JP4097949B2 - 空間光伝送システム - Google Patents
空間光伝送システム Download PDFInfo
- Publication number
- JP4097949B2 JP4097949B2 JP2002026725A JP2002026725A JP4097949B2 JP 4097949 B2 JP4097949 B2 JP 4097949B2 JP 2002026725 A JP2002026725 A JP 2002026725A JP 2002026725 A JP2002026725 A JP 2002026725A JP 4097949 B2 JP4097949 B2 JP 4097949B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- wavelength
- receiving element
- laser
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/11—Arrangements specific to free-space transmission, i.e. transmission through air or vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
- H10F30/223—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PIN barrier
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
- H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/12—Active materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/02234—Resin-filled housings; the housings being made of resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1082—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region with a special facet structure, e.g. structured, non planar, oblique
- H01S5/1085—Oblique facets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34313—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer having only As as V-compound, e.g. AlGaAs, InGaAs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/12—Active materials
- H10F77/122—Active materials comprising only Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/12—Active materials
- H10F77/124—Active materials comprising only Group III-V materials, e.g. GaAs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H10W72/01515—Forming coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Signal Processing (AREA)
- Biophysics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Computer Networks & Wireless Communication (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Light Receiving Elements (AREA)
- Semiconductor Lasers (AREA)
- Optical Communication System (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002026725A JP4097949B2 (ja) | 2001-04-20 | 2002-02-04 | 空間光伝送システム |
| DE60211414T DE60211414T2 (de) | 2001-04-20 | 2002-04-18 | Halbleiterlasermodul, optisches räumliches Übertragungssystem und elektronisches Gerät |
| EP06005995A EP1681751A1 (en) | 2001-04-20 | 2002-04-18 | Semiconductor laser module, spatial optical transmission system and electronic appliance |
| EP02252736A EP1251607B1 (en) | 2001-04-20 | 2002-04-18 | Semiconductor laser module, spatial optical transmission system and electronic appliance |
| US10/126,967 US6970489B2 (en) | 2001-04-20 | 2002-04-22 | Semiconductor laser module, spatial optical transmission system and electronic appliance |
| US11/229,618 US20060062269A1 (en) | 2001-04-20 | 2005-09-20 | Semiconductor laser module, spatial optical transmission system and electronic appliance |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-122399 | 2001-04-20 | ||
| JP2001122399 | 2001-04-20 | ||
| JP2002026725A JP4097949B2 (ja) | 2001-04-20 | 2002-02-04 | 空間光伝送システム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003008131A JP2003008131A (ja) | 2003-01-10 |
| JP2003008131A5 JP2003008131A5 (https=) | 2005-08-18 |
| JP4097949B2 true JP4097949B2 (ja) | 2008-06-11 |
Family
ID=26613908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002026725A Expired - Fee Related JP4097949B2 (ja) | 2001-04-20 | 2002-02-04 | 空間光伝送システム |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6970489B2 (https=) |
