CN1712483A - 各向异性的导电性粘接剂以及应用该粘接剂的薄膜 - Google Patents
各向异性的导电性粘接剂以及应用该粘接剂的薄膜 Download PDFInfo
- Publication number
- CN1712483A CN1712483A CNA2004100808293A CN200410080829A CN1712483A CN 1712483 A CN1712483 A CN 1712483A CN A2004100808293 A CNA2004100808293 A CN A2004100808293A CN 200410080829 A CN200410080829 A CN 200410080829A CN 1712483 A CN1712483 A CN 1712483A
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- Prior art keywords
- resin
- conductive adhesive
- anisotropic conductive
- bonding composition
- acrylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
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- 229920001187 thermosetting polymer Polymers 0.000 claims description 12
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- VHOQXEIFYTTXJU-UHFFFAOYSA-N Isobutylene-isoprene copolymer Chemical compound CC(C)=C.CC(=C)C=C VHOQXEIFYTTXJU-UHFFFAOYSA-N 0.000 claims description 6
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- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 4
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- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims description 4
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- MNAHQWDCXOHBHK-UHFFFAOYSA-N 1-phenylpropane-1,1-diol Chemical compound CCC(O)(O)C1=CC=CC=C1 MNAHQWDCXOHBHK-UHFFFAOYSA-N 0.000 claims description 2
- GZBSIABKXVPBFY-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO GZBSIABKXVPBFY-UHFFFAOYSA-N 0.000 claims description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 claims description 2
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- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 claims description 2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
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- C09J133/08—Homopolymers or copolymers of acrylic acid esters
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- C09J135/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Adhesives based on derivatives of such polymers
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- C09J151/06—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
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- C09J155/02—ABS [Acrylonitrile-Butadiene-Styrene] polymers
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- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K2201/001—Conductive additives
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L2205/22—Mixtures comprising a continuous polymer matrix in which are dispersed crosslinked particles of another polymer
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
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- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
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- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/24—Graft or block copolymers according to groups C08L51/00, C08L53/00 or C08L55/02; Derivatives thereof
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- C08L33/18—Homopolymers or copolymers of nitriles
- C08L33/20—Homopolymers or copolymers of acrylonitrile
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- C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
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Abstract
Description
粘接强度(gf/cm) | 连接电阻(Ω) | 短路发生数(片) | |||
初期 | 环境实验后 | 初期 | 环境实验后 | ||
实施例1 | 1310 | 1100 | 1.88 | 2.00 | - |
实施例2 | 1320 | 1250 | 1.89 | 1.99 | - |
实施例3 | 1290 | 1010 | 1.85 | 2.00 | - |
比较例1 | 971 | 750 | 1.89 | 3.01 | 6 |
比较例2 | 1015 | 940 | 1.85 | 2.35 | 2 |
比较例3 | 1020 | 910 | 1.98 | 3.29 | 2 |
Claims (18)
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KR1020040047195A KR100601341B1 (ko) | 2004-06-23 | 2004-06-23 | 이방 도전성 접착제 및 이를 이용한 접착필름 |
KR1020040047195 | 2004-06-23 |
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CN1712483A true CN1712483A (zh) | 2005-12-28 |
CN100491489C CN100491489C (zh) | 2009-05-27 |
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US (1) | US7452923B2 (zh) |
JP (1) | JP4268145B2 (zh) |
KR (1) | KR100601341B1 (zh) |
CN (1) | CN100491489C (zh) |
TW (1) | TWI305225B (zh) |
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- 2004-06-23 KR KR1020040047195A patent/KR100601341B1/ko not_active IP Right Cessation
- 2004-10-05 US US10/958,825 patent/US7452923B2/en not_active Expired - Fee Related
- 2004-10-09 CN CNB2004100808293A patent/CN100491489C/zh not_active Expired - Fee Related
- 2004-12-07 TW TW093137734A patent/TWI305225B/zh not_active IP Right Cessation
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- 2005-01-19 JP JP2005011224A patent/JP4268145B2/ja not_active Expired - Fee Related
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CN110461982A (zh) * | 2017-03-29 | 2019-11-15 | 日立化成株式会社 | 粘接剂组合物及结构体 |
CN109762483A (zh) * | 2018-12-25 | 2019-05-17 | 苏州义铠轩电子科技有限公司 | 垂直导电热解粘胶带及其制备方法 |
CN115368849A (zh) * | 2021-05-20 | 2022-11-22 | 中国科学院福建物质结构研究所 | 一种异方性导电胶膜及其制备方法和应用 |
CN115368849B (zh) * | 2021-05-20 | 2023-10-03 | 中国科学院福建物质结构研究所 | 一种异方性导电胶膜及其制备方法和应用 |
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US20050288427A1 (en) | 2005-12-29 |
US7452923B2 (en) | 2008-11-18 |
TW200600562A (en) | 2006-01-01 |
JP4268145B2 (ja) | 2009-05-27 |
KR100601341B1 (ko) | 2006-07-14 |
TWI305225B (en) | 2009-01-11 |
JP2006008978A (ja) | 2006-01-12 |
CN100491489C (zh) | 2009-05-27 |
KR20050122056A (ko) | 2005-12-28 |
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