CN100491489C - 各向异性的导电性粘接剂以及应用该粘接剂的薄膜 - Google Patents

各向异性的导电性粘接剂以及应用该粘接剂的薄膜 Download PDF

Info

Publication number
CN100491489C
CN100491489C CN 200410080829 CN200410080829A CN100491489C CN 100491489 C CN100491489 C CN 100491489C CN 200410080829 CN200410080829 CN 200410080829 CN 200410080829 A CN200410080829 A CN 200410080829A CN 100491489 C CN100491489 C CN 100491489C
Authority
CN
China
Prior art keywords
resin
anisotropic conductive
conductive adhesive
rubber
adhesive
Prior art date
Application number
CN 200410080829
Other languages
English (en)
Other versions
CN1712483A (zh
Inventor
安佑永
张钟允
田暎美
郑润载
韩用锡
Original Assignee
Lg电线有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to KR1020040047195A priority Critical patent/KR100601341B1/ko
Priority to KR10-2004-0047195 priority
Application filed by Lg电线有限公司 filed Critical Lg电线有限公司
Publication of CN1712483A publication Critical patent/CN1712483A/zh
Application granted granted Critical
Publication of CN100491489C publication Critical patent/CN100491489C/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JAdhesives; non-mechanical aspects of adhesive processes in general; adhesive processes not provided for elsewhere; use of material as adhesives
    • C09J121/00Adhesives based on unspecified rubbers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JAdhesives; non-mechanical aspects of adhesive processes in general; adhesive processes not provided for elsewhere; use of material as adhesives
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08Homopolymers or copolymers of acrylic acid esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JAdhesives; non-mechanical aspects of adhesive processes in general; adhesive processes not provided for elsewhere; use of material as adhesives
    • C09J135/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J135/06Copolymers with vinyl aromatic monomers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JAdhesives; non-mechanical aspects of adhesive processes in general; adhesive processes not provided for elsewhere; use of material as adhesives
    • C09J151/00Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/003Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JAdhesives; non-mechanical aspects of adhesive processes in general; adhesive processes not provided for elsewhere; use of material as adhesives
    • C09J151/00Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/04Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to rubbers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JAdhesives; non-mechanical aspects of adhesive processes in general; adhesive processes not provided for elsewhere; use of material as adhesives
    • C09J151/00Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/06Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JAdhesives; non-mechanical aspects of adhesive processes in general; adhesive processes not provided for elsewhere; use of material as adhesives
    • C09J155/00Adhesives based on homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C09J123/00 - C09J153/00
    • C09J155/02ABS [Acrylonitrile-Butadiene-Styrene] polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JAdhesives; non-mechanical aspects of adhesive processes in general; adhesive processes not provided for elsewhere; use of material as adhesives
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/001Conductive additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00Compositions of unspecified rubbers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/22Mixtures comprising a continuous polymer matrix in which are dispersed crosslinked particles of another polymer
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/16Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/24Graft or block copolymers according to groups C08L51/00, C08L53/00 or C08L55/02; Derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/18Homopolymers or copolymers of nitriles
    • C08L33/20Homopolymers or copolymers of acrylonitrile
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L35/06Copolymers with vinyl aromatic monomers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0133Elastomeric or compliant polymer

Abstract

本发明提供一种各向异性的导电性粘接剂,其含有绝缘性粘接成分以及分散在上述绝缘性粘接成分中的大量导电性颗粒,其中,在上述绝缘性粘接成分中含有交联性橡胶树脂。连接电路时,通过使各向异性的导电性粘接剂在聚合反应或固化反应中的热收缩最小化,防止粘接剂的剥离或电路粘接强度的降低,从而在连接微细电路时,可以预防相邻电极间的短路,在长期可靠性方面优异。

Description

各向异性的导电性粘接剂以及应用该粘接剂的薄膜 技术领域

本发明涉及各向异性的导电性粘接剂以及应用该粘接剂的薄膜

(ACF)。更详细地说,涉及各向异性的导电性粘接剂以及应用该粘接剂的 薄膜(ACF),其特征为,在绝缘性粘接成分中含有交联性橡胶树脂。

背景技术

各向异性的导电性粘接剂是电路连接材料,其在绝缘性粘接成分中 分散有导电性颗粒,将对置的电路进行机械连接的同时,由于导电性颗 粒的存在,电路电极之间形成电连接。作为绝缘性粘接成分可以使用热 塑性树脂和热固性树脂等,但从连接可靠性的方面考虑,主要还是用热 固性树脂。

