JPH10119276A - Ink jet recording head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce a cost by decreasing the number of parts by a method wherein adhesive resin is filled between a support component for fixing a recording element substrate by bonding and a wiring substrate. SOLUTION: A heating resistant element layer, a wiring layer, and the like are patterned on a silicon water by a photolithographic technique, a nozzle wall, and a discharge opening are made of photosensitive resin, a recording liquid feed opening is formed by anisotropic etching, and a recording element substrate 1 is formed. The substrate 1 is bonded to a wiring substrate 4 giving a recording signal for discharging recording liquid to the substrate 1. An upside of a lead wiring is sealed. Those are fixed to a support component composed of a molding component 7 and a heat radiation component 8 by bonding. In this case adhesive resin 11 is filled between the support component and the wiring component 4, which is cured. Since a fixing component used as an adhesive face of the wiring substrate can be removed, the number of pieces of parts can be reduced by one piece of the part, and a bonding process wherein the fixing component is bonded to the support component can be eliminated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet recording head for an ink jet recording apparatus which forms a liquid droplet by ejecting a liquid from an orifice.

[0002]

2. Description of the Related Art An ink jet recording apparatus is a recording apparatus of a so-called non-impact recording method, capable of high-speed recording and recording on various recording media, and has substantially no noise during recording. It has various features such as From such a point, it has been widely adopted as a device carrying a recording mechanism such as a printer, a word processor, a facsimile, a copying machine, and the like.

As a typical method of the ink jet recording, there is a method using an electrothermal conversion element, in which ink droplets are discharged from minute discharge ports to perform recording on recording paper. In general, the head includes an ink jet recording head for forming droplets and a supply system for supplying a recording liquid to the head. In an ink jet recording head using an electrothermal conversion element, an electrothermal conversion element is provided in a pressurized chamber, and thermal energy is given to the recording liquid by applying an electric pulse serving as a recording signal to the recording medium, and the phase change of the recording liquid at that time The bubble pressure at the time of bubbling (at the time of boiling) of the recording liquid caused by the above is used for discharging the recording liquid droplets.

An "edge shooter" for discharging a recording liquid in parallel to a substrate on which electrothermal transducers are arranged.
There is a type and a "side shooter" type in which the recording liquid is discharged perpendicularly to the substrate on which the electrothermal transducers are arranged.

In the latter side shooter type ink jet recording head, a wiring substrate and a recording element substrate based on a polyimide film, and a molding material for forming a recording liquid supply path and bonding and fixing the wiring substrate and the recording element substrate are provided. And the like. In order to assemble the recording head, it is general to connect a recording element substrate to a wiring substrate to form an integral component and adhere and fix it to the support member. A step corresponding to the thickness of the recording element substrate is provided between the recording element substrate and the surface.

Further, in a high-resolution and high-density recording element substrate, a heat radiating member for suppressing a temperature rise during printing (recording) is required, and a heat sink having good heat conductivity as an aluminum material heat sink is required. Materials are used. The heat radiating member is bonded to the back surface of the recording element substrate to promote a heat radiation effect, and is used as a part of a support member for bonding and fixing the recording element substrate and the wiring substrate.

FIG. 5 is an exploded perspective view of a conventional ink jet recording head. FIG. 6A is a three-sided view of the recording element substrate of the side shooter system, FIG. 6B is a diagram in which the recording element substrate 1 and the wiring substrate 4 are connected, and FIG. FIG. 7 is a perspective view of the inkjet recording head after assembly is completed.
FIG. 2B is a sectional view taken along the line AA of FIG.

5 to 7, reference numeral 1 denotes a printing element substrate;
Is a discharge port for discharging the recording liquid, 4 is a wiring board based on a polyimide film, on which a signal line for supplying a recording signal to the recording element substrate 1 is wired, 5 is a recording element substrate 1 and a wiring substrate 4 is a lead bonding part for connecting to the recording element substrate; 6 is a recording liquid supply path for supplying a recording liquid to the recording element substrate 1; and 7 is a recording liquid supply path for holding the recording element substrate 1 and supplying the recording liquid. A mold member constituting the path 6, a heat dissipation member 8 made of aluminum having good thermal conductivity as a heat sink, a fixing member 9, and a mounting surface of the heat dissipation member on which the recording element substrate 1 is mounted.

