head and the paper that is the recording medium can be narrowed, and the recording quality can be improved as the landing accuracy of the ink on the recording medium is improved.

  In the ink jet head according to the present embodiment, since the reinforcing plate 106 is made of silicon, it is possible to adopt another form in which a driving element 211 is provided on the reinforcing plate 106 as shown in FIG. FIG. 5A is a schematic plan view of the inkjet head. The second through electrode 105 is not shown here. 5B is a schematic cross-sectional view taken along line X2-Y2 shown in FIG. 5A, and FIG. 5C is a schematic cross-sectional view taken along line X2-Y2 shown in FIG. 5A.

  On the surface 106a of the reinforcing plate 106, a driving element 211 and wirings 108a and 108b for driving the heating resistor 110 are formed. The drive element 211 is electrically connected to the first through electrode 105 through the wiring 108a and is electrically connected to the second through electrode 109 through the wiring 108b. By providing the driving element 211 on the reinforcing plate 106, it is not necessary to provide a driving element on the substrate 101 side, so that the substrate 101 can be reduced in size and the cost of the substrate 101 can be reduced.

1 is a schematic plan view showing an ink jet head according to an embodiment of the present invention. It is typical sectional drawing in the X1-Y1 line | wire shown to FIG. 1A of the inkjet head which concerns on embodiment of this invention. It is typical sectional drawing in the X2-Y2 line | wire shown to FIG. 1A of the inkjet head which concerns on embodiment of this invention. FIG. 3 is a schematic plan view of a silicon wafer formed by arranging an inkjet head substrate in a lattice pattern. It is the typical top view to which one of the inkjet head substrates formed in the silicon wafer of Drawing 2A was expanded. FIG. 3 is a schematic plan view of a silicon wafer formed by arranging reinforcing plates in a lattice pattern. It is the typical top view to which one of the reinforcement boards formed in the silicon wafer of Drawing 3A was expanded. It is a typical top view which shows the state which joined the silicon wafer which formed the reinforcement board corresponding to the grid | lattice form to the back surface of the silicon wafer which formed the inkjet head board | substrate in the grid | lattice form. It is the typical top view which expanded one of the inkjet head board | substrates with a reinforcement board in the state which joined the two silicon wafers of FIG. 4A. It is a typical top view which shows the board | substrate of the form provided with the drive element in the reinforcement board of the inkjet head which concerns on embodiment of this invention. It is typical sectional drawing in the X1-Y1 line | wire shown to FIG. 5A of the inkjet head which concerns on embodiment of this invention. It is typical sectional drawing in the X2-Y2 line | wire shown to FIG. 5A of the inkjet head which concerns on embodiment of this invention. It is a schematic plan view showing an example of a conventional inkjet head. It is typical sectional drawing in the X3-Y3 line shown to FIG. 6A.

Explanation of symbols

101 Substrate 101a, 106a Front surface 101b, 106b Back surface 102 Ink supply port 103 Discharge port 104 Nozzle material 105 First through electrode 106 Reinforcing plate 107 Beam 108 Electrode 109 Second through electrode 211 Drive element

Claims (3)

Manufacturing of a liquid discharge head comprising: a member having a discharge port for discharging liquid; a first substrate having discharge energy generating means for generating discharge energy for discharging liquid from the discharge port; and a liquid supply port. In the method
Forming the member on the surface of the first wafer;
Forming a plurality of the liquid supply ports through the first wafer;
Forming a first through electrode in the first wafer for passing through the first wafer and supplying power to the ejection energy generating means;
Forming a plurality of openings in the second wafer through the second wafer;
Forming a second through electrode in the second wafer by penetrating the second wafer;
The back surface of the first wafer and the front surface of the second wafer communicate with each other through the liquid supply port and the opening, and the first through electrode and the second through electrode are electrically connected. The step of joining
The member is formed on the surface by cutting the first wafer and the second wafer bonded in the bonding step around the outside of the member where the member is not provided, And the second substrate formed on the second wafer and having the second through electrode and the opening bonded to the back surface is formed on the first wafer and the first through electrode and the Cutting out a plurality of the first substrates having a liquid supply port;
A method for manufacturing a liquid discharge head, comprising:   After forming wiring for electrically connecting the first through electrode and the second through electrode on the surface of the second substrate formed on the second wafer, the first through electrode is formed. The method of manufacturing a liquid discharge head according to claim 1, wherein a wafer and the second wafer are bonded.   2. The first wafer and the second wafer are bonded to each other after forming a driving unit that drives the ejection energy generating unit on the second substrate formed on the second wafer. Or the manufacturing method of the liquid discharge head of 2.

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