JP4305406B2 - 冷却構造体 - Google Patents

冷却構造体 Download PDF

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Publication number
JP4305406B2
JP4305406B2 JP2005079734A JP2005079734A JP4305406B2 JP 4305406 B2 JP4305406 B2 JP 4305406B2 JP 2005079734 A JP2005079734 A JP 2005079734A JP 2005079734 A JP2005079734 A JP 2005079734A JP 4305406 B2 JP4305406 B2 JP 4305406B2
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JP
Japan
Prior art keywords
cooling fluid
heat
heat sink
cooling
flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005079734A
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English (en)
Japanese (ja)
Other versions
JP2006261555A (ja
JP2006261555A5 (enExample
Inventor
茂俊 一法師
山田　　晃
博敏 前川
文春 薮中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
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Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2005079734A priority Critical patent/JP4305406B2/ja
Priority to US11/520,693 priority patent/US8061412B2/en
Publication of JP2006261555A publication Critical patent/JP2006261555A/ja
Publication of JP2006261555A5 publication Critical patent/JP2006261555A5/ja
Application granted granted Critical
Publication of JP4305406B2 publication Critical patent/JP4305406B2/ja
Priority to US13/269,051 priority patent/US20120024513A1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2005079734A 2005-03-18 2005-03-18 冷却構造体 Expired - Fee Related JP4305406B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005079734A JP4305406B2 (ja) 2005-03-18 2005-03-18 冷却構造体
US11/520,693 US8061412B2 (en) 2005-03-18 2006-09-14 Cooling structure, heatsink and cooling method of heat generator
US13/269,051 US20120024513A1 (en) 2005-03-18 2011-10-07 Cooling structure, heatsink and cooling method of heat generator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005079734A JP4305406B2 (ja) 2005-03-18 2005-03-18 冷却構造体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009059509A Division JP5093161B2 (ja) 2009-03-12 2009-03-12 ヒートシンク

Publications (3)

Publication Number Publication Date
JP2006261555A JP2006261555A (ja) 2006-09-28
JP2006261555A5 JP2006261555A5 (enExample) 2007-02-01
JP4305406B2 true JP4305406B2 (ja) 2009-07-29

Family

ID=37100423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005079734A Expired - Fee Related JP4305406B2 (ja) 2005-03-18 2005-03-18 冷却構造体

Country Status (2)

Country Link
US (2) US8061412B2 (enExample)
JP (1) JP4305406B2 (enExample)

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JP4922220B2 (ja) * 2007-12-14 2012-04-25 積水化学工業株式会社 絶縁シート及び積層構造体
JP4922108B2 (ja) * 2007-09-05 2012-04-25 積水化学工業株式会社 絶縁シート及び積層構造体
JP2009231249A (ja) * 2008-03-25 2009-10-08 Sekisui Chem Co Ltd 絶縁シート及び積層構造体
JP5150326B2 (ja) * 2008-03-25 2013-02-20 積水化学工業株式会社 絶縁シート及び積層構造体
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JP6754321B2 (ja) * 2017-06-01 2020-09-09 株式会社三五 受熱ユニット及び当該受熱ユニットを含む熱電発電装置
CN110120736B (zh) * 2018-02-05 2021-04-23 台达电子企业管理（上海）有限公司 水冷电源模块
TWI663506B (zh) * 2018-03-06 2019-06-21 宏碁股份有限公司 利用液化氣體之冷卻方法
CN110297530B (zh) * 2018-03-23 2022-08-30 宏碁股份有限公司 利用液化气体的冷却方法
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CN109548307B (zh) * 2018-12-21 2021-07-02 遂宁市广天电子有限公司 一种碳油板及其制备方法
US20230235978A1 (en) * 2021-03-17 2023-07-27 Amulaire Thermal Technology, Inc. Heat-dissipating substrate with coating structure
CN113380734A (zh) * 2021-05-18 2021-09-10 华南师范大学 双面散热的igbt器件
JP7653847B2 (ja) * 2021-06-25 2025-03-31 三菱重工業株式会社 冷却装置
JP7653849B2 (ja) * 2021-06-30 2025-03-31 三菱重工業株式会社 冷却装置
JP2023023518A (ja) * 2021-08-05 2023-02-16 日本電産株式会社 液冷ジャケット、および冷却装置
WO2023062674A1 (ja) * 2021-10-11 2023-04-20 東芝三菱電機産業システム株式会社 冷却器及び電気機器
CN113970135B (zh) * 2021-10-20 2023-05-30 美的集团武汉暖通设备有限公司 一种电控散热结构、空调室外机及空调器
CN116997134A (zh) * 2022-04-26 2023-11-03 华为技术有限公司 一种柔性液冷散热单元
CN114753933B (zh) * 2022-06-15 2022-09-02 中国空气动力研究与发展中心设备设计与测试技术研究所 一种叶脉仿生主动冷却流道结构
JP2024084215A (ja) * 2022-12-13 2024-06-25 三菱重工業株式会社 冷却装置
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Also Published As

Publication number Publication date
US20120024513A1 (en) 2012-02-02
JP2006261555A (ja) 2006-09-28
US20070062674A1 (en) 2007-03-22
US8061412B2 (en) 2011-11-22

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