[0009]

An ink jet recording head of this type is composed of a recording element substrate, a wiring substrate, and a supporting member, and a part of the supporting member for adhering and fixing the heat radiating member to the wiring substrate and the recording element substrate. When used as a support member, a molding material for forming a recording liquid supply path, a heat radiating member for bonding and fixing the recording element substrate, and a bonding member for bonding the wiring substrate while keeping the surface of the recording element substrate and the wiring substrate surface substantially flush with each other. It has a three-member configuration of a fixing member. In terms of cost, it is advantageous that the number of parts is small.There is a method in which a heat radiating member is processed and a step similar to the thickness of the fixing member is provided instead of the fixing member to serve also as the fixing member. Is often made of Si material, and the bonding surface is required to have a high flatness so that the recording element substrate is not stuck.

In order to form a step corresponding to the fixing member by press working, it is necessary to enlarge the heat dissipating member itself in order to compensate for the bent portion, and it is difficult to obtain the planar accuracy of the portion where the recording element substrate is bonded and fixed. In the method of shaving with a milling machine, it is necessary to increase the thickness of the entire member by an amount corresponding to the step to be shaved, and there remains a problem that the cost is high and it is not suitable for mass production.

Accordingly, a first object of the present invention is to provide a product which is inexpensive in terms of cost by reducing the number of parts of a supporting member in an ink jet recording head requiring a heat radiating member.

[0012]

According to the present invention, in order to solve the above-mentioned problems, a plurality of recording conversion elements for ejecting a recording liquid perpendicularly to a substrate are arranged in at least one line in a substantially linear manner. A recording element substrate provided with a recording liquid supply port for supplying the recording liquid from the back surface of the substrate, and an outer periphery of the recording element substrate for transmitting an electric pulse serving as a recording signal to the recording element substrate. In an ink jet recording apparatus having a wiring board disposed on the same plane and a heat radiating member for suppressing a rise in temperature during printing, bonding is performed between a wiring member and a supporting member for bonding and fixing the recording element substrate. It is characterized by being filled with a resin, and further comprising a plurality of protrusions having a height approximately equal to the thickness of the recording element substrate on the wiring substrate bonding surface of the support member. By providing a jet recording head, it is intended to achieve the object.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on a plurality of embodiments with reference to the drawings.

[0014]

【Example】

(Embodiment 1) FIG. 1 is an exploded perspective view of an ink jet recording head according to a first embodiment which best illustrates the features of the present invention.
FIG. 2A shows an ink jet recording head after the assembly is completed in FIG. 1, and FIG. 2B shows a cross-sectional view taken along the line AA in FIG. 2A. The same components as those in FIGS. 5 to 7 showing the conventional example are denoted by the same reference numerals.

In FIG. 1, there is a partial overlap with the description of FIGS. 5 to 7, wherein 1 is a recording element substrate, 2 is a discharge port for discharging a recording liquid, and 4 is a polyimide film based recording medium. A wiring board 5 on which a signal line for supplying a recording signal is provided to the element substrate 1, a lead bonding portion 5 for connecting the recording element substrate 1 to the wiring board 4,
Is a recording liquid supply path for supplying a recording liquid to the recording element substrate 1,
Reference numeral 7 denotes a mold member that holds the recording element substrate 1 and forms a recording liquid supply path 6 for supplying a recording liquid.
Aluminum material with good thermal conductivity as heat sink (A105
0P) is a heat dissipating member that can hold the recording element substrate 1 and bond and fix the input terminal surface of the wiring substrate 4 to the back surface. 1
Reference numeral 0 denotes a surface of the heat radiation member according to the present embodiment to which the recording element substrate is bonded, and reference numeral 11 denotes an adhesive resin.

First, the recording element substrate 1 is usually formed by patterning a heating resistance element layer, wiring, and the like on a silicon wafer by a photolithography technique, forming nozzle walls and discharge ports with a photosensitive resin, and anisotropically etching the recording liquid. A supply port is formed, and the outer shape is formed by cutting. Since the ink jet recording head according to the present invention is a "side shooter" type, as shown in FIG. 6A, a plurality of orifices and recording elements for discharging a recording liquid are arranged as in the conventional example. A recording liquid supply port 3 for supplying a recording liquid to the discharge ports 2 is opened at substantially the center of the recording element substrate 1 with a length substantially equal to the length of the discharge port array. The recording liquid supply port 3 is generally formed by sandblasting, anisotropic etching, laser processing, or the like.

Then, as shown in FIG. 6 (b), the wiring substrate 4 for supplying a recording signal for discharging the recording liquid to the recording element substrate 1 and the recording element substrate 1 are TAB-bonded, and the lead wiring is Sealed. Then, as shown in FIG.
And is adhesively fixed to the supporting member.

With respect to the flatness between the wiring substrate 4 and the recording element substrate 1, during printing (recording), a recording liquid extra-attached to the discharge port surface of the recording element substrate 1 at a certain time interval. Because the blade for wiping comes into contact,
It is necessary that the ejection port surface of the recording element substrate 1 and the wiring substrate 4 be substantially on the same plane.