使用热國性树脂作为粘接成分时,使各向异性的导电性粘接剂存在 于待粘接构件之间,通过进行热压接合形成连接,为达到充分的连接可 靠性和连接强度,需要高温下相当长的固化反应时间。以环氧树脂为代 表,在140'C〜180'C需要20秒左右的连接时间,或在180'C〜210'C需 要10秒左右的连接时间。

但是,在这样的连接条件下会发生配线的脱落、邻接电极间的短路 及位置的偏移等问题。而且,最近在精密电子仪器领域中电路向高密度 化发展,随着电极宽度、电极间隔变得非常狭窄,以上问题愈发严重。 另外,连接时间过长则导致生产效率下降,于是为了提高效率需要将连 接时间控制在i0秒或10秒以下。

为了克服上述问题,过去考虑过使用自由基聚合性树脂为粘接材料, 自由基聚合性树脂的特征为,通过低温加热或光固化发生自由基聚合, 并通过交联得以固化。但是,即使这种情况下,由于聚合反应导致过度 收縮,固化后,连接部分中蓄积内部应力,易发生剥离;当电极间隔很窄时,由于连接材料的收縮,导致电极间隔縮小,因此仍然存在发生短 路的问题。

发明内容

本发明基于上述问题点考虑,所要解决的技术性课题为:使用各向 异性的导电性粘接剂进行电路连接时,使聚合或固化反应中发生的各向 异性的导电性粘接剂的收縮最小,从而防止粘接剂的剥离或由于电极移 动而产生短路现象,提供一种长期可靠性优异的各向异性的导电性粘接剂。

本发明还要解决的其他技术性课题在于,提供应用上述各向异性的 导电性粘接剂的粘接薄膜。

为了解决上述技术性课题,本发明的各向异性的导电性粘接剂的特 征为:其含有绝缘性粘接成分以及分散在所述绝缘性粘接成分中的大量

导电性颗粒,所述绝缘性粘接成分中含有交联性橡胶树脂。

所述的各向异性的导电性粘接剂的使用形态可以是薄膜状、糊状、 粉末状。

如前所述,通过连接电路时使聚合或固化反应中发生的各向异性的 导电性粘接剂的收縮最小,本发明的各向异性的导电性粘接剂防止了由 于粘接剂剥离或者电极移动导致的短路现象,长期可靠性优异。

附图说明

图1是本发明实施例所制的各向异性的导电性粘接薄膜的示意简图。

图2是将柔软性电路基板和印刷电路基板分别附着于本发明所制的 各向异性的导电性粘接薄膜两面时的示意简图。

具体实施方式

图1是本发明一个实施例所制的各向异性的导电性粘接薄膜的示意 简图。如图1所示,由所述各向异性的导电性粘接剂得到的粘接薄膜30

5是由含有交联性橡胶树脂的绝缘性粘接成分40和导电性颗粒50构成的。

本发明的各向异性的导电性粘接剂中,作为所述交联性橡胶树脂,

可以使用选自以下成分中的一种或一种以上的成分:烯烃树脂、丁二烯 树脂、丙烯腈-丁二烯共聚物、苯乙烯-丁二烯-苯乙烯共聚物、异丁烯-异 戊二烯共聚物(IIR)、腈基丁二烯橡胶树脂、氯丁二烯橡胶树脂、聚乙烯 醇縮丁醛树脂、或硅橡胶树脂。

上述中,作为烯烃树脂,优选乙烯树脂、丁基橡胶树脂、三元乙丙 橡胶(EPDM)。

本发明的各向异性的导电性粘接剂中,相对于100重量份的绝缘性 粘接成分,优选所述交联性橡胶树脂为1〜20重量份。

如果所述交联性橡胶树脂成分的含量大于等于20重量份,此时存在 恢复弹性力和固化密度太高而导致粘接力下降的问题;如果其含量小于 等于1重量份,则存在连接电路时不能充分进行固化反应的问题。

本发明中的交联性橡胶树脂通过在连接电路时使聚合或固化反应中 发生的各向异性的导电性粘接剂的收縮最小,从而防止粘接剂的剥离或 电路粘接强度的降低,提供一种长期可靠性优异的各向异性的导电性粘 接剂。

