JP4268145B2 - 異方導電性接着剤 - Google Patents
異方導電性接着剤 Download PDFInfo
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- C09J135/06—Copolymers with vinyl aromatic monomers
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- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
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- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K2201/0133—Elastomeric or compliant polymer
Description
本発明が解決しようとする他の技術的課題は、上記異方導電性接着剤を用いた接着フィルムを提供することにある。
前記絶縁性接着成分に、架橋性ゴム状樹脂と、重合開始剤と、ラジカル重合性樹脂と、 が含まれ、
前記架橋性ゴム状樹脂は、架橋し得るゴム状の樹脂であり、かつ、オレフィン樹脂、ブ タジエン樹脂、アクリロニトリルブタジエン共重合体、スチレンブタジエンスチレン共重 合体、イソブチレンイソプレン共重合体IIR、ニトリルブタジエンゴム状樹脂、クロロ プレンゴム状樹脂、ビニールブチラル樹脂、或いはシリコンゴム状樹脂からなる群から選 択された1または2以上の成分からなり、
前記重合開始剤として、カルボニル化合物と、硫黄化合物と、アゾ系化合物と、を含む 光重合開始剤の何れか1つ以上が使用され、
前記絶縁性接着成分は、充填材、軟化剤、促進剤、着色剤、難軟化剤、光安定剤、カッ プリング剤、重合禁止剤のうち、少なくとも一つ以上を更に含む、ことを特徴とする。
フェノキシ樹脂(Inchem Inc.、商品名PKHC、平均分子量45,000)50gをトルエン(沸点110.6℃、SP値8.90)/アセトン(沸点56.1℃、SP値10.0)が50/50の重量比で混合された混合溶剤に溶解させて固形分が40%である溶液を製造した。次いで、ラジカル重合性樹脂であるエチレングリコール変性ビスフェノールAジアクリレート(Donga Synthesis Co.、商品名M−210)を25g、重合開始剤であるt−ヘキシルパーオキシ−2−エチルヘキサノエート(Nippon ushi Inc.、商品名パーキュア HO)を5g、架橋性ゴム状樹脂としてムーニー粘度ML1+4@100℃:34であるEPDM(Kumhopolychem Co.、商品名Vistalon 503K)を7g添加した。ここに、金属被覆された樹脂粒子(Jeoksoo Chemical Co.、商品名Micropearl AU205,5.0μm)からなった導電性粒子を前記接着成分の3体積%になるように添加した後均一に分散して異方導電性接着剤を製造した。その後、厚さ50μmの片面を異形処理したPETフィルムに塗工装置を使用して異方導電性接着剤を塗布し、70℃で10分間熱風乾燥させて接着剤層の厚さが35μmである異方導電性接着フィルムを得た。
架橋性ゴム状樹脂としてEPDM(Kumhopolychem Co.、商品名KEP−330、ムーニー粘度ML1+4@125℃:28)ゴム状樹脂を7g添加したことを除いては、実施例1と同一な方法で異方導電性接着フィルムを製造した。
架橋性ゴム状樹脂としてブチルゴム状樹脂(InterService社、商品名BK−1675N、ムーニー粘度ML1+8@125℃:47−54)7gを添加したことを除いては、実施例1と同一な方法で異方導電性接着フィルムを製造した。
架橋性ゴム状樹脂を添加しなかったことを除いては、実施例1と同一な方法で異方導電性接着フィルムを製造した。
架橋性ゴム状樹脂であるDPDMゴム状樹脂の代わりに、架橋性ゴム状樹脂でないSBRゴム状樹脂(SEETEC社、商品名SB 1500H、ムーニー粘度ML1+4@100℃:52)を添加したことを除いては、実施例1と同一な方法で異方導電性接着フィルムを製造した。
架橋性ゴム状樹脂であるEPDMゴム状樹脂の代わりに、架橋性ゴム状樹脂でないNBRゴム状樹脂(Zeon社、商品名N21L、ムーニー粘度ML1+4@100℃:62.5)を添加したことを除いては、実施例1と同一な方法で異方導電性接着フィルムを製造した。
20 下基板
30 異方導電性接着フィルム
40 絶縁性接着成分
50 導電性粒子
Claims (10)
- 絶縁性接着成分及び該絶縁性接着成分に分散された多数の導電性粒子からなる異方導電性接着剤において、
前記絶縁性接着成分に、架橋性ゴム状樹脂と、重合開始剤と、ラジカル重合性樹脂と、 が含まれ、
前記架橋性ゴム状樹脂は、架橋し得るゴム状の樹脂であり、かつ、オレフィン樹脂、ブ タジエン樹脂、アクリロニトリルブタジエン共重合体、スチレンブタジエンスチレン共重 合体、イソブチレンイソプレン共重合体IIR、ニトリルブタジエンゴム状樹脂、クロロ プレンゴム状樹脂、ビニールブチラル樹脂、或いはシリコンゴム状樹脂からなる群から選 択された1または2以上の成分からなり、
前記重合開始剤として、カルボニル化合物と、硫黄化合物と、アゾ系化合物と、を含む 光重合開始剤の何れか1つ以上が使用され、
前記絶縁性接着成分は、充填材、軟化剤、促進剤、着色剤、難軟化剤、光安定剤、カッ プリング剤、重合禁止剤のうち、少なくとも一つ以上を更に含む、
ことを特徴とする異方導電性接着剤。 - 前記導電性粒子の径が2〜10μmであることを特徴とする請求項1に記載の異方導電性接着剤。
