|
AU2003268622A1
(en)
*
|
2002-09-06 |
2004-03-29 |
Basf Corporation |
Method of removing coatings from plastic articles
|
|
KR100951898B1
(ko)
*
|
2002-12-09 |
2010-04-09 |
삼성전자주식회사 |
포토레지스트 제거용 스트리핑 조성물 및 이를 사용한액정 표시 장치의 박막 트랜지스터 기판의 제조방법
|
|
US20080140379A1
(en)
*
|
2003-05-22 |
2008-06-12 |
Xoomsys, Inc. |
Approximations for simulations of systems
|
|
US7253092B2
(en)
*
|
2003-06-24 |
2007-08-07 |
Nec Electronics America, Inc. |
Tungsten plug corrosion prevention method using water
|
|
JP4397646B2
(ja)
*
|
2003-07-30 |
2010-01-13 |
東京エレクトロン株式会社 |
基板処理装置および基板処理方法
|
|
US6977215B2
(en)
*
|
2003-10-28 |
2005-12-20 |
Nec Electronics America, Inc. |
Tungsten plug corrosion prevention method using gas sparged water
|
|
US7052992B2
(en)
*
|
2003-10-28 |
2006-05-30 |
Nec Electronics America, Inc. |
Tungsten plug corrosion prevention method using ionized air
|
|
DE10351689A1
(de)
*
|
2003-11-06 |
2005-06-16 |
Khs Maschinen- Und Anlagenbau Ag |
Verfahren zum Betreiben einer Pasteurisierungsanlage
|
|
US7202175B2
(en)
*
|
2003-11-07 |
2007-04-10 |
Industrial Technology Research Institute |
Method and apparatus for treating a substrate surface by bubbling
|
|
JP2005169287A
(ja)
*
|
2003-12-11 |
2005-06-30 |
Nomura Micro Sci Co Ltd |
有機被膜洗浄液の再生装置及び再生方法並びに有機被膜の洗浄装置及び洗浄方法
|
|
JP2005236083A
(ja)
*
|
2004-02-20 |
2005-09-02 |
Toshiba Corp |
半導体装置の製造方法
|
|
CN100397155C
(zh)
*
|
2004-06-11 |
2008-06-25 |
鸿富锦精密工业（深圳）有限公司 |
基板处理装置及处理方法
|
|
KR20050120914A
(ko)
*
|
2004-06-21 |
2005-12-26 |
주식회사 동진쎄미켐 |
레지스트 제거용 조성물
|
|
JP2006019575A
(ja)
|
2004-07-02 |
2006-01-19 |
Sharp Corp |
フォトレジストの現像方法及び現像装置
|
|
JP4321815B2
(ja)
*
|
2004-07-30 |
2009-08-26 |
富士フイルム株式会社 |
感光材料処理装置
|
|
US7235479B2
(en)
*
|
2004-08-26 |
2007-06-26 |
Applied Materials, Inc. |
Organic solvents having ozone dissolved therein for semiconductor processing utilizing sacrificial materials
|
|
US7632756B2
(en)
*
|
2004-08-26 |
2009-12-15 |
Applied Materials, Inc. |
Semiconductor processing using energized hydrogen gas and in combination with wet cleaning
|
|
US20060084260A1
(en)
*
|
2004-09-07 |
2006-04-20 |
Boyers David G |
Copper processing using an ozone-solvent solution
|
|
US8603258B2
(en)
|
2004-09-14 |
2013-12-10 |
Church & Dwight Co., Inc. |
Paint and ink remover two-phase system
|
|
JP4883975B2
(ja)
*
|
2004-10-19 |
2012-02-22 |
株式会社レナテック |
基体表面上の付着物の除去方法、除去用処理液および除去装置
|
