JPS6425580A - Printed circuit board - Google Patents

Printed circuit board

Info

Publication number
JPS6425580A
JPS6425580A JP18251487A JP18251487A JPS6425580A JP S6425580 A JPS6425580 A JP S6425580A JP 18251487 A JP18251487 A JP 18251487A JP 18251487 A JP18251487 A JP 18251487A JP S6425580 A JPS6425580 A JP S6425580A
Authority
JP
Japan
Prior art keywords
optoelectronic integrated
board
integrated circuit
light
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18251487A
Other languages
Japanese (ja)
Inventor
Hiroaki Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP18251487A priority Critical patent/JPS6425580A/en
Publication of JPS6425580A publication Critical patent/JPS6425580A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)

Abstract

PURPOSE:To align optoelectronic integrated circuits at a time and easing their connection by forming electric and optical wirings on the same printed circuit board. CONSTITUTION:An optoelectronic integrated circuit 7 is electrically connected with a printed wiring 5 by a soldering bump 6, and fixedly mounted on a board. An optoelectronic integrated circuit 8 is also connected with the printed wiring and fixedly mounted on the board. Emitted light 13 from a light emitting part 9 of the optoelectronic integrated circuit 7 is allowed to transmit the board 1, diffracted through a grating 3 into light propagating through an optical waveguide, and further diffracted through a grating 4 toward the outside of the optical waveguide 2 as outgoing light 15, which light then reaches an optical detector part 10 of the optoelectronic integrated circuit 8. In such a manner, the two optoelectronic integrated circuits can be connected electrically by the soldering bump 6 and optically by the optical waveguide 2. The optoelectronic integrated circuit 7 and the board are aligned with each other with the aid of markers 11, 12. Additionally, optical and electrical coupling parts are fixed, thereby allowing those alignment to be effected simultaneously.
JP18251487A 1987-07-22 1987-07-22 Printed circuit board Pending JPS6425580A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18251487A JPS6425580A (en) 1987-07-22 1987-07-22 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18251487A JPS6425580A (en) 1987-07-22 1987-07-22 Printed circuit board

Publications (1)

Publication Number Publication Date
JPS6425580A true JPS6425580A (en) 1989-01-27

Family

ID=16119629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18251487A Pending JPS6425580A (en) 1987-07-22 1987-07-22 Printed circuit board

Country Status (1)

Country Link
JP (1) JPS6425580A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0623980A2 (en) * 1993-05-06 1994-11-09 CSELT Centro Studi e Laboratori Telecomunicazioni S.p.A. Semiconductor laser with transverse emission, and coupling thereof to an optical waveguide
JPH07183570A (en) * 1993-12-24 1995-07-21 Nec Corp Multichip module
JP2002174744A (en) * 2000-12-06 2002-06-21 Toppan Printing Co Ltd Board for mounting optical parts, package substrate and printed circuit board
JP2002174742A (en) * 2000-12-06 2002-06-21 Toppan Printing Co Ltd Board for mounting optical part, package substrate and printed circuit board
KR100478379B1 (en) * 2002-03-19 2005-03-24 학교법인 한국정보통신학원 Architecture of chip-to-chip optical interconnection using waveguides and microlenses
JP2011069925A (en) * 2009-09-24 2011-04-07 Nippon Telegr & Teleph Corp <Ntt> Optical circuit assembly

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0623980A2 (en) * 1993-05-06 1994-11-09 CSELT Centro Studi e Laboratori Telecomunicazioni S.p.A. Semiconductor laser with transverse emission, and coupling thereof to an optical waveguide
EP0623980A3 (en) * 1993-05-06 1995-02-15 Cselt Centro Studi Lab Telecom Semiconductor laser with transverse emission, and coupling thereof to an optical waveguide.
JPH07183570A (en) * 1993-12-24 1995-07-21 Nec Corp Multichip module
JP2002174744A (en) * 2000-12-06 2002-06-21 Toppan Printing Co Ltd Board for mounting optical parts, package substrate and printed circuit board
JP2002174742A (en) * 2000-12-06 2002-06-21 Toppan Printing Co Ltd Board for mounting optical part, package substrate and printed circuit board
KR100478379B1 (en) * 2002-03-19 2005-03-24 학교법인 한국정보통신학원 Architecture of chip-to-chip optical interconnection using waveguides and microlenses
JP2011069925A (en) * 2009-09-24 2011-04-07 Nippon Telegr & Teleph Corp <Ntt> Optical circuit assembly

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