作为本发明的各向异性的导电性粘接剂的绝缘性粘接成分,可以使 用一种或混合使用两种或两种以上的热塑性树脂、热固性树脂或自由基 聚合性树脂。

作为所述的热塑性树脂,可以使用苯乙烯-丁二烯树脂、乙烯-乙烯基 树脂、酯类树脂、硅树脂、苯氧基树脂、丙烯酸树脂、酰胺类树脂、丙 烯酸酯树脂、聚乙烯醇縮丁醛树脂。

作为所述的热固性树脂,可以使用环氧树脂、酚醛树脂、三聚氰胺 树脂。其中,作为环氧树脂,可以使用双酚型环氧树脂、甲酚-线型酚醛 环氧树脂、脂肪族聚环氧树脂、二聚酸改性环氧树脂等。

本发明中,粘接成分中含有热固性树脂时,使用固化剂,所述固化 剂在常温无活性,加热熔融后被活化,使热固性树脂固化。作为这种固化剂,可以使用咪唑衍生物(含氮杂环衍生物)、二元酸二酰肼、二氰基二

酰胺等。相对于100重量份热固性树脂,使用1〜200份所述固化剂。

所述自由基聚合性树脂是具有在自由基作用下聚合的官能团的物 质,可以使用单体或低聚物等,也可以合并使用单体和低聚物。作为自 由基聚合性树脂,可以使用丙烯酸酯类,如丙烯酸甲酯、丙烯酸乙酯、 双酚A乙二醇改性的二丙烯酸酯、异氰脲酸乙二醇改性的二丙烯,、 三丙二醇二丙烯酸酯、四乙二醇二丙烯酸酯、聚乙二醇二丙烯酸酯、季 戊四醇三丙烯酸酯、三羟甲基丙烷三丙烯酸酯、三羟甲基丙垸丙二醇三 丙烯酸酯、三羟甲基丙烷乙二醇三丙烯酸酯、异银脲酸乙二醇改性的三 丙烯酸酯、二季戊西醇五丙烯酸酯、二季戊四醇六丙烯酸酯、季戊四醇 四丙烯酸酯、二环戊烯丙烯酸酯、三环癸基丙烯酸酯等;甲基丙烯酸酯 类;顺丁烯二酰亚胺化合物;不饱和聚酯;丙烯酸;乙酸乙烯酯;丙烯 腈;甲基丙烯腈化合物等。

本发明中,粘接成分中含有自由基聚合性树脂时,使用聚合引发剂, 活化自由基聚合性树脂,从而实现形成高分子网状结构或高分子IPN (互 穿聚合物网络)结构的功能,并且通过形成这种交联结构来使绝缘性粘 接成分固化。作为聚合引发剂,可以使用过氧化物那样的热聚合引发剂 和/或羰基化合物、硫化物以及偶氮化合物等光聚合引发剂。聚合引发剂 的含量可根据聚合性树脂的种类、目的龟路连接工序的可靠性和可操作 性等来调节,相对于100重量份自由基聚合性树脂,优选聚合引发剂为 0.1〜10重量份。

另外,必要时可以在本发明的各向异性的导电性粘接剂的粘接成分 中进一步添加填充剂、软化剂、促进剂、着色剂、抗软化剂、光稳定剂、 偶联剂、阻聚剂等。例如,添加填充剂时,可以提高连接的可靠性等; 添加偶联剂时,可以改善各向异性的导电性粘接剂的粘接界面的粘接性, 增加粘接强度以及耐热性、耐湿性,从而提高连接的可靠性。作为这种

偶联剂,优选硅烷偶联剂,例如,P -(3,4环氧环己基)乙基三甲氧基硅烷、

Y-巯醇基丙基三甲氧基硅烷、Y-甲基丙烯氧基托品基三甲氧基硅烷等。 本发明中,分散在所述绝缘性粘接成分中的大量导电性颗粒可以使用具有导电性的颗粒自身,如镍、铁、铜、铝、锡、锌、铬、钴、银、

金等金属或金属氧化物、焊料、碳等,作为导电性颗粒也可以使用通过 非电解镀覆法等薄层形成方法在玻璃、陶瓷、高分子等的核材表面形成

金属薄层后的颗粒;或者在所述导电性颗粒自身或在核材表面形成有金 属薄层的颗粒表面上被覆绝缘性树脂后的颗粒。

所述导电性颗粒的粒径对应所要连接的电路的间距等而不同,优选 使用粒径为1〜20pm的颗粒,更优选使用粒径为2〜10,的颗粒。

所述导电性颗粒的含量优选为所述内含交联性橡胶树脂的粘接成分 的0.1体积%〜5体积%。如果所述含量小于等于0.1体积%,则连接电路 间的导电性颗粒量少,因而导致连接可靠性下降;如果所述含量大于5 体积%,则连接微细电路时在相邻电极间易发生短路。

