TW584893B - Method and apparatus for removing organic films - Google Patents

Method and apparatus for removing organic films Download PDF

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Publication number
TW584893B
TW584893B TW091124051A TW91124051A TW584893B TW 584893 B TW584893 B TW 584893B TW 091124051 A TW091124051 A TW 091124051A TW 91124051 A TW91124051 A TW 91124051A TW 584893 B TW584893 B TW 584893B
Authority
TW
Taiwan
Prior art keywords
liquid
ozone
substrate
processing
item
Prior art date
Application number
TW091124051A
Other languages
English (en)
Chinese (zh)
Inventor
Hisashi Muraoka
Rieko Muraoka
Asuka Sato
Mitsuru Endo
Original Assignee
Ums Co Ltd
Purex Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ums Co Ltd, Purex Co Ltd filed Critical Ums Co Ltd
Application granted granted Critical
Publication of TW584893B publication Critical patent/TW584893B/zh

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3063Electrolytic etching
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02Cleaning by the force of jets or sprays
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D9/00Chemical paint or ink removers
    • C09D9/005Chemical paint or ink removers containing organic solvents
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/26Organic compounds containing oxygen
    • C11D7/266Esters or carbonates
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/423Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/005Details of cleaning machines or methods involving the use or presence of liquid or steam the liquid being ozonated
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10Objects to be cleaned
    • C11D2111/14Hard surfaces
    • C11D2111/22Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Drying Of Semiconductors (AREA)
  • Weting (AREA)
TW091124051A 2001-10-23 2002-10-18 Method and apparatus for removing organic films TW584893B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001325516 2001-10-23
JP2002061096 2002-03-06
JP2002229394A JP3914842B2 (ja) 2001-10-23 2002-08-07 有機被膜の除去方法および除去装置

Publications (1)

Publication Number Publication Date
TW584893B true TW584893B (en) 2004-04-21

Family

ID=27347717

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091124051A TW584893B (en) 2001-10-23 2002-10-18 Method and apparatus for removing organic films

Country Status (5)

Country Link
US (2) US6696228B2 (OSRAM)
JP (1) JP3914842B2 (OSRAM)
KR (2) KR100882988B1 (OSRAM)
CN (1) CN1286154C (OSRAM)
TW (1) TW584893B (OSRAM)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7586581B2 (en) 2004-07-02 2009-09-08 Sharp Kabushiki Kaisha Developing method of photoresist and developing device
TWI406111B (zh) * 2007-05-23 2013-08-21 Meidensha Electric Mfg Co Ltd Method for removing resist and device thereof
TWI584085B (zh) * 2014-11-18 2017-05-21 Lg 化學股份有限公司 光阻移除裝置及使用其的光阻移除方法
TWI615895B (zh) * 2013-01-22 2018-02-21 東京電子Fsi股份有限公司 自基板移除碳物質之製程

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7586581B2 (en) 2004-07-02 2009-09-08 Sharp Kabushiki Kaisha Developing method of photoresist and developing device
TWI406111B (zh) * 2007-05-23 2013-08-21 Meidensha Electric Mfg Co Ltd Method for removing resist and device thereof
TWI615895B (zh) * 2013-01-22 2018-02-21 東京電子Fsi股份有限公司 自基板移除碳物質之製程
TWI584085B (zh) * 2014-11-18 2017-05-21 Lg 化學股份有限公司 光阻移除裝置及使用其的光阻移除方法

Also Published As

Publication number Publication date
JP2003330206A (ja) 2003-11-19
JP3914842B2 (ja) 2007-05-16
KR100882988B1 (ko) 2009-02-12
US20040076912A1 (en) 2004-04-22
CN1414610A (zh) 2003-04-30
US20030108823A1 (en) 2003-06-12
CN1286154C (zh) 2006-11-22
US6696228B2 (en) 2004-02-24
US6851873B2 (en) 2005-02-08
KR20050115844A (ko) 2005-12-08
KR20030033988A (ko) 2003-05-01
KR100806476B1 (ko) 2008-02-21

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