JPS6465877A - Method of mounting optical semiconductor device - Google Patents

Method of mounting optical semiconductor device

Info

Publication number
JPS6465877A
JPS6465877A JP62221228A JP22122887A JPS6465877A JP S6465877 A JPS6465877 A JP S6465877A JP 62221228 A JP62221228 A JP 62221228A JP 22122887 A JP22122887 A JP 22122887A JP S6465877 A JPS6465877 A JP S6465877A
Authority
JP
Japan
Prior art keywords
chip
marker
stem
optical semiconductor
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62221228A
Other languages
Japanese (ja)
Inventor
Katsuto Hirokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP62221228A priority Critical patent/JPS6465877A/en
Publication of JPS6465877A publication Critical patent/JPS6465877A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)

Abstract

PURPOSE:To enable a very accurate positioning of an optical semiconductor with ease by a method wherein a corresponding part of a chip is made to coincide with a marker provided onto a stem. CONSTITUTION:Markers 12, which represent the position corresponding to angles 23 of a semiconductor chip 2, are provided to a stem 1, where it is assumed that the center of an optical axis 22 coincides with that of the stem 1. Therefore, without providing a marker to a microscope or the like, the position of the chip 2 is so adjusted as to make the markers 12 coincide with the angles 23 of the chip 2, whereby the very accurate positioning for mounting of an optical semiconductor device can be accomplisheded. Moreover, even if a marker is provided to the chip 2 and the marker is made to coincide with a marker provided to the stem 1, the same result can be obtained.
JP62221228A 1987-09-05 1987-09-05 Method of mounting optical semiconductor device Pending JPS6465877A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62221228A JPS6465877A (en) 1987-09-05 1987-09-05 Method of mounting optical semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62221228A JPS6465877A (en) 1987-09-05 1987-09-05 Method of mounting optical semiconductor device

Publications (1)

Publication Number Publication Date
JPS6465877A true JPS6465877A (en) 1989-03-13

Family

ID=16763476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62221228A Pending JPS6465877A (en) 1987-09-05 1987-09-05 Method of mounting optical semiconductor device

Country Status (1)

Country Link
JP (1) JPS6465877A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4950818A (en) * 1988-07-11 1990-08-21 Kuraray Company, Ltd. Method for treating ulcer
JPH05243619A (en) * 1992-02-29 1993-09-21 Nec Corp Manufacture of optical semiconductor device
WO1994011929A2 (en) * 1992-11-06 1994-05-26 Bt&D Technologies Ltd. Optoelectronic devices

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4950818A (en) * 1988-07-11 1990-08-21 Kuraray Company, Ltd. Method for treating ulcer
JPH05243619A (en) * 1992-02-29 1993-09-21 Nec Corp Manufacture of optical semiconductor device
WO1994011929A2 (en) * 1992-11-06 1994-05-26 Bt&D Technologies Ltd. Optoelectronic devices
WO1994011929A3 (en) * 1992-11-06 1994-07-21 Bt & D Technologies Ltd Optoelectronic devices

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