KR100707126B1 - 표면 부착 오염 물질의 제거방법 및 이에 사용되는 장치 - Google Patents
표면 부착 오염 물질의 제거방법 및 이에 사용되는 장치 Download PDFInfo
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- KR100707126B1 KR100707126B1 KR1020000057308A KR20000057308A KR100707126B1 KR 100707126 B1 KR100707126 B1 KR 100707126B1 KR 1020000057308 A KR1020000057308 A KR 1020000057308A KR 20000057308 A KR20000057308 A KR 20000057308A KR 100707126 B1 KR100707126 B1 KR 100707126B1
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- ozone
- liquid
- acetic acid
- treatment
- organic solvent
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- 238000000034 method Methods 0.000 title claims abstract description 58
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- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
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- 239000011261 inert gas Substances 0.000 description 1
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- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/39—Organic or inorganic per-compounds
- C11D3/3947—Liquid compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/28—Organic compounds containing halogen
- C11D7/30—Halogenated hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Emergency Medicine (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (19)
- 기체 중의 오존과의 분배계수가 0.6 이상인 유기 용제로 주로 이루어진 용제에 오존을 100ppm 이상 용해시킨 처리액을 오염 물질이 부착된 피처리체의 표면에 접촉시켜 피처리체 표면에 부착된 오염 물질을 제거함을 특징으로 하는, 표면 부착 오염 물질의 제거방법.
- 제1항에 있어서, 처리액의 액막을 오염 물질이 부착된 피처리체의 표면에 형성시키고, 이러한 액막에 새로운 처리액을 연속적으로 또는 간헐적으로 공급하여 액막을 이동시킴으로써, 피처리체 표면과 오존 함유 처리액을 접촉시킴을 특징으로 하는, 표면 부착 오염 물질의 제거방법.
- 제1항에 있어서, 오존을 포함하는 분위기 하에서, 유기 용제의 액막을 오염 물질이 부착된 피처리체의 표면에 형성시키고, 이러한 액막에 새로운 용제를 연속적으로 또는 간헐적으로 공급하여 막의 액을 이동시킴으로써, 피처리체 표면과 오존 함유 처리액을 접촉시킴을 특징으로 하는, 표면 부착 오염 물질의 제거방법.
- 제2항 또는 제3항에 있어서, 처리액 또는 유기 용제의 공급이 분무에 의해 수행됨을 특징으로 하는, 표면 부착 오염 물질의 제거방법.
- 제1항 내지 제3항 중의 어느 한 항에 있어서, 오염 물질 제거 처리 후의 오존 함유 유기 용제액을 오존을 유기 용제에 용해시키기 위한 유기 용제의 용기 속으로 복귀시켜, 별도의 피처리체를 처리하기 위한 처리액으로서 순환 사용함을 특징으로 하는, 표면 부착 오염 물질의 제거방법.
- 제3항에 있어서, 유기 용제액의 공급이, 가열된 당해 용제액으로부터 발생하는 증기를 냉각시켜 피처리체 표면 위에서 응축시킴으로써 수행됨을 특징으로 하는, 표면 부착 오염 물질의 제거방법.
- 제1항 내지 제3항 및 제6항 중의 어느 한 항에 있어서, 유기 용제가 화학식 CnH2n+1(COOH)의 지방산(여기서, n은 1, 2 또는 3의 정수이다)임을 특징으로 하는, 표면 부착 오염 물질의 제거방법.
- 제7항에 있어서, 지방산으로 이루어진 유기 용제에 5용량% 이하의 무기산을 포함하는 물이 첨가되어 있음을 특징으로 하는, 표면 부착 오염 물질의 제거방법.
- 제7항에 있어서, 지방산으로 이루어진 유기 용제가 15 내지 30용량%의 물을 함유함을 특징으로 하는, 표면 부착 오염 물질의 제거방법.
- 제1항 내지 제3항 및 제6항 중의 어느 한 항에 있어서, 유기 용제가 디클로로메탄임을 특징으로 하는, 표면 부착 오염 물질의 제거방법.
- 기체 중의 오존과의 분배계수가 0.6 이상인 유기 용제로 주로 이루어진 용제에 오존을 포함하는 기체를 버블링시켜 당해 용제에 오존을 100ppm 이상의 농도로 용해시켜 처리액을 제조하는 용기, 처리액을 저부(底部)의 임의의 처리 챔버 속으로 수송하는 배관, 챔버 내에서 오염 물질이 부착된 피처리체의 처리면 전체면에 처리액의 액막을 형성시키고 당해 막의 액을 이동시키는 기구 및 처리를 완료하여 챔버 바닥에 도달한 액을 용기로 복귀시키는 배관으로 구성됨을 특징으로 하는, 피처리체 표면의 부착 오염 물질의 제거장치.
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JP2000086924 | 2000-03-27 |
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US (1) | US6699330B1 (ko) |
EP (1) | EP1088603B1 (ko) |
KR (1) | KR100707126B1 (ko) |
AT (1) | ATE283119T1 (ko) |
DE (1) | DE60016133T2 (ko) |
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EP1088603B1 (en) | 2004-11-24 |
KR20010039947A (ko) | 2001-05-15 |
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ATE283119T1 (de) | 2004-12-15 |
TW466558B (en) | 2001-12-01 |
US6699330B1 (en) | 2004-03-02 |
DE60016133D1 (de) | 2004-12-30 |
DE60016133T2 (de) | 2005-05-25 |
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