JP3855929B2 - 感光性樹脂組成物、感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法 - Google Patents
感光性樹脂組成物、感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法 Download PDFInfo
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- JP3855929B2 JP3855929B2 JP2002501106A JP2002501106A JP3855929B2 JP 3855929 B2 JP3855929 B2 JP 3855929B2 JP 2002501106 A JP2002501106 A JP 2002501106A JP 2002501106 A JP2002501106 A JP 2002501106A JP 3855929 B2 JP3855929 B2 JP 3855929B2
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- photosensitive resin
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- glycol chain
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- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
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- FDZZZRQASAIRJF-UHFFFAOYSA-M malachite green Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1C(C=1C=CC=CC=1)=C1C=CC(=[N+](C)C)C=C1 FDZZZRQASAIRJF-UHFFFAOYSA-M 0.000 description 3
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- WTAGSJAOBUKKCE-UHFFFAOYSA-N 9-(2-acridin-9-ylethyl)acridine Chemical compound C1=CC=C2C(CCC=3C4=CC=CC=C4N=C4C=CC=CC4=3)=C(C=CC=C3)C3=NC2=C1 WTAGSJAOBUKKCE-UHFFFAOYSA-N 0.000 description 1
- RXHZPGSSIWOFGS-UHFFFAOYSA-N 9-(3-acridin-9-ylpropyl)acridine Chemical compound C1=CC=C2C(CCCC=3C4=CC=CC=C4N=C4C=CC=CC4=3)=C(C=CC=C3)C3=NC2=C1 RXHZPGSSIWOFGS-UHFFFAOYSA-N 0.000 description 1
- WEGVLMACGSHSDS-UHFFFAOYSA-N 9-(4-acridin-9-ylbutyl)acridine Chemical compound C1=CC=C2C(CCCCC=3C4=CC=CC=C4N=C4C=CC=CC4=3)=C(C=CC=C3)C3=NC2=C1 WEGVLMACGSHSDS-UHFFFAOYSA-N 0.000 description 1
- IPRFSEGUKLMSFA-UHFFFAOYSA-N 9-(5-acridin-9-ylpentyl)acridine Chemical compound C1=CC=C2C(CCCCCC=3C4=CC=CC=C4N=C4C=CC=CC4=3)=C(C=CC=C3)C3=NC2=C1 IPRFSEGUKLMSFA-UHFFFAOYSA-N 0.000 description 1
- WCKMSJWQEMKTSO-UHFFFAOYSA-N 9-(6-acridin-9-ylhexyl)acridine Chemical compound C1=CC=C2C(CCCCCCC=3C4=CC=CC=C4N=C4C=CC=CC4=3)=C(C=CC=C3)C3=NC2=C1 WCKMSJWQEMKTSO-UHFFFAOYSA-N 0.000 description 1
- OQZQPVXWVWYBJB-UHFFFAOYSA-N 9-(8-acridin-9-yloctyl)acridine Chemical compound C1=CC=C2C(CCCCCCCCC=3C4=CC=CC=C4N=C4C=CC=CC4=3)=C(C=CC=C3)C3=NC2=C1 OQZQPVXWVWYBJB-UHFFFAOYSA-N 0.000 description 1
- ANEVUELFSBEQSF-UHFFFAOYSA-N 9-(9-acridin-9-ylnonyl)acridine Chemical compound C1=CC=C2C(CCCCCCCCCC=3C4=CC=CC=C4N=C4C=CC=CC4=3)=C(C=CC=C3)C3=NC2=C1 ANEVUELFSBEQSF-UHFFFAOYSA-N 0.000 description 1
- MTRFEWTWIPAXLG-UHFFFAOYSA-N 9-phenylacridine Chemical compound C1=CC=CC=C1C1=C(C=CC=C2)C2=NC2=CC=CC=C12 MTRFEWTWIPAXLG-UHFFFAOYSA-N 0.000 description 1
- BLODUABHBVJLOF-UHFFFAOYSA-N 9-pyrazin-2-ylacridine Chemical compound C=12C=CC=CC2=NC2=CC=CC=C2C=1C1=CN=CC=N1 BLODUABHBVJLOF-UHFFFAOYSA-N 0.000 description 1
- JQPNFFYPPWWWCH-UHFFFAOYSA-N 9-pyridin-2-ylacridine Chemical compound N1=CC=CC=C1C1=C(C=CC=C2)C2=NC2=CC=CC=C12 JQPNFFYPPWWWCH-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 241000251468 Actinopterygii Species 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical class OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- XLYMOEINVGRTEX-ARJAWSKDSA-N Ethyl hydrogen fumarate Chemical compound CCOC(=O)\C=C/C(O)=O XLYMOEINVGRTEX-ARJAWSKDSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
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- SOGAXMICEFXMKE-UHFFFAOYSA-N alpha-Methyl-n-butyl acrylate Natural products CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- 125000000332 coumarinyl group Chemical class O1C(=O)C(=CC2=CC=CC=C12)* 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 150000004292 cyclic ethers Chemical group 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- MKVYSRNJLWTVIK-UHFFFAOYSA-N ethyl carbamate;2-methylprop-2-enoic acid Chemical class CCOC(N)=O.CC(=C)C(O)=O.CC(=C)C(O)=O MKVYSRNJLWTVIK-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- XLYMOEINVGRTEX-UHFFFAOYSA-N fumaric acid monoethyl ester Natural products CCOC(=O)C=CC(O)=O XLYMOEINVGRTEX-UHFFFAOYSA-N 0.000 description 1