In addition, there is a condition that the surface of the wiring substrate 4 must be flat in order to cap the wiring substrate 4 surrounding the recording element substrate 1 when the recording head is stored.

The wiring board 4 has a thickness of 50 (μm).
Although it is based on a polyimide film of about, the protective material is coated on the signal wiring,
Because the strength and flatness of the wiring board 4 itself are high,
As shown in FIG. 7, the portion where the fixing member 9 was provided was filled with the adhesive resin 11 and cured.

In the first embodiment, the number of components can be reduced by one by eliminating the fixing member 9 from the conventional ink jet recording head shown in FIGS. 5 and 7, and the fixing member 9 is bonded to the supporting member. One bonding step can be eliminated.

(Embodiment 2) FIG. 3A shows a second embodiment of the present invention.
FIG. 3B is an exploded perspective view of the ink jet recording head according to the embodiment, and FIG. 3B is a sectional view taken along the line AA in FIG.

In the second embodiment, a plurality of projections 12 as shown in FIG. 3A are provided in order to accurately maintain the distance between the heat radiation member 8 and the wiring board 4. And the first embodiment
In the same manner as described above, the recording element substrate 1 was bonded, the wiring substrate 4 was abutted against each projection 12, and the adhesive resin 11 was filled between the recording substrate 1 and the heat radiation member 8 and cured.

Each of the projections 12 is formed by a mold member 7, and a hole for projecting a projection is formed in the heat radiation member 8 at the time of punching, and the two are adhered to each other to form the recording element substrate 1 and the wiring substrate 4. It is a supporting member.

(Embodiment 3) FIG. 4A shows a third embodiment of the present invention.
FIG. 4B is an exploded perspective view of the ink jet recording head according to the embodiment, and FIG. 4B is a sectional view taken along the line AA of FIG.

In the third embodiment, a plurality of projections 13 formed by press working are used.
The recording element substrate 1 was adhered, the wiring substrate 4 was brought into contact with each projection 13, and the adhesive resin 11 was filled between the recording substrate 1 and the heat radiation member 8 and cured.

It is difficult to form a step corresponding to the fixing member 9 in FIGS. 5 and 7 by press working in terms of cost and planar accuracy. However, this step is formed by press working in the above-mentioned projection shape. In this case, the size of the heat dissipating member 8 before press working is substantially the same as that of the conventional heat dissipating member, and the deformation generated on the recording element substrate bonding surface is extremely small.

In the third embodiment, an ink jet recording head of this type can be manufactured with the same processing cost and work steps as those in the first embodiment.

[0029]

As described above, according to the present invention,
Filling and curing an adhesive resin instead of a fixing member that has been conventionally used as an adhesive surface of a wiring board, thereby simplifying one member and shortening the working process, thereby providing an inexpensive inkjet recording head. Can be.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of an inkjet recording head according to a first embodiment.

2 (a) and FIG. 2 (a) of FIG.
-A sectional view (b)

FIG. 3 is an exploded perspective view of an ink jet recording head according to a second embodiment, and FIG.

FIG. 4 is an exploded perspective view of an ink jet recording head according to a third embodiment (a) and an AA sectional view thereof (b).

FIG. 5 is an exploded perspective view of a conventional inkjet recording head.

FIGS. 6A and 6B are three views of a printing element substrate according to the related art and the present invention, and FIG. 6B is a perspective view illustrating a connection between the printing element substrate and a wiring board;

7 (a) and the sectional view taken along line AA of FIG. 5 (b).

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Recording element board 2 Discharge port 3 Recording liquid supply port 4 Wiring board 5 Lead wiring 6 Recording liquid supply path 7 Mold member 8 Heat radiating member 9 Fixing member 10 Adhesion surface of recording element substrate 11 Adhesive resin 12 Projection formed by molding member 13 Projection formed by pressing a part of heat dissipation member

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Attack Morita 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc.

Claims (2)

[Claims] 1. A recording liquid supply port for supplying a recording liquid from a back surface of the substrate, wherein a plurality of recording conversion elements for discharging the recording liquid perpendicular to the substrate are arranged in at least one row in a substantially linear manner. A printing element substrate, a wiring board disposed on the substantially same plane on the outer periphery of the printing element substrate for transmitting an electric pulse serving as a printing signal to the printing element substrate, and suppressing a temperature rise during printing. An ink jet recording head having a heat radiating member for filling an adhesive resin between a support member for adhering and fixing the recording element substrate and a wiring substrate. 2. The method according to claim 1, further comprising:
2. The ink jet recording head according to claim 1, comprising a plurality of protrusions having a height approximately equal to the thickness of the recording element substrate.