WO1994011929A3 - Optoelectronic devices - Google Patents

Optoelectronic devices Download PDF

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Publication number
WO1994011929A3
WO1994011929A3 PCT/GB1993/002300 GB9302300W WO9411929A3 WO 1994011929 A3 WO1994011929 A3 WO 1994011929A3 GB 9302300 W GB9302300 W GB 9302300W WO 9411929 A3 WO9411929 A3 WO 9411929A3
Authority
WO
WIPO (PCT)
Prior art keywords
optoelectronic component
encapsulation
optical
provides
electrical
Prior art date
Application number
PCT/GB1993/002300
Other languages
French (fr)
Other versions
WO1994011929A2 (en
Inventor
David Philip Martin Chown
Original Assignee
Bt & D Technologies Ltd
David Philip Martin Chown
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bt & D Technologies Ltd, David Philip Martin Chown filed Critical Bt & D Technologies Ltd
Priority to AU54280/94A priority Critical patent/AU5428094A/en
Publication of WO1994011929A2 publication Critical patent/WO1994011929A2/en
Publication of WO1994011929A3 publication Critical patent/WO1994011929A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

This invention relates to an encapsulated optoelectronic circuit which is operable at wavelengths above 1200 nm, preferably in the band 1200 - 1600 nm. As well as the optoelectronic component which operates in the specified waveband the encapsulated device contains full electrical circuitry to drive the optoelectronic component. The invention includes receiver circuits in which the optoelectronic component receives an optical signal, e.g. from a fibre waveguide and electronic circuitry drives the optical receiver, demodulates and provides the data in an electrical form at one of its outputs. The invention includes the alternative case in which the optoelectronic component is an optical signal generator, e.g. an LED or a laser, and the electrical circuitry drives and modulates the optical generator. In this case the data is received from an external terminal. The various components are mounted on a conductive skelton which provides both electrical connections and partial mechanical support. The encapsulation provides the other mechanical support as well as environmental protection. The encapsulation may include a lens surface which assists in optical coupling. It is possible to adjust resistors, e.g. by evaporative heating, after encapsulation whereby operation parameters of the device can be adjusted at a very late stage.
PCT/GB1993/002300 1992-11-06 1993-11-08 Optoelectronic devices WO1994011929A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU54280/94A AU5428094A (en) 1992-11-06 1993-11-08 Optoelectronic devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9223306.3 1992-11-06
GB929223306A GB9223306D0 (en) 1992-11-06 1992-11-06 Optoelectronic devices

Publications (2)

Publication Number Publication Date
WO1994011929A2 WO1994011929A2 (en) 1994-05-26
WO1994011929A3 true WO1994011929A3 (en) 1994-07-21

Family

ID=10724664

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1993/002300 WO1994011929A2 (en) 1992-11-06 1993-11-08 Optoelectronic devices

Country Status (3)

Country Link
AU (1) AU5428094A (en)
GB (1) GB9223306D0 (en)
WO (1) WO1994011929A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6066890A (en) * 1995-11-13 2000-05-23 Siliconix Incorporated Separate circuit devices in an intra-package configuration and assembly techniques
SE508763C2 (en) 1995-11-29 1998-11-02 Ericsson Telefon Ab L M Process and device for chip mounting
DE19615839A1 (en) * 1996-04-20 1997-10-23 Abb Patent Gmbh SMD light emitting diode
DE19622459C1 (en) * 1996-05-24 1997-11-27 Siemens Ag Electro-optical module
DE19718950A1 (en) * 1997-05-05 1998-11-12 Bosch Gmbh Robert Electro-optical module
AT407683B (en) * 1999-06-14 2001-05-25 Siemens Ag Oesterreich OPTICAL TRANSMISSION SYSTEM
JP4179866B2 (en) 2002-12-24 2008-11-12 株式会社沖データ Semiconductor composite device and LED head
DE102008048259A1 (en) * 2008-09-22 2010-04-08 Osram Opto Semiconductors Gmbh Housing for an optoelectronic component
CN104752955B (en) * 2015-03-31 2017-08-25 西安炬光科技有限公司 A kind of high-power semiconductor laser light source for processing system of feedback against sunshine
EP3168874B1 (en) 2015-11-11 2020-09-30 Lipac Co., Ltd. Semiconductor chip package with optical interface
EP3534204B1 (en) * 2016-11-01 2022-09-07 Jeong-Soo Kim Variable wavelength filter, and light receiver and light receiving method using variable wavelength filter