- NKHAVTQWNUWKEO-UHFFFAOYSA-N fumaric acid monomethyl ester Natural products COC(=O)C=CC(O)=O NKHAVTQWNUWKEO-UHFFFAOYSA-N 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical group OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000012216 imaging agent Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- NKHAVTQWNUWKEO-IHWYPQMZSA-N methyl hydrogen fumarate Chemical compound COC(=O)\C=C/C(O)=O NKHAVTQWNUWKEO-IHWYPQMZSA-N 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- UORVCLMRJXCDCP-UHFFFAOYSA-N propynoic acid Chemical compound OC(=O)C#C UORVCLMRJXCDCP-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- LMYRWZFENFIFIT-UHFFFAOYSA-N toluene-4-sulfonamide Chemical compound CC1=CC=C(S(N)(=O)=O)C=C1 LMYRWZFENFIFIT-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/322—Aqueous alkaline compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/12—Nitrogen compound containing
- Y10S430/121—Nitrogen in heterocyclic ring
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000-157530 | 2000-05-29 | ||
| JP2000157530 | 2000-05-29 | ||
| JP2000-395193 | 2000-12-26 | ||
| JP2000395193 | 2000-12-26 | ||
| PCT/JP2001/004496 WO2001092958A1 (en) | 2000-05-29 | 2001-05-29 | Photosensitive resin composition, photosensitive element, production method for resist pattern and production method for printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2001092958A1 JPWO2001092958A1 (ja) | 2003-08-05 |
| JP3855929B2 true JP3855929B2 (ja) | 2006-12-13 |
Family
ID=26592761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002501106A Expired - Lifetime JP3855929B2 (ja) | 2000-05-29 | 2001-05-29 | 感光性樹脂組成物、感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7517636B2 (enExample) |
| JP (1) | JP3855929B2 (enExample) |
| KR (1) | KR100537084B1 (enExample) |
| CN (1) | CN1228688C (enExample) |
| AU (1) | AU6063901A (enExample) |
| TW (1) | TWI306546B (enExample) |
| WO (1) | WO2001092958A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4632117B2 (ja) * | 2004-07-27 | 2011-02-16 | 日立化成工業株式会社 | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法 |
| JP2006106287A (ja) * | 2004-10-04 | 2006-04-20 | Hitachi Chem Co Ltd | 感光性樹脂組成物、感光性エレメント及び感光性エレメントの製造方法 |
| KR100935780B1 (ko) * | 2005-05-30 | 2010-01-06 | 히다치 가세고교 가부시끼가이샤 | 감광성 수지 조성물 이것을 이용한 감광성 엘리먼트,레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법 |
| KR101190945B1 (ko) | 2005-10-25 | 2012-10-12 | 히다치 가세고교 가부시끼가이샤 | 감광성 수지 조성물, 이것을 이용한 감광성 엘리먼트, 레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법 |
| US7094523B1 (en) * | 2005-11-30 | 2006-08-22 | Kesheng Feng | Developer solution and process for use |
| KR100994311B1 (ko) * | 2006-09-13 | 2010-11-12 | 히다치 가세고교 가부시끼가이샤 | 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법 |
| US8460852B2 (en) * | 2008-04-28 | 2013-06-11 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for manufacturing printed wiring board |
| CN102037406A (zh) * | 2008-06-02 | 2011-04-27 | 日立化成工业株式会社 | 感光性树脂组合物、感光性元件、抗蚀剂图形的制造方法以及印刷电路板的制造方法 |
| WO2010103918A1 (ja) * | 2009-03-13 | 2010-09-16 | 日立化成工業株式会社 | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
| JP5488866B2 (ja) * | 2009-03-16 | 2014-05-14 | 日立化成株式会社 | 感光性エレメント、並びにこれを用いたレジストパターンの形成方法及びプリント配線板の製造方法 |
| JP4873043B2 (ja) * | 2009-04-28 | 2012-02-08 | 日立化成工業株式会社 | 感光性樹脂組成物、これを用いた感光性エレメント、画像表示装置の隔壁の形成方法及び画像表示装置の製造方法 |
| CN103076717A (zh) * | 2011-10-26 | 2013-05-01 | 日立化成工业株式会社 | 感光性树脂组合物、感光性元件、抗蚀图案的形成方法及印刷配线板的制造方法 |
| JP5826006B2 (ja) * | 2011-12-01 | 2015-12-02 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物 |
