AU6063901A - Photosensitive resin composition, photosensitive element, production method for resist pattern and production method for printed circuit board - Google Patents

Photosensitive resin composition, photosensitive element, production method for resist pattern and production method for printed circuit board

Info

Publication number
AU6063901A
AU6063901A AU60639/01A AU6063901A AU6063901A AU 6063901 A AU6063901 A AU 6063901A AU 60639/01 A AU60639/01 A AU 60639/01A AU 6063901 A AU6063901 A AU 6063901A AU 6063901 A AU6063901 A AU 6063901A
Authority
AU
Australia
Prior art keywords
production method
circuit board
resin composition
printed circuit
resist pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU60639/01A
Other languages
English (en)
Inventor
Takuji Abe
Masaki Endou
Takahiro Fukaya
Katsutoshi Itagaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of AU6063901A publication Critical patent/AU6063901A/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/322—Aqueous alkaline compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/12—Nitrogen compound containing
    • Y10S430/121—Nitrogen in heterocyclic ring

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AU60639/01A 2000-05-29 2001-05-29 Photosensitive resin composition, photosensitive element, production method for resist pattern and production method for printed circuit board Abandoned AU6063901A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2000-157530 2000-05-29
JP2000157530 2000-05-29
JP2000-395193 2000-12-26
JP2000395193 2000-12-26
PCT/JP2001/004496 WO2001092958A1 (en) 2000-05-29 2001-05-29 Photosensitive resin composition, photosensitive element, production method for resist pattern and production method for printed circuit board

Publications (1)

Publication Number Publication Date
AU6063901A true AU6063901A (en) 2001-12-11

Family

ID=26592761

Family Applications (1)

Application Number Title Priority Date Filing Date
AU60639/01A Abandoned AU6063901A (en) 2000-05-29 2001-05-29 Photosensitive resin composition, photosensitive element, production method for resist pattern and production method for printed circuit board

Country Status (7)

Country Link
US (1) US7517636B2 (enExample)
JP (1) JP3855929B2 (enExample)
KR (1) KR100537084B1 (enExample)
CN (1) CN1228688C (enExample)
AU (1) AU6063901A (enExample)
TW (1) TWI306546B (enExample)
WO (1) WO2001092958A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4632117B2 (ja) * 2004-07-27 2011-02-16 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
JP2006106287A (ja) * 2004-10-04 2006-04-20 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント及び感光性エレメントの製造方法
KR100935780B1 (ko) * 2005-05-30 2010-01-06 히다치 가세고교 가부시끼가이샤 감광성 수지 조성물 이것을 이용한 감광성 엘리먼트,레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법
KR101190945B1 (ko) 2005-10-25 2012-10-12 히다치 가세고교 가부시끼가이샤 감광성 수지 조성물, 이것을 이용한 감광성 엘리먼트, 레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법
US7094523B1 (en) * 2005-11-30 2006-08-22 Kesheng Feng Developer solution and process for use
KR100994311B1 (ko) * 2006-09-13 2010-11-12 히다치 가세고교 가부시끼가이샤 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법
US8460852B2 (en) * 2008-04-28 2013-06-11 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for manufacturing printed wiring board
CN102037406A (zh) * 2008-06-02 2011-04-27 日立化成工业株式会社 感光性树脂组合物、感光性元件、抗蚀剂图形的制造方法以及印刷电路板的制造方法
WO2010103918A1 (ja) * 2009-03-13 2010-09-16 日立化成工業株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP5488866B2 (ja) * 2009-03-16 2014-05-14 日立化成株式会社 感光性エレメント、並びにこれを用いたレジストパターンの形成方法及びプリント配線板の製造方法
JP4873043B2 (ja) * 2009-04-28 2012-02-08 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、画像表示装置の隔壁の形成方法及び画像表示装置の製造方法
CN103076717A (zh) * 2011-10-26 2013-05-01 日立化成工业株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法及印刷配线板的制造方法
JP5826006B2 (ja) * 2011-12-01 2015-12-02 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
JP5673762B2 (ja) * 2013-09-17 2015-02-18 日立化成株式会社 感光性エレメント、並びにこれを用いたレジストパターンの形成方法及びプリント配線板の製造方法
JP6486672B2 (ja) * 2013-12-20 2019-03-20 旭化成株式会社 感光性エレメント、及びその製造方法
JP6092802B2 (ja) * 2014-03-20 2017-03-08 藤森工業株式会社 粘着フィルムの製造方法、粘着剤組成物及び粘着フィルム
CN104834182B (zh) * 2015-05-20 2019-05-03 杭州福斯特应用材料股份有限公司 一种具有高分辨率和优异掩孔性能的感光干膜

