JP3914842B2 - 有機被膜の除去方法および除去装置 - Google Patents

有機被膜の除去方法および除去装置 Download PDF

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Publication number
JP3914842B2
JP3914842B2 JP2002229394A JP2002229394A JP3914842B2 JP 3914842 B2 JP3914842 B2 JP 3914842B2 JP 2002229394 A JP2002229394 A JP 2002229394A JP 2002229394 A JP2002229394 A JP 2002229394A JP 3914842 B2 JP3914842 B2 JP 3914842B2
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JP
Japan
Prior art keywords
liquid
ozone
treatment
film
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002229394A
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English (en)
Japanese (ja)
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JP2003330206A (ja
JP2003330206A5 (OSRAM
Inventor
久志 村岡
里江子 村岡
あすか 佐藤
満 遠藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nomura Micro Science Co Ltd
UMS Co Ltd
Original Assignee
Nomura Micro Science Co Ltd
UMS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nomura Micro Science Co Ltd, UMS Co Ltd filed Critical Nomura Micro Science Co Ltd
Priority to JP2002229394A priority Critical patent/JP3914842B2/ja
Priority to TW091124051A priority patent/TW584893B/zh
Priority to US10/274,153 priority patent/US6696228B2/en
Priority to CNB021471231A priority patent/CN1286154C/zh
Priority to KR1020020064786A priority patent/KR100882988B1/ko
Priority to US10/683,288 priority patent/US6851873B2/en
Publication of JP2003330206A publication Critical patent/JP2003330206A/ja
Publication of JP2003330206A5 publication Critical patent/JP2003330206A5/ja
Priority to KR1020050111295A priority patent/KR100806476B1/ko
Application granted granted Critical
Publication of JP3914842B2 publication Critical patent/JP3914842B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3063—Electrolytic etching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D9/00—Chemical paint or ink removers
    • C09D9/005—Chemical paint or ink removers containing organic solvents
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/266—Esters or carbonates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/005—Details of cleaning machines or methods involving the use or presence of liquid or steam the liquid being ozonated
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Drying Of Semiconductors (AREA)
  • Weting (AREA)
JP2002229394A 2001-10-23 2002-08-07 有機被膜の除去方法および除去装置 Expired - Fee Related JP3914842B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2002229394A JP3914842B2 (ja) 2001-10-23 2002-08-07 有機被膜の除去方法および除去装置
TW091124051A TW584893B (en) 2001-10-23 2002-10-18 Method and apparatus for removing organic films
US10/274,153 US6696228B2 (en) 2001-10-23 2002-10-21 Method and apparatus for removing organic films
CNB021471231A CN1286154C (zh) 2001-10-23 2002-10-22 除去有机薄膜的方法和设备
KR1020020064786A KR100882988B1 (ko) 2001-10-23 2002-10-23 유기 피막의 제거 방법
US10/683,288 US6851873B2 (en) 2001-10-23 2003-10-14 Method and apparatus for removing organic films
KR1020050111295A KR100806476B1 (ko) 2001-10-23 2005-11-21 유기 피막의 제거 장치

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2001-325516 2001-10-23
JP2001325516 2001-10-23
JP2002061096 2002-03-06
JP2002-61096 2002-03-06
JP2002229394A JP3914842B2 (ja) 2001-10-23 2002-08-07 有機被膜の除去方法および除去装置

Publications (3)

Publication Number Publication Date
JP2003330206A JP2003330206A (ja) 2003-11-19
JP2003330206A5 JP2003330206A5 (OSRAM) 2005-07-07
JP3914842B2 true JP3914842B2 (ja) 2007-05-16

Family

ID=27347717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002229394A Expired - Fee Related JP3914842B2 (ja) 2001-10-23 2002-08-07 有機被膜の除去方法および除去装置

Country Status (5)

Country Link
US (2) US6696228B2 (OSRAM)
JP (1) JP3914842B2 (OSRAM)
KR (2) KR100882988B1 (OSRAM)
CN (1) CN1286154C (OSRAM)
TW (1) TW584893B (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150037719A (ko) 2012-06-26 2015-04-08 노무라마이크로사이엔스가부시키가이샤 레지스트 박리제

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