JP4179866B2 - 半導体複合装置及びｌｅｄヘッド - Google Patents

半導体複合装置及びｌｅｄヘッド Download PDF

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Publication number
JP4179866B2
JP4179866B2 JP2002371724A JP2002371724A JP4179866B2 JP 4179866 B2 JP4179866 B2 JP 4179866B2 JP 2002371724 A JP2002371724 A JP 2002371724A JP 2002371724 A JP2002371724 A JP 2002371724A JP 4179866 B2 JP4179866 B2 JP 4179866B2
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semiconductor
led
layer
region
thin film
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Japanese (ja)
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JP2004207323A5 (enExample
JP2004207323A (ja
Inventor
光彦 荻原
博之 藤原
昌明 佐久田
一松 安孫子
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株式会社沖データ
株式会社沖デジタルイメージング
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Priority to JP2002371724A priority Critical patent/JP4179866B2/ja
Priority to EP03029114A priority patent/EP1434271A3/en
Priority to US10/743,104 priority patent/US20040135157A1/en
Publication of JP2004207323A publication Critical patent/JP2004207323A/ja
Publication of JP2004207323A5 publication Critical patent/JP2004207323A5/ja
Application granted granted Critical
Publication of JP4179866B2 publication Critical patent/JP4179866B2/ja
Priority to US12/654,486 priority patent/US8664668B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components

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  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2002371724A 2002-12-24 2002-12-24 半導体複合装置及びｌｅｄヘッド Expired - Fee Related JP4179866B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002371724A JP4179866B2 (ja) 2002-12-24 2002-12-24 半導体複合装置及びｌｅｄヘッド
EP03029114A EP1434271A3 (en) 2002-12-24 2003-12-17 Integrated semiconductor device comprising semiconductor thin films and optical print head
US10/743,104 US20040135157A1 (en) 2002-12-24 2003-12-23 Combined semiconductor apparatus with semiconductor thin film
US12/654,486 US8664668B2 (en) 2002-12-24 2009-12-22 Combined semiconductor apparatus with semiconductor thin film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002371724A JP4179866B2 (ja) 2002-12-24 2002-12-24 半導体複合装置及びｌｅｄヘッド

Publications (3)

Publication Number Publication Date
JP2004207323A JP2004207323A (ja) 2004-07-22
JP2004207323A5 JP2004207323A5 (enExample) 2005-07-28
JP4179866B2 true JP4179866B2 (ja) 2008-11-12

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JP2002371724A Expired - Fee Related JP4179866B2 (ja) 2002-12-24 2002-12-24 半導体複合装置及びｌｅｄヘッド

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Country Link
US (2) US20040135157A1 (enExample)
EP (1) EP1434271A3 (enExample)
JP (1) JP4179866B2 (enExample)

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JP2006082260A (ja) * 2004-09-14 2006-03-30 Oki Data Corp 半導体複合装置、半導体複合装置の製造方法、半導体複合装置を使用したｌｅｄヘッド及びこのｌｅｄヘッドを用いた画像形成装置
DE102004050371A1 (de) * 2004-09-30 2006-04-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement mit einer drahtlosen Kontaktierung
JP4837295B2 (ja) * 2005-03-02 2011-12-14 株式会社沖データ 半導体装置、ｌｅｄ装置、ｌｅｄヘッド、及び画像形成装置
JP4636501B2 (ja) 2005-05-12 2011-02-23 株式会社沖データ 半導体装置、プリントヘッド及び画像形成装置
JP5258167B2 (ja) * 2006-03-27 2013-08-07 株式会社沖データ 半導体複合装置、ｌｅｄヘッド、及び画像形成装置
JP4420932B2 (ja) * 2007-03-09 2010-02-24 株式会社沖データ 可撓性表示体及び可撓性表示体付き物品
JP5438889B2 (ja) * 2007-06-20 2014-03-12 株式会社沖データ 半導体装置、及びｌｅｄプリントヘッド
CA2739327A1 (en) * 2008-10-10 2010-04-15 Alta Devices, Inc. Mesa etch method and composition for epitaxial lift off
JP2011086928A (ja) 2009-09-17 2011-04-28 Sumitomo Chemical Co Ltd 化合物半導体結晶の製造方法、電子デバイスの製造方法、および半導体基板
WO2012049600A1 (en) 2010-10-12 2012-04-19 Koninklijke Philips Electronics N.V. Highly reflective coating on led submount
EP2500623A1 (en) 2011-03-18 2012-09-19 Koninklijke Philips Electronics N.V. Method for providing a reflective coating to a substrate for a light-emitting device
JP5404709B2 (ja) * 2011-08-02 2014-02-05 株式会社沖データ 半導体装置、ｌｅｄ装置、ｌｅｄヘッド、及び画像形成装置
KR20130066271A (ko) * 2011-12-12 2013-06-20 한국전자통신연구원 유기발광다이오드의 제조 방법
DE102012101409A1 (de) 2011-12-23 2013-06-27 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Mehrzahl von optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip
JP2015126189A (ja) * 2013-12-27 2015-07-06 株式会社沖データ 半導体装置、半導体装置の製造方法、光プリントヘッド及び画像形成装置
JP6129777B2 (ja) 2014-03-31 2017-05-17 株式会社沖データ 半導体装置、半導体装置の製造方法、プリントヘッド、及び画像形成装置
US9576595B1 (en) 2014-11-19 2017-02-21 Seagate Technology Llc Transfer printing an epitaxial layer to a read/write head to form an integral laser
DE102015115812B4 (de) * 2015-09-18 2025-12-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Bauelement sowie Verfahren zur Herstellung eines Bauelements
CN109300932B (zh) * 2018-11-12 2024-01-23 严光能 Led显示器及其制作方法

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JPH0694216B2 (ja) * 1987-04-06 1994-11-24 沖電気工業株式会社 光プリントヘツド
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Also Published As

Publication number Publication date
US20100096748A1 (en) 2010-04-22
US20040135157A1 (en) 2004-07-15
EP1434271A3 (en) 2011-01-12
EP1434271A2 (en) 2004-06-30
US8664668B2 (en) 2014-03-04
JP2004207323A (ja) 2004-07-22

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