- 前記導電性粒子の含量は前記架橋性ゴム状樹脂が含まれた前記絶縁性接着成分の0.1〜5体積%を使用することを特徴とする請求項1に記載の異方導電性接着剤。
- 前記オレフィン樹脂はエチレン樹脂、ブリル系ゴム状樹脂、エチレンプロピレン共重合体(EPDM)であることを特徴とする請求項1に記載の異方導電性接着剤。
- 前記架橋性ゴム状樹脂は前記絶縁性接着成分の100重量部に対して1〜20重量部の比率で含有されることを特徴とする請求項1に記載の異方導電性接着剤。
- 前記ラジカル重合性樹脂はラジカルにより重合する官能基を有する物質であって、単量体またはオリゴマー、或いは単量体とオリゴマーとを併行して使用することを特徴とする請求項1に記載の異方導電性接着剤。
- 前記ラジカル重合性樹脂はメチルアクリレート、エチルアクリレート、ビスフェノールAエチレングリコール変性ジアクリレート、イソシアヌル酸エチレングリコール変性ジアクリレート、トリプロピレングリコールジアクリレート、テトラエチレングリコールジアクリレート、ポリエチルグリコールジアクリレート、ペンタエリストールトリアクリレート、トリメチロールプロパントリアクリレート、トリメチロールプロパンプロピレングリコールトリアクリレート、トリメチロールプロパンエチレングリコールトリアクリレート、イソシアヌル酸エチレングリコール変性トリアクリレート、ジペンタエリストールペンタアクリレート、ジペンタエリスリトールヘキサアクリレート、ペンタエリストールテトラアクリレート、ジシクロペンテニルアクリレート、トリシクロデカニルアクリレートなどのアクリレート系、メタクリレート系、マレイミド化合物、不飽和ポリエステル、アクリル酸、ビニールアセテート、アクリロニトリル、メタトリルロニトリル化合物からなる群から選ばれることを特徴とする請求項1に記載の異方導電性接着剤。
- 前記重合開始剤の含量は前記ラジカル重合性樹脂の100重量部に対して0.1〜10重量部であることを特徴とする請求項1に記載の異方導電性接着剤。
- 前記カップリング剤はβ−(3,4エポキシシクロヘキシル)エチルトリメトキシシラン、γ−マーカプトプロピルトリメトキシシラン、γ−メタクリロキシトロピルトリメトキシシランのうち、少なくとも1つ以上を含むシランカップリング剤が使用されることを特徴とする請求項1に記載の異方導電性接着剤。
- 該異方導電性接着剤はフィルム形態であることを特徴とする請求項1乃至9の何れか1 項に記載の異方導電性接着剤。
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US8518304B1 (en) | 2003-03-31 | 2013-08-27 | The Research Foundation Of State University Of New York | Nano-structure enhancements for anisotropic conductive material and thermal interposers |
JP5123664B2 (ja) * | 2005-09-28 | 2013-01-23 | スパンション エルエルシー | 半導体装置およびその製造方法 |
KR100746781B1 (ko) | 2006-01-03 | 2007-08-06 | 엘에스전선 주식회사 | 상이한 박리강도의 박리 필름을 구비하는 이방성 도전 필름 |
JP2011049612A (ja) * | 2006-01-16 | 2011-03-10 | Hitachi Chem Co Ltd | 太陽電池モジュールの製造方法 |
JP2007214533A (ja) * | 2006-01-16 | 2007-08-23 | Hitachi Chem Co Ltd | 導電性接着フィルム及び太陽電池モジュール |
DE602006002247D1 (de) * | 2006-03-22 | 2008-09-25 | Premix Oy | Elektrisch leitfähige Elastomermischung, Methode zu deren Herstellung und Verwendung der Mischung |
JP4825043B2 (ja) * | 2006-04-21 | 2011-11-30 | ポリマテック株式会社 | 異方導電性シート |
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JPH10147762A (ja) | 1996-11-20 | 1998-06-02 | Sumitomo Bakelite Co Ltd | 異方導電性接着剤 |
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JP3477367B2 (ja) * | 1998-05-12 | 2003-12-10 | ソニーケミカル株式会社 | 異方導電性接着フィルム |
JP3491595B2 (ja) * | 2000-02-25 | 2004-01-26 | ソニーケミカル株式会社 | 異方導電性接着フィルム |
KR20040052126A (ko) * | 2002-12-13 | 2004-06-19 | 엘지전선 주식회사 | 이방 도전성 접착제, 이를 이용한 회로 접속 방법 및 회로접속 구조체 |
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TWI305225B (en) | 2009-01-11 |
TW200600562A (en) | 2006-01-01 |
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