以下,对本发明的各向异性的导电性粘接剂连接电路时的作用进行 说明。

参照图1,本发明的各向异性的导电性粘接剂中的大量导电性颗粒 分散在绝缘性粘接成分中。

首先,将所述的各向异性的导电性粘接剂置于上基板10和下基板 20之间,上基板IO和下基板20分别配有对置的电路电极11和电路电极 21(图1)。

接着,按规定的温度和压力进行加热加压,于是在绝缘性粘接成分 被固化之前,电路电极11和电路电极21通过导电性颗粒电连接。

之后,绝缘性粘接成分被完全固化,上下基板被牢固地粘接、固定, 由此,通过本发明的各向异性的导电性粘接剂使对置的电路电极11和电 路电极21间电连接,形成可靠性高的电路连接结构体(图2)。

为了更具体地对本发明进行说明,以下举实施例详细说明。但本发 明的实施例等可以变化成多种不同的形式,不能说本发明的范围只限于 下述的实施例。提供本发明的实施例等是为了向本专业中具备平均知识 水平的人员更完全地说明本发明。

[实施例1〗

将50克苯氧基树脂(lnchemlnc.、商品名PKHC、平均分子量45000) 溶解于重量比为50/50的甲苯(沸点U0.6。C、 SP值8.90)/丙酮(沸点56.1°C、 SP值10.0)混合溶剂中,得到固体成分占40%的溶液。接着,添加自 由基聚合性树脂,25克乙二醇改性的双酚A 二丙烯酸酯(Donga Synthesis Co.、商品名M-210);聚合引发剂,5克叔己基过氧-2-乙基己酸酯(Nippon ushi Inc.、商品名"一々^ 7 HO);交联性橡胶树脂,7克门尼粘度为 ML1+4@100'C:34的EPDM(Kumh邵olychem Co.、商品名Vistal加503K)。 此时,按所述粘接性成分的3体积%的量,向其中添加由金属被覆的树脂 颗粒(JeoksooChemical Co.、商品名Micropearl AU205, 5.0pm)组成的导电 性颗粒,然后,分散均匀,制备各向异性的导电性粘接剂。之后,使用 涂装装置,将各向异性的导电性粘接剂涂布在单面经过异形处理的厚度 为50,的PET薄膜上,在70'C的温度,热风干燥10分钟后得到粘接剂 层厚为35阿的各向异性的导电性粘接薄膜。 [实施例2]

除了添加的交联性橡胶树脂为7克EPE«Vf(KiHnhopolychem Co.、商 品名KEP-330、门尼粘度为MLl+4(gl25"C:28)之外,采用和实施例1相 同的方法,制造出各向异性的导电性粘接薄膜。

〖实施例3〗

除了添加的交联性樣胶树脂为7克丁基橡胶树脂(MterService社、商 品名为BK-16乃N、门尼粘度为ML1+糊125-C:W-S勺之外,釆用和实施 例1相同的方法,制造出各向异性的导电性粘接薄膜。

[比较例1]

除了没有添加交联性橡胶树脂外,采用和实施例1相同的方法,制 造出各向异性的导电性粘接薄膜。 [比较例2〗

除了添加作为非交联性橡胶树脂的SBR橡胶树脂(S腿TEC社,商品 名为SB 1500H、门尼粘度为ML1+4@100°C:52),代替交联性橡胶树脂 EPDM橡胶树脂外,采用和实施例1相同的方法,制造出各向异性的导 电性粘接薄膜。

[比较例3〗

除了添加作为非交联性橡胶树脂的NBR橡胶树脂(Zeon社,商品名为N21L、门尼粘度为ML1+4@100'C:62.5),代替交联性橡胶树脂EPDM 橡胶树脂之外,采用和实施例1相同的方法,制造出各向异性的导电性 粘接薄膜。