|
KR100625486B1
(ko)
*
|
2004-11-04 |
2006-09-20 |
주식회사 디엠에스 |
평판 디스플레이용 기판처리장치 및 기판처리방법
|
|
JP4503426B2
(ja)
*
|
2004-11-30 |
2010-07-14 |
野村マイクロ・サイエンス株式会社 |
洗浄装置
|
|
JP2006173211A
(ja)
*
|
2004-12-13 |
2006-06-29 |
Sekisui Chem Co Ltd |
レジスト除去方法及びレジスト除去装置
|
|
JP2006310767A
(ja)
*
|
2005-03-28 |
2006-11-09 |
Dainippon Screen Mfg Co Ltd |
基板処理装置
|
|
KR100690347B1
(ko)
*
|
2005-04-09 |
2007-03-09 |
주식회사 엘지화학 |
박리액 조성물, 이를 이용한 박리 방법 및 그 박리 장치
|
|
KR20080018215A
(ko)
*
|
2005-06-22 |
2008-02-27 |
도아고세이가부시키가이샤 |
기체 표면 위의 유기 피막의 제거 방법 및 제거 장치
|
|
JPWO2007004612A1
(ja)
*
|
2005-07-05 |
2009-01-29 |
東亞合成株式会社 |
剥離液中の有機物濃度を管理した基体の製造方法
|
|
JP4413831B2
(ja)
*
|
2005-08-11 |
2010-02-10 |
株式会社日立ハイテクノロジーズ |
ウェハ表面検査装置及びウェハ表面検査方法
|
|
US20070095366A1
(en)
*
|
2005-11-02 |
2007-05-03 |
Applied Materials, Inc. |
Stripping and cleaning of organic-containing materials from electronic device substrate surfaces
|
|
US7402213B2
(en)
*
|
2006-02-03 |
2008-07-22 |
Applied Materials, Inc. |
Stripping and removal of organic-containing materials from electronic device substrate surfaces
|
|
US20070261718A1
(en)
*
|
2006-05-10 |
2007-11-15 |
Rubinder Randhawa |
Method and apparatus for ozone-enhanced cleaning of flat objects with pulsed liquid jet
|
|
KR100801149B1
(ko)
*
|
2006-05-18 |
2008-02-11 |
(주)엠아이반도체 |
패키지된 반도체 및 전자부품의 몰딩 수지 제거장치
|
|
CN1888878B
(zh)
*
|
2006-07-14 |
2012-05-30 |
沪东中华造船(集团)有限公司 |
不燃型着色探伤清洗液及其制备方法
|
|
EP1903400A1
(en)
*
|
2006-09-20 |
2008-03-26 |
Interuniversitair Microelektronica Centrum |
A method to remove resist layers from a substrate
|
|
US20080076689A1
(en)
*
|
2006-09-27 |
2008-03-27 |
Matthews Robert R |
System using ozonated acetic anhydride to remove photoresist materials
|
|
KR101294019B1
(ko)
*
|
2007-02-20 |
2013-08-16 |
주식회사 동진쎄미켐 |
포토레지스트 제거 조성물 및 이를 이용한 포토레지스트제거방법
|
|
WO2008105108A1
(ja)
*
|
2007-02-27 |
2008-09-04 |
Shigenori Aono |
漂白繊維品の製法およびそれに用いる装置、並びにそれによって得られる漂白繊維品
|
|
JP4905253B2
(ja)
*
|
2007-05-23 |
2012-03-28 |
株式会社明電舎 |
レジスト除去方法及びその装置
|
|
JP4952375B2
(ja)
|
2007-05-23 |
2012-06-13 |
株式会社明電舎 |
レジスト除去方法及びその装置
|
|
TWI406111B
(zh)
*
|
2007-05-23 |
2013-08-21 |
Meidensha Electric Mfg Co Ltd |
Method for removing resist and device thereof
|
|
JP2009049300A
(ja)
*
|
2007-08-22 |
2009-03-05 |
Toshiba Corp |
半導体記憶装置の製造方法
|
|
JP2009076638A
(ja)
*
|
2007-09-20 |
2009-04-09 |
Toshiba Corp |
半導体装置の製造方法
|
|