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Publication number Priority date Publication date Assignee Title
JPS63147159A (ja) * 1986-12-11 1988-06-20 Fuji Photo Film Co Ltd 光重合性組成物
DE3878349T2 (de) 1987-03-17 1993-05-27 Asahi Denka Kogyo Kk Substituierte acridin-derivate und deren verwendung.
US5260149A (en) * 1988-01-15 1993-11-09 E. I. Du Pont De Nemours And Company Photopolymerizable compositions in elements for hologram imaging
JP2730630B2 (ja) 1988-08-19 1998-03-25 日立化成工業 株式会社 積層体エレメントおよびその滲み出しの防止方法
EP0506616B1 (de) 1991-03-27 1998-01-21 Ciba SC Holding AG Photoempfindliches Gemisch auf Basis von Acrylaten
TW223683B (enExample) 1991-03-27 1994-05-11 Ciba Geigy Ag
JPH05271130A (ja) 1992-01-30 1993-10-19 Idemitsu Petrochem Co Ltd （ペルフルオロデカリン）カルボン酸エステル体、その製造方法及び（ペルフルオロデカリン）アルコール体の製造方法
JPH05224413A (ja) * 1992-02-14 1993-09-03 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた積層体
JPH05232699A (ja) 1992-02-24 1993-09-10 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
JPH0675371A (ja) 1992-08-26 1994-03-18 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
JPH06236031A (ja) * 1993-02-12 1994-08-23 Asahi Denka Kogyo Kk 感光性樹脂組成物及びこれを用いた感光性エレメント
JPH06242603A (ja) 1993-02-15 1994-09-02 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
DE69426298T2 (de) * 1993-03-31 2001-07-12 Nippon Zeon Co., Ltd. Lichtempfindliche zusammensetzung, lichtempfindliche kautschukplatte und verfahren zur herstellung dieser platte, flexografische platte und verfahren zur herstellung dieser platte
JPH08157744A (ja) * 1994-12-12 1996-06-18 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
TW424172B (en) 1995-04-19 2001-03-01 Hitachi Chemical Co Ltd Photosensitive resin composition and photosensitive element using the same
JP3199600B2 (ja) 1995-04-19 2001-08-20 日立化成工業株式会社 感光性樹脂組成物及びこれを用いた感光性エレメント
JP3055499B2 (ja) 1996-07-30 2000-06-26 日立化成工業株式会社 積層フィルム及びプリント配線板の製造法
JP3100041B2 (ja) 1997-07-04 2000-10-16 日本合成化学工業株式会社 レジストパターン形成方法
JP3939402B2 (ja) 1997-09-08 2007-07-04 日本合成化学工業株式会社 レジストパターン形成方法
SG85613A1 (en) 1998-02-06 2002-01-15 Morton Int Inc Photoimageable compositions having hydrophilic binder polymers and hydrophilic monomers

Also Published As

Publication number Publication date
KR20030076223A (ko) 2003-09-26
JP3855929B2 (ja) 2006-12-13
CN1432141A (zh) 2003-07-23
CN1228688C (zh) 2005-11-23
US20030186166A1 (en) 2003-10-02
TWI306546B (enExample) 2009-02-21
WO2001092958A1 (en) 2001-12-06
US7517636B2 (en) 2009-04-14
KR100537084B1 (ko) 2005-12-16

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase