CN1228688C - 感光性树脂组合物、感光性元件、保护层图形的制造方法和印刷电路布线板的制造方法 - Google Patents

感光性树脂组合物、感光性元件、保护层图形的制造方法和印刷电路布线板的制造方法 Download PDF

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Publication number
CN1228688C
CN1228688C CNB018102395A CN01810239A CN1228688C CN 1228688 C CN1228688 C CN 1228688C CN B018102395 A CNB018102395 A CN B018102395A CN 01810239 A CN01810239 A CN 01810239A CN 1228688 C CN1228688 C CN 1228688C
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CN
China
Prior art keywords
resin composition
photosensitive resin
weight
mentioned
polymer combination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB018102395A
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English (en)
Chinese (zh)
Other versions
CN1432141A (zh
Inventor
深谷雄大
远藤昌树
阿部卓治
板垣胜俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN1432141A publication Critical patent/CN1432141A/zh
Application granted granted Critical
Publication of CN1228688C publication Critical patent/CN1228688C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/322—Aqueous alkaline compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/12—Nitrogen compound containing
    • Y10S430/121—Nitrogen in heterocyclic ring

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CNB018102395A 2000-05-29 2001-05-29 感光性树脂组合物、感光性元件、保护层图形的制造方法和印刷电路布线板的制造方法 Expired - Lifetime CN1228688C (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2000157530 2000-05-29
JP157530/2000 2000-05-29
JP157530/00 2000-05-29
JP395193/2000 2000-12-26
JP395193/00 2000-12-26
JP2000395193 2000-12-26

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CNB2005100796271A Division CN100541328C (zh) 2000-05-29 2001-05-29 感光性树脂组合物和元件、以及相关构件的制造方法

Publications (2)

Publication Number Publication Date
CN1432141A CN1432141A (zh) 2003-07-23
CN1228688C true CN1228688C (zh) 2005-11-23

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CNB018102395A Expired - Lifetime CN1228688C (zh) 2000-05-29 2001-05-29 感光性树脂组合物、感光性元件、保护层图形的制造方法和印刷电路布线板的制造方法

Country Status (7)

Country Link
US (1) US7517636B2 (enExample)
JP (1) JP3855929B2 (enExample)
KR (1) KR100537084B1 (enExample)
CN (1) CN1228688C (enExample)
AU (1) AU6063901A (enExample)
TW (1) TWI306546B (enExample)
WO (1) WO2001092958A1 (enExample)

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JP4632117B2 (ja) * 2004-07-27 2011-02-16 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
JP2006106287A (ja) * 2004-10-04 2006-04-20 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント及び感光性エレメントの製造方法
WO2006129469A1 (ja) * 2005-05-30 2006-12-07 Hitachi Chemical Company, Ltd. 感光性樹脂組成物これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP4788716B2 (ja) 2005-10-25 2011-10-05 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
US7094523B1 (en) * 2005-11-30 2006-08-22 Kesheng Feng Developer solution and process for use
EP2063318A4 (en) * 2006-09-13 2010-06-23 Hitachi Chemical Co Ltd A LIGHT-SENSITIVE RESIN COMPOSITION, A LIGHT-SENSITIVE ELEMENT, A METHOD FOR FORMING A RESISTANCE STRUCTURE, AND A METHOD FOR PRODUCING A LADDER PLATE
CN105425544A (zh) * 2008-04-28 2016-03-23 日立化成工业株式会社 感光性树脂组合物、感光性元件、抗蚀图形的形成方法及印刷电路板的制造方法
CN105182688B (zh) * 2008-06-02 2019-11-12 日立化成株式会社 感光性树脂组合物、感光性元件、抗蚀剂图形的制造方法以及印刷电路板的制造方法
MY151102A (en) * 2009-03-13 2014-04-15 Hitachi Chemical Co Ltd Photosensitive resin composition, and photosensitive element, resist pattern formation method and printed circuit board production method each utilizing same
JP5488866B2 (ja) * 2009-03-16 2014-05-14 日立化成株式会社 感光性エレメント、並びにこれを用いたレジストパターンの形成方法及びプリント配線板の製造方法
JP4873043B2 (ja) * 2009-04-28 2012-02-08 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、画像表示装置の隔壁の形成方法及び画像表示装置の製造方法
CN103076717A (zh) * 2011-10-26 2013-05-01 日立化成工业株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法及印刷配线板的制造方法
JP5826006B2 (ja) * 2011-12-01 2015-12-02 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
JP5673762B2 (ja) * 2013-09-17 2015-02-18 日立化成株式会社 感光性エレメント、並びにこれを用いたレジストパターンの形成方法及びプリント配線板の製造方法
JP6486672B2 (ja) * 2013-12-20 2019-03-20 旭化成株式会社 感光性エレメント、及びその製造方法
JP6092802B2 (ja) * 2014-03-20 2017-03-08 藤森工業株式会社 粘着フィルムの製造方法、粘着剤組成物及び粘着フィルム
CN104834182B (zh) * 2015-05-20 2019-05-03 杭州福斯特应用材料股份有限公司 一种具有高分辨率和优异掩孔性能的感光干膜

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Also Published As

Publication number Publication date
CN1432141A (zh) 2003-07-23
US7517636B2 (en) 2009-04-14
JP3855929B2 (ja) 2006-12-13
AU6063901A (en) 2001-12-11
KR20030076223A (ko) 2003-09-26
KR100537084B1 (ko) 2005-12-16
WO2001092958A1 (en) 2001-12-06
TWI306546B (enExample) 2009-02-21
US20030186166A1 (en) 2003-10-02

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