AU2002224832A1 - Positive type photosensitive epoxy resin composition and printed circuit board using the same - Google Patents

Positive type photosensitive epoxy resin composition and printed circuit board using the same

Info

Publication number
AU2002224832A1
AU2002224832A1 AU2002224832A AU2483202A AU2002224832A1 AU 2002224832 A1 AU2002224832 A1 AU 2002224832A1 AU 2002224832 A AU2002224832 A AU 2002224832A AU 2483202 A AU2483202 A AU 2483202A AU 2002224832 A1 AU2002224832 A1 AU 2002224832A1
Authority
AU
Australia
Prior art keywords
circuit board
resin composition
printed circuit
epoxy resin
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002224832A
Inventor
Yasuharu Nojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huntsman Advanced Materials Switzerland GmbH
Original Assignee
Vantico GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vantico GmbH filed Critical Vantico GmbH
Publication of AU2002224832A1 publication Critical patent/AU2002224832A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Materials For Photolithography (AREA)
AU2002224832A 2000-11-15 2001-11-06 Positive type photosensitive epoxy resin composition and printed circuit board using the same Abandoned AU2002224832A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP00811080 2000-11-15
EP00811080.1 2000-11-15
PCT/EP2001/012819 WO2002041079A2 (en) 2000-11-15 2001-11-06 Positive type photosensitive epoxy resin composition and printed circuit board using the same

Publications (1)

Publication Number Publication Date
AU2002224832A1 true AU2002224832A1 (en) 2002-05-27

Family

ID=8175030

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002224832A Abandoned AU2002224832A1 (en) 2000-11-15 2001-11-06 Positive type photosensitive epoxy resin composition and printed circuit board using the same

Country Status (10)

Country Link
US (2) US7097958B2 (en)
EP (1) EP1350140A2 (en)
JP (1) JP4071106B2 (en)
KR (1) KR100789733B1 (en)
CN (1) CN1232885C (en)
AU (1) AU2002224832A1 (en)
CA (1) CA2427923A1 (en)
MY (1) MY129757A (en)
TW (1) TWI228639B (en)
WO (1) WO2002041079A2 (en)

Families Citing this family (33)

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JP4006618B2 (en) * 2001-09-26 2007-11-14 日鉱金属株式会社 Manufacturing method of copper foil with carrier and printed board using copper foil with carrier
US7226724B2 (en) * 2003-11-10 2007-06-05 Think Laboratory Co., Ltd. Positive-type photosensitive composition
CN1896870B (en) * 2005-07-15 2010-12-01 乐凯集团第二胶片厂 Positive PS-process photosensitive coating liquid for high-speed vehicle coating
US7972761B2 (en) * 2006-08-04 2011-07-05 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist materials and photolithography process
KR101290041B1 (en) * 2005-08-19 2013-07-30 제이에스알 가부시끼가이샤 Positive Type Photosensitive Insulating Resin Composition, and Cured Product and Electronic Component Produced Therefrom
JP4997937B2 (en) * 2005-12-05 2012-08-15 日立化成工業株式会社 Curable resin composition, and prepreg and multilayer printed wiring board using the same
CN100400592C (en) * 2006-12-08 2008-07-09 浙江大学 Fire tetardant no-halogen epoxy resin glue and its prepn process and use
CN101616949B (en) * 2007-02-23 2014-01-01 松下电器产业株式会社 Epoxy resin composition, prepreg, laminates and printed wiring boards
TWI350944B (en) * 2007-08-03 2011-10-21 Univ Yuan Ze Photoresist and a pattern-forming process using the same
KR100877342B1 (en) * 2007-09-13 2009-01-07 삼성전기주식회사 Flame retardant resin composition for printed circuit board, printed circuit board using the same and manufacturing method thereof
PT2221666E (en) * 2007-11-12 2013-10-31 Hitachi Chemical Co Ltd Positive-type photosensitive resin composition, method for production of resist pattern, and semiconductor device
US20090162797A1 (en) * 2007-12-19 2009-06-25 Canon Kabushiki Kaisha Method of manufacturing liquid ejection head
JP4825848B2 (en) * 2008-07-11 2011-11-30 東芝電子管デバイス株式会社 Reflective film composition, reflective film, and X-ray detector
CN105694001A (en) * 2008-08-12 2016-06-22 亨斯迈先进材料（瑞士）有限公司 Thermosetting composition
JP5417799B2 (en) * 2008-10-30 2014-02-19 日立化成株式会社 Thermosetting resin composition, and prepreg and laminate using the same
US9093448B2 (en) 2008-11-25 2015-07-28 Lord Corporation Methods for protecting a die surface with photocurable materials
WO2010068488A1 (en) * 2008-11-25 2010-06-17 Lord Corporation Methods for protecting a die surface with photocurable materials
KR20120126088A (en) * 2010-01-27 2012-11-20 다우 글로벌 테크놀로지스 엘엘씨 A multilayer structure, and a method for making the same
CN102372903B (en) * 2010-08-18 2014-04-16 合正科技股份有限公司 Halogen-free phosphorus-free thermosetting resin composition
TWI481657B (en) 2010-09-15 2015-04-21 Asahi Kasei E Materials Corp A phenol resin composition and a hardened embossed pattern, and a method for manufacturing the semiconductor
US20120095132A1 (en) * 2010-10-19 2012-04-19 Chung-Hao Chang Halogen- and phosphorus-free thermosetting resin composition
JP5806493B2 (en) * 2011-03-31 2015-11-10 太陽インキ製造株式会社 Positive photosensitive resin composition, dry film, cured product, and printed wiring board
SI2679605T1 (en) * 2012-06-29 2016-02-29 Evonik Degussa Gmbh Polybutadiene with epoxy groups
KR101956273B1 (en) * 2013-08-13 2019-03-08 삼성전기주식회사 Resin composition, printed circuit board using the composition, and preparing method thereof
DE102013225703A1 (en) 2013-12-12 2015-06-18 Evonik Industries Ag Epoxy-terminated polybutadiene as an oxygen scavenger
JP5876182B1 (en) * 2014-09-30 2016-03-02 太陽インキ製造株式会社 Curable resin composition, dry film and cured product thereof, and printed wiring board having the same
JP6011745B2 (en) * 2014-10-01 2016-10-19 Dic株式会社 Epoxy resin composition and cured product thereof
JP6380146B2 (en) * 2015-02-06 2018-08-29 Jsr株式会社 Resin composition for pattern formation, insulating film, method for forming the same, and display element
JP6230562B2 (en) * 2015-04-13 2017-11-15 太陽インキ製造株式会社 Positive photosensitive resin composition, dry film, cured product, and printed wiring board
CN105282982A (en) * 2015-11-24 2016-01-27 悦虎电路(苏州)有限公司 Photosensitive preparation method of holes
JP6694180B2 (en) * 2016-01-29 2020-05-13 日東電工株式会社 Photosensitive epoxy resin composition for forming optical waveguide, photosensitive film for forming optical waveguide, optical waveguide using the same, and mixed flexible printed wiring board for optical / electrical transmission
JP6702251B2 (en) * 2017-04-17 2020-05-27 信越化学工業株式会社 Positive resist film laminate and pattern forming method
CN109283791B (en) * 2018-10-22 2021-09-28 北京欣奕华科技有限公司 Negative colored photosensitive resin composition, optical filter, and liquid crystal display device

