AU2001284499A1 - Photosensitive composition, cured article thereof, and printed circuit board using the same - Google Patents

Photosensitive composition, cured article thereof, and printed circuit board using the same

Info

Publication number
AU2001284499A1
AU2001284499A1 AU2001284499A AU8449901A AU2001284499A1 AU 2001284499 A1 AU2001284499 A1 AU 2001284499A1 AU 2001284499 A AU2001284499 A AU 2001284499A AU 8449901 A AU8449901 A AU 8449901A AU 2001284499 A1 AU2001284499 A1 AU 2001284499A1
Authority
AU
Australia
Prior art keywords
circuit board
same
printed circuit
photosensitive composition
cured article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001284499A
Inventor
Motoyuki Hirata
Yoshikazu Kanemaru
Kenji Tamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001088113A external-priority patent/JP4611554B2/en
Priority claimed from JP2001268392A external-priority patent/JP4623890B2/en
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of AU2001284499A1 publication Critical patent/AU2001284499A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
AU2001284499A 2000-09-11 2001-09-10 Photosensitive composition, cured article thereof, and printed circuit board using the same Abandoned AU2001284499A1 (en)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
JP2000-275704 2000-09-11
JP2000275704 2000-09-11
US23804600P 2000-10-06 2000-10-06
US60238046 2000-10-06
JP2000367131 2000-12-01
JP2000-367131 2000-12-01
US25691600P 2000-12-21 2000-12-21
US60256916 2000-12-21
JP2001-088113 2001-03-26
JP2001088113A JP4611554B2 (en) 2000-12-01 2001-03-26 Photosensitive composition, cured product thereof, and printed wiring board using the same
JP2001-268392 2001-09-05
JP2001268392A JP4623890B2 (en) 2000-09-11 2001-09-05 Photosensitive composition, cured product thereof and printed wiring board using the same
PCT/JP2001/007826 WO2002023273A2 (en) 2000-09-11 2001-09-10 Photosensitive composition, cured article thereof, and printed circuit board using the same

Publications (1)

Publication Number Publication Date
AU2001284499A1 true AU2001284499A1 (en) 2002-03-26

Family

ID=27554841

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001284499A Abandoned AU2001284499A1 (en) 2000-09-11 2001-09-10 Photosensitive composition, cured article thereof, and printed circuit board using the same

Country Status (6)

Country Link
US (1) US6818382B2 (en)
EP (1) EP1317691A2 (en)
KR (1) KR100515218B1 (en)
CN (1) CN1306338C (en)
AU (1) AU2001284499A1 (en)
WO (1) WO2002023273A2 (en)