| EP (2) | EP1251607B1 (https=) |
| JP (1) | JP4097949B2 (https=) |
| DE (1) | DE60211414T2 (https=) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6712529B2 (en) * | 2000-12-11 | 2004-03-30 | Rohm Co., Ltd. | Infrared data communication module and method of making the same |
| US7061025B2 (en) * | 2003-03-10 | 2006-06-13 | Mccolloch Lawrence R | Optoelectronic device packaging assemblies and methods of making the same |
| US7508854B2 (en) * | 2003-11-14 | 2009-03-24 | Sanyo Electric Co., Ltd. | Semiconductor laser device |
| JP3857694B2 (ja) * | 2004-02-05 | 2006-12-13 | ローム株式会社 | 光通信モジュール |
| KR100945621B1 (ko) * | 2005-03-07 | 2010-03-04 | 로무 가부시키가이샤 | 광 통신 모듈 및 그 제조 방법 |
| JP4969055B2 (ja) * | 2005-04-28 | 2012-07-04 | ローム株式会社 | 光通信モジュール |
| US7482666B2 (en) * | 2006-01-12 | 2009-01-27 | Silicon Laboratories Inc. | Apparatus and method for optical isolation |
| JP2007258667A (ja) * | 2006-02-21 | 2007-10-04 | Seiko Epson Corp | 光電気複合基板及び電子機器 |
| JP5114773B2 (ja) * | 2007-08-10 | 2013-01-09 | スタンレー電気株式会社 | 表面実装型発光装置 |
| EP2249201A4 (en) | 2008-03-03 | 2011-08-10 | Sharp Kk | DISPLAY DEVICE WITH LIGHT SENSOR |
| US20130223846A1 (en) | 2009-02-17 | 2013-08-29 | Trilumina Corporation | High speed free-space optical communications |
| US9620934B2 (en) * | 2010-08-31 | 2017-04-11 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Flip-chip assembly comprising an array of vertical cavity surface emitting lasers (VCSELs) |
| US9188751B2 (en) | 2010-08-31 | 2015-11-17 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Flip-chip assembly comprising an array of vertical cavity surface emitting lasers (VCSELSs), and an optical transmitter assembly that incorporates the flip-chip assembly |
| WO2012115246A1 (ja) * | 2011-02-25 | 2012-08-30 | ローム株式会社 | 通信モジュールおよび携帯型電子機器 |
| US11095365B2 (en) * | 2011-08-26 | 2021-08-17 | Lumentum Operations Llc | Wide-angle illuminator module |
| US20150270900A1 (en) * | 2014-03-19 | 2015-09-24 | Apple Inc. | Optical data transfer utilizing lens isolation |
| KR102378761B1 (ko) * | 2015-07-21 | 2022-03-25 | 엘지이노텍 주식회사 | 일체형 발광 패키지 및 이를 이용한 차량용 램프 |
| US10539661B2 (en) * | 2015-11-25 | 2020-01-21 | Velodyne Lidar, Inc. | Three dimensional LIDAR system with targeted field of view |
| JP6940749B2 (ja) * | 2016-04-28 | 2021-09-29 | 日亜化学工業株式会社 | 発光装置 |
| US10148365B2 (en) * | 2017-01-05 | 2018-12-04 | Intel Corporation | Hybrid free air and electrical interconnect |
| CN114069378B (zh) * | 2020-07-30 | 2025-07-22 | 核工业理化工程研究院 | 一种高功率激光长距离传输装置及其长距离传输方法 |
| DE102022201340A1 (de) * | 2022-02-09 | 2023-08-24 | Osram Opto Semiconductors Gmbh | Halbleiterlaser mit Strahlungsführungselement |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2737345C2 (de) * | 1976-08-20 | 1991-07-25 | Canon K.K., Tokio/Tokyo | Halbleiterlaser-Vorrichtung mit einem Peltier-Element |
| JPS5848443A (ja) * | 1981-09-17 | 1983-03-22 | Toshiba Corp | 樹脂封止型半導体装置 |
| JPS6063977A (ja) * | 1983-09-17 | 1985-04-12 | Mitsubishi Electric Corp | 半導体レ−ザ装置 |
| JPS60154689A (ja) * | 1984-01-25 | 1985-08-14 | Hitachi Ltd | 発光素子およびこれを用いた光通信装置 |
| KR910004265B1 (ko) * | 1987-03-26 | 1991-06-25 | 가부시기가이샤 히다찌세이사꾸쇼 | 반도체 레이저 장치와 그 제조 방법 및 그것을 사용한 광 헤드 |
| US5130563A (en) * | 1989-11-30 | 1992-07-14 | Washington Research Foundation | Optoelectronic sensory neural network |
| JPH03274781A (ja) * | 1990-03-23 | 1991-12-05 | Rohm Co Ltd | レーザダイオード |