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0127689B1 (en) * 1983-05-19 1987-08-26 Ibm Deutschland Gmbh Process for manufacturing printed circuits with metallic conductor patterns embedded in the isolating substrate
EP0295211B1 (en) 1987-06-12 1994-03-16 Ciba-Geigy Ag Photoresist composition
JPH05136575A (en) 1991-11-14 1993-06-01 Hitachi Ltd Manufacture of multilayer printed board and photosetting interlayer insulating film thereof
JPH08236945A (en) 1994-12-02 1996-09-13 Nippon Paint Co Ltd Manufacture of multilayered substrate
JPH0940751A (en) 1995-07-27 1997-02-10 Taiyo Ink Mfg Ltd Impact-resistant insulating resin composition
US5955184A (en) * 1995-09-29 1999-09-21 Toshiba Chemical Corporation Halogen-free flame-retardant epoxy resin composition as well as prepreg and laminate containing the same
KR100489918B1 (en) 1996-05-09 2005-08-04 어플라이드 머티어리얼스, 인코포레이티드 Coils for generating a plasma and for sputtering
JPH1036682A (en) 1996-07-18 1998-02-10 Asahi Chem Res Lab Ltd Curing resin composition, production of multilayer printed wiring board therefrom, and multilayer printed wiring board produced thereby
JPH10173336A (en) 1996-12-06 1998-06-26 Sumitomo Bakelite Co Ltd Photosensitive additive adhesive composition
JP4117690B2 (en) 1996-12-26 2008-07-16 味の素株式会社 Method for producing multilayer printed wiring board using adhesive film for multilayer printed wiring board
JP3785749B2 (en) * 1997-04-17 2006-06-14 味の素株式会社 Epoxy resin composition and method for producing multilayer printed wiring board using the composition
JPH1130855A (en) 1997-07-11 1999-02-02 Fujitsu Ltd Photosensitive resin composition
CA2243727A1 (en) * 1998-01-30 1999-07-30 James J. Briguglio Positive-tone photoimageable crosslinkable coating
US6168898B1 (en) * 1998-02-17 2001-01-02 Isola Laminate Systems Corp. Positive acting photodielectric composition
JPH11343398A (en) * 1998-03-31 1999-12-14 Hitachi Chem Co Ltd Flame retardant epoxy resin composition, and prepreg, laminate for electrical wiring board and metallic foil with resin using the composition
JP3714399B2 (en) * 2000-06-19 2005-11-09 信越化学工業株式会社 Epoxy resin composition for semiconductor encapsulation and semiconductor device

Also Published As

Publication number Publication date
CN1232885C (en) 2005-12-21
WO2002041079A3 (en) 2002-08-01
EP1350140A2 (en) 2003-10-08
CN1474961A (en) 2004-02-11
WO2002041079A2 (en) 2002-05-23
US20040043327A1 (en) 2004-03-04
KR100789733B1 (en) 2008-01-02
US7097958B2 (en) 2006-08-29
CA2427923A1 (en) 2002-05-23
JP2004514173A (en) 2004-05-13
US20060240356A1 (en) 2006-10-26
TWI228639B (en) 2005-03-01
KR20040004392A (en) 2004-01-13
US7378228B2 (en) 2008-05-27
MY129757A (en) 2007-04-30
JP4071106B2 (en) 2008-04-02

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