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58111008A (en) * 1981-12-24 1983-07-01 Toshiba Corp Optical module
JPS58182281A (en) * 1982-04-19 1983-10-25 Nec Corp Photoelectric converter
JPS59149072A (en) * 1983-02-16 1984-08-25 Hitachi Ltd Light-emitting semiconductor device
WO1985003179A1 (en) * 1984-01-09 1985-07-18 Hase Klaus Ruediger Circuit with optical bus
JPS60242691A (en) * 1984-05-16 1985-12-02 Omron Tateisi Electronics Co Assembling method of light-emitting apparatus
JPS6316676A (en) * 1986-07-08 1988-01-23 Canon Inc Optical semiconductor device
JPS6316682A (en) * 1986-07-08 1988-01-23 Nec Corp Resin-sealed light emitting module
JPS6465877A (en) * 1987-09-05 1989-03-13 Fujitsu Ltd Method of mounting optical semiconductor device
EP0400193A1 (en) * 1989-06-02 1990-12-05 Siemens Aktiengesellschaft Sensing device
EP0472755A1 (en) * 1990-08-28 1992-03-04 Sumitomo Electric Industries, Ltd. Optical module

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58111008A (en) * 1981-12-24 1983-07-01 Toshiba Corp Optical module
JPS58182281A (en) * 1982-04-19 1983-10-25 Nec Corp Photoelectric converter
JPS59149072A (en) * 1983-02-16 1984-08-25 Hitachi Ltd Light-emitting semiconductor device
WO1985003179A1 (en) * 1984-01-09 1985-07-18 Hase Klaus Ruediger Circuit with optical bus
JPS60242691A (en) * 1984-05-16 1985-12-02 Omron Tateisi Electronics Co Assembling method of light-emitting apparatus
JPS6316676A (en) * 1986-07-08 1988-01-23 Canon Inc Optical semiconductor device
JPS6316682A (en) * 1986-07-08 1988-01-23 Nec Corp Resin-sealed light emitting module
JPS6465877A (en) * 1987-09-05 1989-03-13 Fujitsu Ltd Method of mounting optical semiconductor device
EP0400193A1 (en) * 1989-06-02 1990-12-05 Siemens Aktiengesellschaft Sensing device
EP0472755A1 (en) * 1990-08-28 1992-03-04 Sumitomo Electric Industries, Ltd. Optical module

Non-Patent Citations (7)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 10, no. 104 (E - 397)<2161> 19 April 1986 (1986-04-19) *
PATENT ABSTRACTS OF JAPAN vol. 12, no. 221 (E - 625) 23 June 1988 (1988-06-23) *
PATENT ABSTRACTS OF JAPAN vol. 12, no. 221 (E - 625)<3068> 23 June 1988 (1988-06-23) *
PATENT ABSTRACTS OF JAPAN vol. 13, no. 280 (E - 779) 27 June 1989 (1989-06-27) *
PATENT ABSTRACTS OF JAPAN vol. 7, no. 216 (P - 225) 24 September 1983 (1983-09-24) *
PATENT ABSTRACTS OF JAPAN vol. 8, no. 17 (E - 223)<1454> 25 January 1984 (1984-01-25) *
PATENT ABSTRACTS OF JAPAN vol. 8, no. 281 (E - 286) 21 December 1984 (1984-12-21) *

Also Published As

Publication number Publication date
GB9223306D0 (en) 1992-12-23
AU5428094A (en) 1994-06-08
WO1994011929A2 (en) 1994-05-26

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