| US5140384A (en) * | 1990-06-14 | 1992-08-18 | Rohm Co., Ltd. | Semiconductor laser device mounted on a stem |
| JPH0448674A (ja) * | 1990-06-14 | 1992-02-18 | Rohm Co Ltd | 半導体レーザ |
| JPH04144396A (ja) * | 1990-10-04 | 1992-05-18 | Sony Corp | 双方向リモートコントロール装置 |
| US5590144A (en) * | 1990-11-07 | 1996-12-31 | Fuji Electric Co., Ltd. | Semiconductor laser device |
| JPH04216682A (ja) * | 1990-12-18 | 1992-08-06 | Sumitomo Electric Ind Ltd | 受光素子 |
| JPH06252856A (ja) * | 1992-12-30 | 1994-09-09 | Canon Inc | 近赤外光空間通信装置 |
| US5680241A (en) * | 1992-12-30 | 1997-10-21 | Canon Kabushiki Kaisha | Optical space communication |
| JP3110586B2 (ja) * | 1993-06-04 | 2000-11-20 | 松下電子工業株式会社 | 半導体レーザ装置 |
| EP0632511A3 (en) * | 1993-06-29 | 1996-11-27 | Mitsubishi Cable Ind Ltd | Light emitting diode assembly and manufacturing method. |
| IL114176A (en) * | 1995-06-15 | 2000-02-29 | Jolt Ltd | Wireless communication system |
| JPH09252285A (ja) * | 1996-03-15 | 1997-09-22 | Toshiba Corp | 近赤外線通信装置 |
| JPH10190584A (ja) | 1996-10-25 | 1998-07-21 | Seiko Epson Corp | 光無線データ通信システムと、それに用いる送信装置、受信装置 |
| US6310707B1 (en) * | 1996-10-25 | 2001-10-30 | Seiko Epson Corporation | Optical wireless data communication system, and transmitter and receiver used therefor |
| JP3425310B2 (ja) * | 1996-11-25 | 2003-07-14 | シャープ株式会社 | 発光/受光装置 |
| JP3087676B2 (ja) * | 1997-02-13 | 2000-09-11 | 日本電気株式会社 | ゲル状樹脂を用いた光結合系及び実装構造 |
| US5844257A (en) * | 1997-06-12 | 1998-12-01 | Quarton, Inc. | Multi-directional light emitting semiconductor device |
| JP3948789B2 (ja) * | 1997-07-02 | 2007-07-25 | シチズン電子株式会社 | 赤外線データ通信モジュール |
| US6020590A (en) * | 1998-01-22 | 2000-02-01 | Ois Optical Imaging Systems, Inc. | Large area imager with UV blocking layer |
| US6081020A (en) * | 1998-02-20 | 2000-06-27 | Lucent Technologies Inc. | Linear PIN photodiode |
| EP1079550B1 (en) * | 1998-04-24 | 2007-10-31 | Sharp Kabushiki Kaisha | Space-division multiplex full-duplex local area network |
| US6452669B1 (en) * | 1998-08-31 | 2002-09-17 | Digital Optics Corp. | Transmission detection for vertical cavity surface emitting laser power monitor and system |
| US6198800B1 (en) * | 1998-09-16 | 2001-03-06 | Canon Kabushiki Kaisha | Exposure control for digital radiography systems using charge build-up in sensor array pixels |
| EP1163711A1 (en) * | 1999-03-24 | 2001-12-19 | Cielo Communications, Inc. | Encapsulated optoelectronic devices with controlled properties |
| JP4902044B2 (ja) * | 1999-09-24 | 2012-03-21 | シャープ株式会社 | 半導体レーザ装置、光伝送装置、光伝送システム、電子機器、制御装置、接続コネクタ、通信装置、ならびに光伝送方法、データ送受信方法 |
-
2002
- 2002-02-04 JP JP2002026725A patent/JP4097949B2/ja not_active Expired - Fee Related
- 2002-04-18 EP EP02252736A patent/EP1251607B1/en not_active Expired - Lifetime
- 2002-04-18 DE DE60211414T patent/DE60211414T2/de not_active Expired - Lifetime
- 2002-04-18 EP EP06005995A patent/EP1681751A1/en not_active Ceased
- 2002-04-22 US US10/126,967 patent/US6970489B2/en not_active Expired - Lifetime
-
2005
- 2005-09-20 US US11/229,618 patent/US20060062269A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20060062269A1 (en) | 2006-03-23 |
| JP2003008131A (ja) | 2003-01-10 |
| EP1681751A1 (en) | 2006-07-19 |
| EP1251607B1 (en) | 2006-05-17 |
| EP1251607A2 (en) | 2002-10-23 |
| DE60211414T2 (de) | 2007-04-26 |
| US6970489B2 (en) | 2005-11-29 |
| DE60211414D1 (de) | 2006-06-22 |
| US20020154667A1 (en) | 2002-10-24 |
| EP1251607A3 (en) | 2003-05-07 |
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