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JP4606684B2 (en) * 2000-03-29 2011-01-05 学校法人神奈川大学 Photocurable / thermosetting resin composition, photosensitive dry film thereof and pattern forming method using the same
US6913352B2 (en) * 2000-10-10 2005-07-05 Toyo Ink Mfg. Co., Ltd. Actinic radiation curing jet printing ink
EP1561765A4 (en) * 2002-11-08 2007-07-04 Mitsubishi Chem Corp Radiation curing resin composition and cured product thereof
KR100725432B1 (en) * 2003-03-06 2007-06-07 닛뽄 가야쿠 가부시키가이샤 Photosensitive resin composition and curing product thereof
JP4267974B2 (en) * 2003-07-10 2009-05-27 日本メクトロン株式会社 Circuit board and manufacturing method thereof
US20070172742A1 (en) * 2004-02-13 2007-07-26 Kentarou Yachi Volume hologram recording material and volume hologram recording medium
JP4587865B2 (en) * 2004-04-22 2010-11-24 昭和電工株式会社 Photosensitive resin composition, cured product thereof, and method for producing printed wiring board using them
JP4509638B2 (en) * 2004-04-26 2010-07-21 東京応化工業株式会社 Photosensitive resin composition and photosensitive dry film using the same
TW200613903A (en) * 2004-05-26 2006-05-01 Showa Denko Kk Photosensitive resin composition, and cured product and use thereof
EP1802674A1 (en) * 2004-09-21 2007-07-04 Showa Denko K.K. Heat-curable urethane resin composition
TW200630447A (en) * 2004-11-19 2006-09-01 Showa Denko Kk Resin cured film for flexible printed wiring board and production process thereof
TWI388584B (en) * 2005-03-04 2013-03-11 Showa Denko Kk The film is formed with a paste
TW200710115A (en) * 2005-05-16 2007-03-16 Showa Denko Kk Carboxy group-containing polyurethane, thermosetting resin composition and their use
KR101307124B1 (en) * 2005-08-03 2013-09-10 도아고세이가부시키가이샤 Photosensitive resin composition, composition for solder resist, and photosensitive dry film
US20090163615A1 (en) * 2005-08-31 2009-06-25 Izhar Halahmi Uv curable hybridcuring ink jet ink composition and solder mask using the same
WO2007043240A1 (en) * 2005-10-07 2007-04-19 Hitachi Chemical Company, Ltd. Photosensitive resin composition and photosensitive element using the same
JP5265854B2 (en) * 2005-12-08 2013-08-14 昭和電工株式会社 Thermosetting resin composition, thermoplastic resin solution and film forming material, and cured products thereof
CN101400716B (en) * 2006-03-16 2012-06-06 昭和电工株式会社 Heat curable resin composition, overcoating agent for flexible circuit board, and surface protective film
KR100827312B1 (en) * 2006-10-02 2008-05-06 삼성전기주식회사 Method for manufacturing cover lay of Printed Circuit Board
DE102007001862A1 (en) * 2007-01-12 2008-07-17 Clariant International Ltd. Flame retardant resin formulation and its use
KR100957024B1 (en) * 2007-10-04 2010-05-13 주식회사 엘지화학 Ink Composition for Color-Filter and Color-Filter
JP5186556B2 (en) * 2008-04-14 2013-04-17 昭和電工株式会社 Cured film and method for producing the same
JP5548406B2 (en) * 2008-08-22 2014-07-16 東京応化工業株式会社 Positive resist composition, resist pattern forming method, polymer compound
KR101033827B1 (en) * 2008-11-25 2011-05-13 금호석유화학 주식회사 Curable resin composition, flat panel display having cured product from the same and method of manufacturing flat panel display
CN102612665B (en) * 2009-11-26 2014-07-30 木本股份有限公司 Thermosetting protective solution for glass mask, and glass mask
JP5470053B2 (en) 2010-01-05 2014-04-16 東京応化工業株式会社 Positive resist composition and resist pattern forming method
JP5731229B2 (en) * 2010-08-20 2015-06-10 株式会社タムラ製作所 Alkali-soluble transparent resin composition
JP2013082863A (en) * 2011-09-26 2013-05-09 Asahi Kasei Chemicals Corp Water-dispersible urethane (meth)acrylate and coating composition
JP6002378B2 (en) 2011-11-24 2016-10-05 東京応化工業株式会社 Method for producing polymer compound
JP5964608B2 (en) * 2012-02-20 2016-08-03 株式会社タムラ製作所 UV curable transparent resin composition
US8795947B2 (en) 2012-03-22 2014-08-05 Tokyo Ohka Kogyo Co., Ltd. Resist composition and method of forming resist pattern
US8795948B2 (en) 2012-03-22 2014-08-05 Tokyo Ohka Kogyo Co., Ltd. Resist composition, method of forming resist pattern and polymeric compound
CN103118449B (en) * 2013-01-31 2015-09-30 深圳市景旺电子股份有限公司 A kind of method and pcb board utilizing anti-welding dry film making pcb board
KR101423223B1 (en) * 2013-09-03 2014-07-24 주식회사 비엠솔루션 UV resin for forming a UV pattern layer of a window for protecting a pannel
JP6515806B2 (en) * 2014-06-12 2019-05-22 三菱ケミカル株式会社 Active energy ray-curable resin composition, resin molded article and method for producing resin molded article
CN104152030A (en) * 2014-06-30 2014-11-19 永利电子铜陵有限公司 Hot steam corrosion resisting tri-proof paint for printed circuit boards
CN104193944A (en) * 2014-08-21 2014-12-10 苏州瑞红电子化学品有限公司 Controllable-acid-value photosensitive alkali-soluble polyurethane acrylate resin and photoresist composition thereof
JP6986340B2 (en) * 2016-08-29 2021-12-22 株式会社タムラ製作所 Manufacturing method of printed wiring board and printed wiring board
CN107172804B (en) * 2017-07-11 2023-12-26 昆山倬跃蓝天电子科技有限公司 Photosensitive covering film and product
CN109613800B (en) * 2019-01-28 2020-09-01 深圳市华星光电技术有限公司 Negative photoresist material and color filter
CN114874650B (en) * 2022-05-17 2023-08-04 广东希贵光固化材料有限公司 UV (ultraviolet) coating for PCB (printed circuit board) drilling wood backing plate

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5089376A (en) * 1986-12-08 1992-02-18 Armstrong World Industries, Inc. Photoimagable solder mask coating
US5006436A (en) 1988-09-20 1991-04-09 Atochem North America, Inc. UV curable compositions for making tentable solder mask coating
JPH03191352A (en) * 1989-12-15 1991-08-21 W R Grace & Co Photosensitive resin composite
DE69227982T2 (en) * 1991-11-01 1999-05-12 Macdermid Imaging Technology Inc., Waterbury, Conn. Plasticizers containing carboxyl groups in photopolymerizable dry film compositions
JPH06295060A (en) * 1992-10-29 1994-10-21 Ajinomoto Co Inc Photosensitive resin composition or photosensitive thermosetting resin composition, and photosolder resist composition using these
TW475098B (en) * 1995-10-27 2002-02-01 Tokyo Ohka Kogyo Co Ltd Photosensitive resin composition and photosensitive resin laminated film containing the same
EP1008911A1 (en) * 1998-12-11 2000-06-14 Shipley Company LLC Photoimageable compositions having improved flexibility and stripping ability
CA2365144A1 (en) 1999-03-19 2000-09-28 Nippon Kayaku Kabushiki Kaisha Urethane oligomer, resin compositions thereof, and cured article thereof
US6268111B1 (en) 1999-10-20 2001-07-31 Rohm And Haas Company Photoimageable composition having photopolymerizeable binder oligomer
CN1282036C (en) * 2001-07-04 2006-10-25 昭和电工株式会社 Resist curable resin composition and cured article thereof

Also Published As

Publication number Publication date
CN1306338C (en) 2007-03-21
KR20030008212A (en) 2003-01-24
WO2002023273A3 (en) 2002-06-27
US6818382B2 (en) 2004-11-16
US20030003398A1 (en) 2003-01-02
CN1392971A (en) 2003-01-22
EP1317691A2 (en) 2003-06-11
KR100515218B1 (en) 2005-09-16
WO2002023273A2 (en) 2002-03-21

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