| JP5673762B2 (ja) * | 2013-09-17 | 2015-02-18 | 日立化成株式会社 | 感光性エレメント、並びにこれを用いたレジストパターンの形成方法及びプリント配線板の製造方法 |
| JP6486672B2 (ja) * | 2013-12-20 | 2019-03-20 | 旭化成株式会社 | 感光性エレメント、及びその製造方法 |
| JP6092802B2 (ja) * | 2014-03-20 | 2017-03-08 | 藤森工業株式会社 | 粘着フィルムの製造方法、粘着剤組成物及び粘着フィルム |
| CN104834182B (zh) * | 2015-05-20 | 2019-05-03 | 杭州福斯特应用材料股份有限公司 | 一种具有高分辨率和优异掩孔性能的感光干膜 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63147159A (ja) * | 1986-12-11 | 1988-06-20 | Fuji Photo Film Co Ltd | 光重合性組成物 |
| DE3878349T2 (de) | 1987-03-17 | 1993-05-27 | Asahi Denka Kogyo Kk | Substituierte acridin-derivate und deren verwendung. |
| US5260149A (en) * | 1988-01-15 | 1993-11-09 | E. I. Du Pont De Nemours And Company | Photopolymerizable compositions in elements for hologram imaging |
| JP2730630B2 (ja) | 1988-08-19 | 1998-03-25 | 日立化成工業 株式会社 | 積層体エレメントおよびその滲み出しの防止方法 |
| EP0506616B1 (de) | 1991-03-27 | 1998-01-21 | Ciba SC Holding AG | Photoempfindliches Gemisch auf Basis von Acrylaten |
| TW223683B (enExample) | 1991-03-27 | 1994-05-11 | Ciba Geigy Ag | |
| JPH05271130A (ja) | 1992-01-30 | 1993-10-19 | Idemitsu Petrochem Co Ltd | （ペルフルオロデカリン）カルボン酸エステル体、その製造方法及び（ペルフルオロデカリン）アルコール体の製造方法 |
| JPH05224413A (ja) * | 1992-02-14 | 1993-09-03 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた積層体 |
| JPH05232699A (ja) | 1992-02-24 | 1993-09-10 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた感光性エレメント |
| JPH0675371A (ja) | 1992-08-26 | 1994-03-18 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた感光性エレメント |
| JPH06236031A (ja) * | 1993-02-12 | 1994-08-23 | Asahi Denka Kogyo Kk | 感光性樹脂組成物及びこれを用いた感光性エレメント |
| JPH06242603A (ja) | 1993-02-15 | 1994-09-02 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた感光性エレメント |
| DE69426298T2 (de) * | 1993-03-31 | 2001-07-12 | Nippon Zeon Co., Ltd. | Lichtempfindliche zusammensetzung, lichtempfindliche kautschukplatte und verfahren zur herstellung dieser platte, flexografische platte und verfahren zur herstellung dieser platte |
| JPH08157744A (ja) * | 1994-12-12 | 1996-06-18 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた感光性エレメント |
| TW424172B (en) | 1995-04-19 | 2001-03-01 | Hitachi Chemical Co Ltd | Photosensitive resin composition and photosensitive element using the same |
| JP3199600B2 (ja) | 1995-04-19 | 2001-08-20 | 日立化成工業株式会社 | 感光性樹脂組成物及びこれを用いた感光性エレメント |
| JP3055499B2 (ja) | 1996-07-30 | 2000-06-26 | 日立化成工業株式会社 | 積層フィルム及びプリント配線板の製造法 |
| JP3100041B2 (ja) | 1997-07-04 | 2000-10-16 | 日本合成化学工業株式会社 | レジストパターン形成方法 |
| JP3939402B2 (ja) | 1997-09-08 | 2007-07-04 | 日本合成化学工業株式会社 | レジストパターン形成方法 |
| SG85613A1 (en) | 1998-02-06 | 2002-01-15 | Morton Int Inc | Photoimageable compositions having hydrophilic binder polymers and hydrophilic monomers |
-
2001
- 2001-05-29 TW TW090112863A patent/TWI306546B/zh not_active IP Right Cessation
- 2001-05-29 US US10/296,911 patent/US7517636B2/en not_active Expired - Fee Related
- 2001-05-29 AU AU60639/01A patent/AU6063901A/en not_active Abandoned
- 2001-05-29 JP JP2002501106A patent/JP3855929B2/ja not_active Expired - Lifetime
- 2001-05-29 KR KR10-2002-7015775A patent/KR100537084B1/ko not_active Expired - Lifetime
- 2001-05-29 WO PCT/JP2001/004496 patent/WO2001092958A1/ja not_active Ceased
- 2001-05-29 CN CNB018102395A patent/CN1228688C/zh not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR20030076223A (ko) | 2003-09-26 |
| CN1432141A (zh) | 2003-07-23 |
| CN1228688C (zh) | 2005-11-23 |
| US20030186166A1 (en) | 2003-10-02 |
| TWI306546B (enExample) | 2009-02-21 |
| AU6063901A (en) | 2001-12-11 |
| WO2001092958A1 (en) | 2001-12-06 |
| US7517636B2 (en) | 2009-04-14 |
| KR100537084B1 (ko) | 2005-12-16 |
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