将所述实施例1至3及比较例1至3所制造的各向异性的导电性粘 接薄膜分别置于具有500个其线宽为50nm、间距为100,、厚度为18陴 铜电路的柔软的电路板(FPC)间,在一侧的FPC上附着各向异性的导电性 粘接薄膜的粘接面后,在70'C、 5kg/ci^的条件下加热加压5秒钟,在宽 2mm的范围临时连接,剥离PET薄膜,通过与另一侧的FPC连接而接通 电路。之后,在160'C、 30kg/cn^的条件下加热加压IO秒钟,完成了电 路连接结构体。

将通过以上方法制造的电路连接结构体在65'C、相对湿度95%的条 件下放置IOOO小时后,测定粘接强度及连接电阻,另外,各试样中将每 IOO片进行压接,测定短路发生率。测定结果如下表l所示。

表l

<table>table see original document page 10</column></row> <table>

参照表1可以看出,使用本发明实施例1至3的各向异性的导电性 粘接剂的电路连接结构体在粘接强度、通电电阻以及短路发生率方面均良好。

相反,比较例1至3全部发生了短路,在粘接强度及通电电阻方面 也比使用了本发明的各向异性的导电性粘接剂的情况差。

Claims (9)

1、各向异性的导电性粘接剂,其特征为:其含有绝缘性粘接成分以及分散在所述绝缘性粘接成分中的导电性颗粒,且在所述绝缘性粘接成分中含有交联性橡胶树脂、自由基聚合性树脂和聚合引发剂;其中,所述自由基聚合性树脂是具有在自由基作用下聚合的官能团的物质,使用单体或低聚物,或者合并使用单体和低聚物;其中,所述聚合引发剂是过氧化物类热聚合引发剂和/或羰基化合物、硫化物以及偶氮化合物光聚合引发剂;其中,所述导电性颗粒是通过薄层形成方法在核材表面形成金属薄层后的颗粒,或者是在所述导电性颗粒自身或在核材表面形成有金属薄层的颗粒表面上被覆绝缘性树脂后的颗粒;其中,所述导电性颗粒的含量为含有所述交联性橡胶树脂的粘接成分的0.1体积%~5体积%;其中,相对于100重量份的所述绝缘性粘接成分,所述交联性橡胶树脂的含量为1~20重量份。
2、 如权利要求l所述的各向异性的导电性粘接剂,其特征为:所述 导电性颗粒的粒径为2〜10拜。
3、 如权利要求l所述的各向异性的导电性粘接剂,其特征为:所述 交联性橡胶树脂含有选自由丁二烯树脂、丙烯腈-丁二烯共聚物、苯乙烯-丁二烯-苯乙烯共聚物、异丁烯-异戊二烯共聚物IIR、腈基丁二烯橡胶树 脂、氯丁二烯橡胶树脂、聚乙烯醇缩丁醛树脂以及硅橡胶树脂组成的组 中的一种或一种以上的成分。
4、 如权利要求l所述的各向异性的导电性粘接剂,其特征为:所迷 交联性橡胶树脂含有乙烯树脂、丁基橡胶树脂和/或三元乙丙橡胶。
5、 如权利要求l所述的各向异性的导电性粘接剂,其特征为:所述自由基聚合性树脂是从丙烯酸酯、甲基丙烯酸酯、顺丁烯二酰亚胺化合 物、不饱和聚酯、丙烯酸、乙酸乙烯酯、丙烯腈、甲基丙烯腈化合物组成的组中选择的,所述丙烯酸酯包括丙烯酸甲酯、丙烯酸乙酯、双酚A 乙二醇改性的二丙烯酸酯、异氰脲酸乙二醇改性的二丙烯酸酯、三丙二 醇二丙烯酸酯、四乙二醇二丙烯酸酯、聚乙二醇二丙烯酸酯、季戊四醇 三丙烯酸酯、三羟甲基丙烷三丙烯酸酯、三羟甲基丙烷丙二醇三丙烯酸 酯、三羟甲基丙烷乙二醇三丙烯酸酯、异氰脲酸乙二醇改性的三丙烯酸 酯、二季戊四醇五丙烯酸酯、二季戊四醇六丙烯酸酯、季戊四醇四丙烯 酸酯、二环戊烯丙烯酸酯和三环癸基丙烯酸酯。
6、 如权利要求l所述的各向异性的导电性粘接剂,其特征为:相对于100重量份所述自由基聚合性树脂,所述聚合引发剂的含量为0.1〜10重量份。
7、 如权利要求l所述的各向异性的导电性粘接剂,其特征为:所述 各向异性的导电性粘接剂的粘接成分中还含有填充剂、软化剂、促进剂、 着色剂、抗软化剂、光稳定剂、偶联剂、阻聚剂中的至少一种物质。
8、 如权利要求7所述的各向异性的导电性粘接剂,其特征为:所述偶联剂使用的是P-(3,4环氧环己基)乙基三甲氧基硅垸、Y -巯醇基丙基三甲氧基硅烷或,甲基丙烯氧基托品基三甲氧基硅烷那样的硅垸偶联剂。
9、 如权利要求l所述的各向异性的导电性粘接剂,其特征为:所述 各向异性的导电性粘接剂是薄膜的形式。
CN 200410080829 2004-06-23 2004-10-09 各向异性的导电性粘接剂以及应用该粘接剂的薄膜 CN100491489C (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020040047195A KR100601341B1 (ko) 2004-06-23 2004-06-23 이방 도전성 접착제 및 이를 이용한 접착필름
KR10-2004-0047195 2004-06-23

Publications (2)

Publication Number Publication Date
CN1712483A CN1712483A (zh) 2005-12-28
CN100491489C true CN100491489C (zh) 2009-05-27

Family

ID=35506860

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200410080829 CN100491489C (zh) 2004-06-23 2004-10-09 各向异性的导电性粘接剂以及应用该粘接剂的薄膜

Country Status (5)

Country Link
US (1) US7452923B2 (zh)
JP (1) JP4268145B2 (zh)
KR (1) KR100601341B1 (zh)
CN (1) CN100491489C (zh)
TW (1) TWI305225B (zh)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
JP5123664B2 (ja) * 2005-09-28 2013-01-23 スパンション エルエルシー 半導体装置およびその製造方法
KR100746781B1 (ko) 2006-01-03 2007-08-06 엘에스전선 주식회사 상이한 박리강도의 박리 필름을 구비하는 이방성 도전 필름
JP2007214533A (ja) * 2006-01-16 2007-08-23 Hitachi Chem Co Ltd 導電性接着フィルム及び太陽電池モジュール
CN101512781B (zh) 2006-08-29 2013-01-23 日立化成工业株式会社 导电性粘结薄膜和太阳能电池模块
JP2011049612A (ja) * 2006-01-16 2011-03-10 Hitachi Chem Co Ltd 太陽電池モジュールの製造方法
AT404979T (de) * 2006-03-22 2008-08-15 Premix Oy Elektrisch leitfähige elastomermischung, methode zu deren herstellung und verwendung der mischung
JP4825043B2 (ja) 2006-04-21 2011-11-30 ポリマテック株式会社 異方導電性シート
KR101296464B1 (ko) * 2006-04-26 2013-08-13 히타치가세이가부시끼가이샤 태양 전지 모듈의 제조 방법
KR100787758B1 (ko) 2006-05-30 2007-12-24 제일모직주식회사 흐름성이 우수한 이방 전도성 접착제 조성물 및 그로부터 제조되는 이방 전도성 필름
JP4845645B2 (ja) * 2006-08-30 2011-12-28 三洋電機株式会社 固体電解コンデンサおよびその製造方法
KR100787727B1 (ko) 2006-10-31 2007-12-24 제일모직주식회사 스티렌-아크릴로니트릴 공중합체를 이용한 고신뢰성 이방전도성 필름용 조성물
KR100828238B1 (ko) * 2006-12-08 2008-05-07 엘에스전선 주식회사 이방 도전성 필름
KR100787740B1 (ko) 2006-12-19 2007-12-24 제일모직주식회사 고신뢰성 이방 전도성 필름용 조성물
KR100815384B1 (ko) 2006-12-28 2008-03-20 제일모직주식회사 이방 전도성 필름용 조성물
US7727423B2 (en) * 2006-12-29 2010-06-01 Cheil Industries, Inc. Anisotropic conductive film composition and film including the same
KR100939905B1 (ko) * 2007-01-04 2010-02-03 주식회사 엘지화학 고리형 올레핀계 필름과의 부착성이 우수한 코팅 조성물 및 이를 이용하여 제조된 코팅층을 포함하는 고리형 올레핀계 필름
JP5311772B2 (ja) * 2007-06-27 2013-10-09 デクセリアルズ株式会社 接着フィルム
GB0717867D0 (en) * 2007-09-14 2007-10-24 3M Innovative Properties Co Flexible epoxy-based compositions
US8044330B2 (en) * 2008-01-17 2011-10-25 E.I. Du Pont De Nemours And Company Electrically conductive adhesive
KR100979947B1 (ko) * 2008-04-08 2010-09-03 엘지이노텍 주식회사 접속 신뢰성이 우수한 이방도전필름 및 이를 이용한 회로접속구조체
JP4976351B2 (ja) * 2008-08-21 2012-07-18 シー・アール・ケイ株式会社 ブチルゴム系粘着剤組成物、及び該ブチルゴム系粘着剤組成物を用いた粘着テープ、並びに前記ブチルゴム系粘着剤組成物又は前記粘着テープを用いた屋根用防水シート及び接合体
US20100078788A1 (en) 2008-09-26 2010-04-01 Amir Wagiman Package-on-package assembly and method
KR101138799B1 (ko) * 2009-08-20 2012-04-24 제일모직주식회사 이방 도전성 필름용 조성물
WO2011062149A1 (ja) * 2009-11-17 2011-05-26 日立化成工業株式会社 回路接続材料、それを用いた接続構造体及び仮圧着方法
JP5412357B2 (ja) * 2010-04-01 2014-02-12 株式会社フジクラ メンブレン配線板
JP5521848B2 (ja) * 2010-07-21 2014-06-18 デクセリアルズ株式会社 異方性導電フィルム、接続構造体及びそれらの製造方法
CN102548252A (zh) 2010-12-28 2012-07-04 富葵精密组件(深圳)有限公司 多层电路板及其制作方法
US9281097B2 (en) 2010-12-29 2016-03-08 Cheil Industries, Inc. Anisotropic conductive film, composition for the same, and apparatus including the same
KR101279980B1 (ko) * 2010-12-29 2013-07-05 제일모직주식회사 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름
KR101397690B1 (ko) * 2010-12-31 2014-05-22 제일모직주식회사 이방 전도성 필름
TWI407874B (zh) * 2010-12-31 2013-09-01 Zhen Ding Technology Co Ltd 多層電路板及其製作方法
KR101345694B1 (ko) 2011-03-11 2013-12-30 옵토팩 주식회사 파이버, 파이버 집합체 및 이를 포함하는 접착제
CN102740608A (zh) * 2011-04-15 2012-10-17 常熟东南相互电子有限公司 组合式电路板及其制造方法
CN102660205B (zh) * 2012-06-01 2013-10-30 苏州联科合成材料有限公司 丙烯酸酯类热熔胶组合物及uv交联热熔胶的制备方法
CN102863926B (zh) * 2012-10-16 2014-03-26 上海电缆研究所 一种导电密封胶及其应用
KR101594484B1 (ko) * 2012-11-20 2016-02-16 제일모직주식회사 이방성 도전 필름 및 반도체 장치
CN103131352B (zh) * 2013-02-17 2014-12-03 东莞市瑞为电器配件有限公司 电子保护胶及其制备方法
CN103333466B (zh) * 2013-06-20 2015-08-26 天津凯华绝缘材料股份有限公司 一种具有互穿网络结构的高柔性环氧树脂及其合成方法
TW201508953A (zh) * 2013-08-29 2015-03-01 Lextar Electronics Corp 發光二極體與其製作方法以及應用其之發光二極體模組與其封裝方法
JP6187126B2 (ja) * 2013-10-15 2017-08-30 デクセリアルズ株式会社 電気接続材料
CN103571417B (zh) * 2013-10-24 2015-06-17 芜湖众力部件有限公司 一种高抗冲击的热熔胶
US20170077056A1 (en) * 2014-02-04 2017-03-16 Dexerials Corporation Anisotropic conductive film and production method of the same
WO2015119090A1 (ja) * 2014-02-04 2015-08-13 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
CN103820043A (zh) * 2014-02-27 2014-05-28 深圳市友联亨达光电有限公司 一种uv固化型光学透明热熔胶膜(toca)及贴合方法
CN103929896A (zh) * 2014-05-07 2014-07-16 上海美维科技有限公司 一种内埋芯片的印制电路板制造方法
EP2947662A1 (en) * 2014-05-21 2015-11-25 Condalign AS A method for arranging particles at an interface
CN104231975A (zh) * 2014-08-21 2014-12-24 江苏华侃核电器材科技有限公司 第三代核电站用密封胶带材料及其制备方法
CN104650789B (zh) * 2015-02-11 2016-11-02 武汉轻工大学 一种各向异性导电胶及封装方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1242403A (zh) 1998-03-18 2000-01-26 住友电木株式会社 各向异性导电粘合剂、其制法和使用该粘合剂的电子装置
CN1470559A (zh) 2003-06-20 2004-01-28 山东大学 硅橡胶/三元乙丙并用导电橡胶及其制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0765023B2 (ja) 1985-12-13 1995-07-12 ソニーケミカル株式会社 フィルム状導電異方性接着剤
JPH10147762A (ja) 1996-11-20 1998-06-02 Sumitomo Bakelite Co Ltd 異方導電性接着剤
US6140396A (en) * 1997-12-19 2000-10-31 Nippon Shokubai Co., Ltd. Thermosetting resin composition and producing process thereof
JP3477367B2 (ja) * 1998-05-12 2003-12-10 ソニーケミカル株式会社 異方導電性接着フィルム
JP3491595B2 (ja) * 2000-02-25 2004-01-26 ソニーケミカル株式会社 異方導電性接着フィルム
KR20040052126A (ko) * 2002-12-13 2004-06-19 엘지전선 주식회사 이방 도전성 접착제, 이를 이용한 회로 접속 방법 및 회로접속 구조체

