GB9223306D0 - Optoelectronic devices - Google Patents

Optoelectronic devices

Info

Publication number
GB9223306D0
GB9223306D0 GB929223306A GB9223306A GB9223306D0 GB 9223306 D0 GB9223306 D0 GB 9223306D0 GB 929223306 A GB929223306 A GB 929223306A GB 9223306 A GB9223306 A GB 9223306A GB 9223306 D0 GB9223306 D0 GB 9223306D0
Authority
GB
United Kingdom
Prior art keywords
optoelectronic devices
optoelectronic
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB929223306A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BT&D Technologies Ltd
Original Assignee
BT&D Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BT&D Technologies Ltd filed Critical BT&D Technologies Ltd
Priority to GB929223306A priority Critical patent/GB9223306D0/en
Publication of GB9223306D0 publication Critical patent/GB9223306D0/en
Priority to PCT/GB1993/002300 priority patent/WO1994011929A2/en
Priority to AU54280/94A priority patent/AU5428094A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Optical Couplings Of Light Guides (AREA)
GB929223306A 1992-11-06 1992-11-06 Optoelectronic devices Pending GB9223306D0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB929223306A GB9223306D0 (en) 1992-11-06 1992-11-06 Optoelectronic devices
PCT/GB1993/002300 WO1994011929A2 (en) 1992-11-06 1993-11-08 Optoelectronic devices
AU54280/94A AU5428094A (en) 1992-11-06 1993-11-08 Optoelectronic devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB929223306A GB9223306D0 (en) 1992-11-06 1992-11-06 Optoelectronic devices

Publications (1)

Publication Number Publication Date
GB9223306D0 true GB9223306D0 (en) 1992-12-23

Family

ID=10724664

Family Applications (1)

Application Number Title Priority Date Filing Date
GB929223306A Pending GB9223306D0 (en) 1992-11-06 1992-11-06 Optoelectronic devices

Country Status (3)

Country Link
AU (1) AU5428094A (en)
GB (1) GB9223306D0 (en)
WO (1) WO1994011929A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6066890A (en) * 1995-11-13 2000-05-23 Siliconix Incorporated Separate circuit devices in an intra-package configuration and assembly techniques
SE508763C2 (en) 1995-11-29 1998-11-02 Ericsson Telefon Ab L M Process and device for chip mounting
DE19615839A1 (en) * 1996-04-20 1997-10-23 Abb Patent Gmbh SMD light emitting diode
DE19622459C1 (en) * 1996-05-24 1997-11-27 Siemens Ag Electro-optical module
DE19718950A1 (en) * 1997-05-05 1998-11-12 Bosch Gmbh Robert Electro-optical module
AT407683B (en) * 1999-06-14 2001-05-25 Siemens Ag Oesterreich OPTICAL TRANSMISSION SYSTEM
JP4179866B2 (en) * 2002-12-24 2008-11-12 株式会社沖データ Semiconductor composite device and LED head
DE102008048259B4 (en) * 2008-09-22 2024-10-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Housing for an optoelectronic component, side-emitting component with a housing and method for producing a housing
CN104752955B (en) * 2015-03-31 2017-08-25 西安炬光科技有限公司 A kind of high-power semiconductor laser light source for processing system of feedback against sunshine
EP3168874B1 (en) 2015-11-11 2020-09-30 Lipac Co., Ltd. Semiconductor chip package with optical interface
US10880004B2 (en) 2016-11-01 2020-12-29 Jeong-Soo Kim Variable wavelength filter, and light receiver and light receiving method using variable wavelength filter

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58111008A (en) * 1981-12-24 1983-07-01 Toshiba Corp Optical module
JPS58182281A (en) * 1982-04-19 1983-10-25 Nec Corp Photoelectric converter
JPS59149072A (en) * 1983-02-16 1984-08-25 Hitachi Ltd Light-emitting semiconductor device
DE3400480A1 (en) * 1984-01-09 1985-09-05 Klaus-Rüdiger Dipl.-Ing. 4350 Recklinghausen Hase OPTICAL BUS SYSTEM (OPTOBUS) WITH PLANAR LIGHT-GUIDE FOR DATA-PROCESSING SYSTEMS, IN PARTICULAR MICRO-COMPUTERS
JPS60242691A (en) * 1984-05-16 1985-12-02 Omron Tateisi Electronics Co Assembling method of light-emitting apparatus
JPS6316682A (en) * 1986-07-08 1988-01-23 Nec Corp Resin-sealed light emitting module
JPS6316676A (en) * 1986-07-08 1988-01-23 Canon Inc Optical semiconductor device
JPS6465877A (en) * 1987-09-05 1989-03-13 Fujitsu Ltd Method of mounting optical semiconductor device
EP0400193B1 (en) * 1989-06-02 1994-02-09 Siemens Aktiengesellschaft Sensing device
AU631000B2 (en) * 1990-08-28 1992-11-12 Sumitomo Electric Industries, Ltd. Optical module

Also Published As

Publication number Publication date
WO1994011929A3 (en) 1994-07-21
AU5428094A (en) 1994-06-08
WO1994011929A2 (en) 1994-05-26

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