US7767586B2
(en)
*
|
2007-10-29 |
2010-08-03 |
Applied Materials, Inc. |
Methods for forming connective elements on integrated circuits for packaging applications
|
|
US7749327B2
(en)
*
|
2007-11-01 |
2010-07-06 |
Micron Technology, Inc. |
Methods for treating surfaces
|
|
WO2009072402A1
(ja)
|
2007-12-04 |
2009-06-11 |
Meidensha Corporation |
レジスト除去方法及びその装置
|
|
US8309502B2
(en)
*
|
2009-03-27 |
2012-11-13 |
Eastman Chemical Company |
Compositions and methods for removing organic substances
|
|
US8614053B2
(en)
|
2009-03-27 |
2013-12-24 |
Eastman Chemical Company |
Processess and compositions for removing substances from substrates
|
|
US8444768B2
(en)
*
|
2009-03-27 |
2013-05-21 |
Eastman Chemical Company |
Compositions and methods for removing organic substances
|
|
US8691056B2
(en)
*
|
2009-04-17 |
2014-04-08 |
Distillation Technologies, Inc. |
Method and apparatus for separating fluid mixtures
|
|
JP5278247B2
(ja)
*
|
2009-08-28 |
2013-09-04 |
旭硝子株式会社 |
ガラス基板用スペーサ分離装置及びガラス基板の製造方法
|
|
CN102024675B
(zh)
*
|
2009-11-20 |
2012-09-05 |
沈阳芯源微电子设备有限公司 |
多种化学品分类排放回收系统
|
|
JP2011192885A
(ja)
*
|
2010-03-16 |
2011-09-29 |
Toshiba Corp |
半導体基板の洗浄方法
|
|
JP5470186B2
(ja)
*
|
2010-07-30 |
2014-04-16 |
日本発條株式会社 |
被検査物の清浄度検査装置と、清浄度検査方法
|
|
JP2012109290A
(ja)
|
2010-11-15 |
2012-06-07 |
Kurita Water Ind Ltd |
シリコンウェハ清浄化方法及びシリコンウェハ清浄化装置
|
|
US8709165B2
(en)
|
2010-12-03 |
2014-04-29 |
Lam Research Ag |
Method and apparatus for surface treatment using inorganic acid and ozone
|
|
TWI480937B
(zh)
|
2011-01-06 |
2015-04-11 |
Screen Holdings Co Ltd |
基板處理方法及基板處理裝置
|
|
SE537311C2
(sv)
*
|
2011-11-16 |
2015-04-07 |
Observe Medical Aps |
Anording och metod för detektering av en mätkammares ytdegenerering under mätning av urinproduktion
|
|
US9170496B2
(en)
*
|
2011-11-30 |
2015-10-27 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Method of pre-treating a wafer surface before applying a solvent-containing material thereon
|
|
CN103987664B
(zh)
|
2011-12-06 |
2017-03-08 |
德尔塔阀门公司 |
龙头中的臭氧分配
|
|
US20130260569A1
(en)
*
|
2012-03-30 |
2013-10-03 |
Lam Research Ag |
Apparatus and method for liquid treatment of wafer-shaped articles
|
|
CN103733137B
(zh)
|
2012-06-26 |
2019-06-25 |
野村微科学股份有限公司 |
抗蚀剂剥离剂
|
|
US9011611B2
(en)
*
|
2012-07-02 |
2015-04-21 |
Fuji Xerox Co., Ltd. |
Cleaning apparatus and cleaning method
|
|
US9875916B2
(en)
*
|
2012-07-09 |