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1242403A (zh) 1998-03-18 2000-01-26 住友电木株式会社 各向异性导电粘合剂、其制法和使用该粘合剂的电子装置
CN1470559A (zh) 2003-06-20 2004-01-28 山东大学 硅橡胶/三元乙丙并用导电橡胶及其制备方法

Also Published As

Publication number Publication date
TWI305225B (en) 2009-01-11
US20050288427A1 (en) 2005-12-29
KR20050122056A (ko) 2005-12-28
US7452923B2 (en) 2008-11-18
JP2006008978A (ja) 2006-01-12
JP4268145B2 (ja) 2009-05-27
KR100601341B1 (ko) 2006-07-14
TW200600562A (en) 2006-01-01
CN1712483A (zh) 2005-12-28

Similar Documents

Publication Publication Date Title
US4696764A (en) Electrically conductive adhesive composition
US8501045B2 (en) Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same
JP4383768B2 (ja) 封止用フィルム接着剤、封止用フィルム積層体及び封止方法
US4740657A (en) Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
KR101035864B1 (ko) 이방성 도전막 및 그 제조방법과 접합체
EP0982385B1 (en) Adhesive, method for bonding, and assemblies of mounted boards
JP5247968B2 (ja) 回路接続材料、及びこれを用いた回路部材の接続構造
CN1831073B (zh) 低应力导电胶粘剂
KR100483017B1 (ko) 전극의 접속구조 및 전극의 접속방법
US7777335B2 (en) Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles
US7258918B2 (en) Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure
WO2011158666A1 (ja) 接続構造体の製造方法
TWI265191B (en) Adhesive composition, material for connecting circuit, connecting structure of circuit member and semiconductor device
TW200932855A (en) Adhesive composition, film-like adhesive, and connection structure for circuit member
US6827880B2 (en) Anisotropic conductive adhesive
JP5549103B2 (ja) 異方性導電フィルム
CN1250663C (zh) 具有增强粘度的各向异性导电粘合剂及使用它的粘接方法和集成电路封装件
CN1180368A (zh) 粘合剂、胶膜及带粘合剂底面的金属箔
CN101278027B (zh) 各向异性导电粘合剂
JP2011231326A (ja) 接着剤組成物、回路接続材料、接続構造及び回路部材の接続方法
US7795325B2 (en) Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device
CN1192071C (zh) 一种用于将元件粘合和连接在一起的连接材料
KR101130002B1 (ko) 전자 부품의 접속 방법 및 접합체
KR101298829B1 (ko) 이방 도전성 접착제 및 이것을 이용한 전극의 접속 방법
CN1146647C (zh) 各向异性导电粘合剂、其制法和使用该粘合剂的电子装置

Legal Events

Date Code Title Description
C06 Publication
C10 Entry into substantive examination
C14 Grant of patent or utility model
ASS Succession or assignment of patent right

Owner name: LG INNOTEK CO., LTD.

Free format text: FORMER OWNER: LG CABLE LTD.

Effective date: 20100324

C41 Transfer of patent application or patent right or utility model
ASS Succession or assignment of patent right

Owner name: HIGH TECH CORPORATION

Free format text: FORMER OWNER: IG INNOTEK CO., LTD.

Effective date: 20140729

C41 Transfer of patent application or patent right or utility model
CF01