2018-01-23 |
Tokyo Electron Limited |
Method of stripping photoresist on a single substrate system
|
|
US8871108B2
(en)
*
|
2013-01-22 |
2014-10-28 |
Tel Fsi, Inc. |
Process for removing carbon material from substrates
|
|
CN103324038A
(zh)
*
|
2013-06-25 |
2013-09-25 |
京东方科技集团股份有限公司 |
一种显影装置及显影方法
|
|
US9562291B2
(en)
*
|
2014-01-14 |
2017-02-07 |
Mei, Llc |
Metal etch system
|
|
JP6289318B2
(ja)
*
|
2014-09-08 |
2018-03-07 |
東京エレクトロン株式会社 |
現像方法、現像装置及び記憶媒体
|
|
US10308541B2
(en)
|
2014-11-13 |
2019-06-04 |
Gerresheimer Glas Gmbh |
Glass forming machine particle filter, a plunger unit, a blow head, a blow head support and a glass forming machine adapted to or comprising said filter
|
|
KR101847086B1
(ko)
*
|
2014-11-18 |
2018-04-10 |
주식회사 엘지화학 |
포토레지스트 박리 장치 및 이를 이용한 포토레지스트 박리 방법
|
|
CN104409398A
(zh)
*
|
2014-12-02 |
2015-03-11 |
昆山国显光电有限公司 |
刻蚀装置
|
|
KR101776017B1
(ko)
*
|
2015-10-27 |
2017-09-07 |
세메스 주식회사 |
용존 오존 제거 유닛 및 이를 포함하는 기판 처리 장치, 용존 오존 제거 방법, 기판 세정 방법
|
|
WO2017112795A1
(en)
|
2015-12-21 |
2017-06-29 |
Delta Faucet Company |
Fluid delivery system including a disinfectant device
|
|
JP6439766B2
(ja)
*
|
2016-09-23 |
2018-12-19 |
東京エレクトロン株式会社 |
塗布、現像方法及び塗布、現像装置
|
|
DK179314B1
(en)
*
|
2017-02-08 |
2018-04-30 |
Steeper Energy Aps |
Pressurization system for high pressure treatment system
|
|
JP2019126746A
(ja)
*
|
2018-01-22 |
2019-08-01 |
株式会社ディスコ |
加工装置
|
|
CN108831995B
(zh)
*
|
2018-06-08 |
2022-07-29 |
东君新能源有限公司 |
一种柔性组件中有机层的分离方法
|
|
US10663865B2
(en)
*
|
2018-06-29 |
2020-05-26 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Photoresist recycling apparatus
|
|
KR102121237B1
(ko)
*
|
2018-12-06 |
2020-06-10 |
세메스 주식회사 |
기판 처리 장치 및 방법
|
|
JP7314634B2
(ja)
*
|
2019-06-11 |
2023-07-26 |
東京エレクトロン株式会社 |
塗布装置及び塗布方法
|
|
WO2022221641A1
(en)
*
|
2021-04-15 |
2022-10-20 |
Zep Ip Holding Llc |
System and method for assessing cleanliness
|
|
CN113600541B
(zh)
*
|
2021-08-19 |
2022-06-21 |
富兰克科技（深圳）股份有限公司 |
一种低排放环保单工位智能水油通用清洗机
|
|
CN113917806A
(zh)
*
|
2021-10-15 |
2022-01-11 |
广州奥松电子股份有限公司 |
光刻胶清洗装置及其清洗方法
|
|
CN113959045A
(zh)
*
|
2021-10-27 |
2022-01-21 |
杭州树派环保科技有限公司 |
室内空气治理用除异味的装置及除异味装置用自清洁装置
|
|
US12138745B2
(en)
|
2023-03-22 |
2024-11-12 |
Yield Engineering Systems, Inc. |
Apparatus and method for coating removal
|
|
CN117181694B
(zh)
*
|
2023-05-31 |
2025-11-04 |
安徽富乐德科技发展股份有限公司 |
一种Faceplate部件清洗装置及清洗药水配方
|