AU2001266324A1 - Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board - Google Patents

Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board

Info

Publication number
AU2001266324A1
AU2001266324A1 AU2001266324A AU6632401A AU2001266324A1 AU 2001266324 A1 AU2001266324 A1 AU 2001266324A1 AU 2001266324 A AU2001266324 A AU 2001266324A AU 6632401 A AU6632401 A AU 6632401A AU 2001266324 A1 AU2001266324 A1 AU 2001266324A1
Authority
AU
Australia
Prior art keywords
producing
circuit board
resin composition
printed circuit
resist pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001266324A
Inventor
Tomoaki Aoki
Masaki Endou
Kenji Kamio
Noriyo Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of AU2001266324A1 publication Critical patent/AU2001266324A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
AU2001266324A 2000-06-22 2001-06-22 Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board Abandoned AU2001266324A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000187819 2000-06-22
JP2000-187819 2000-06-22
PCT/JP2001/005357 WO2001098832A1 (en) 2000-06-22 2001-06-22 Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board

Publications (1)

Publication Number Publication Date
AU2001266324A1 true AU2001266324A1 (en) 2002-01-02

Family

ID=18687725

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001266324A Abandoned AU2001266324A1 (en) 2000-06-22 2001-06-22 Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board

Country Status (7)

Country Link
US (1) US7067228B2 (en)
JP (3) JP4779284B2 (en)
KR (1) KR100537085B1 (en)
CN (1) CN1221860C (en)
AU (1) AU2001266324A1 (en)
TW (1) TWI240149B (en)
WO (1) WO2001098832A1 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2001266324A1 (en) * 2000-06-22 2002-01-02 Hitachi Chemical Co. Ltd. Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board
KR100578987B1 (en) * 2000-09-27 2006-05-12 히다치 가세고교 가부시끼가이샤 Resist pattern, process for producing the same, and utilization thereof
US7005143B2 (en) * 2002-04-12 2006-02-28 3M Innovative Properties Company Gel materials, medical articles, and methods
KR100521999B1 (en) * 2002-09-03 2005-10-18 주식회사 코오롱 Photopolymerizable Resin Composition For Sandblast Resist
CA2527362A1 (en) * 2003-06-06 2004-12-16 Basf Aktiengesellschaft (meth)acrylic ester for alkylenylene glycol and the use thereof
WO2006025092A1 (en) * 2004-08-30 2006-03-09 Hitachi Chemical Co., Ltd. Photosensitive film
JP4315892B2 (en) * 2004-11-25 2009-08-19 東京応化工業株式会社 Photosensitive resin composition and photosensitive dry film using the same
JP4764668B2 (en) * 2005-07-05 2011-09-07 セイコーエプソン株式会社 Electronic substrate manufacturing method and electronic substrate
KR101190945B1 (en) * 2005-10-25 2012-10-12 히다치 가세고교 가부시끼가이샤 Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board
US8501392B2 (en) * 2006-04-18 2013-08-06 Hitachi Chemical Company, Ltd. Photosensitive element, method for formation of resist pattern, and method for production of print circuit board
JP4711886B2 (en) * 2006-05-26 2011-06-29 富士フイルム株式会社 Photosensitive composition, photosensitive film and printed circuit board
KR101168828B1 (en) * 2006-12-27 2012-07-25 히다치 가세고교 가부시끼가이샤 Photosensitⅳe resin composition, photosensitⅳe element, method for resist pattern formation, and method for manufacturing printed wiring board
KR100974790B1 (en) * 2009-11-03 2010-08-06 강법식 Device for filling of bar rice cake
JP5935271B2 (en) * 2010-09-22 2016-06-15 Dic株式会社 Film for thermal transfer and method for producing the same
JP6358094B2 (en) * 2012-11-20 2018-07-18 日立化成株式会社 Photosensitive resin composition, photosensitive element, resist pattern forming method and printed wiring board manufacturing method
KR102458628B1 (en) * 2014-05-13 2022-10-26 쇼와덴코머티리얼즈가부시끼가이샤 Photosensitive resin composition, photosensitive element, method for forming resist pattern, and process for producing printed wiring board
KR102595962B1 (en) * 2014-11-17 2023-11-01 가부시끼가이샤 레조낙 Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board
CN104834182B (en) * 2015-05-20 2019-05-03 杭州福斯特应用材料股份有限公司 A kind of photosensitive dry film with high-resolution and excellent masking hole performance

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2548016B2 (en) * 1986-09-09 1996-10-30 旭化成工業株式会社 Photopolymerizable laminate
JP2880775B2 (en) * 1990-08-01 1999-04-12 旭化成工業株式会社 Photopolymerizable composition and photopolymerizable laminate
JPH05341527A (en) * 1992-06-12 1993-12-24 Hitachi Chem Co Ltd Photosensitive resin composition and photosensitive element using same
JPH06242603A (en) 1993-02-15 1994-09-02 Hitachi Chem Co Ltd Photosensitive resin composition and photosensitive resin element using the same
JP3458000B2 (en) * 1994-05-26 2003-10-20 旭化成株式会社 Photopolymerizable resin composition
JP3368987B2 (en) * 1994-06-02 2003-01-20 日立化成工業株式会社 Photosensitive resin composition and photosensitive element using the same
JP3415928B2 (en) * 1994-06-09 2003-06-09 日立化成工業株式会社 Photosensitive resin composition and photosensitive film using the same
JP3362095B2 (en) * 1996-03-27 2003-01-07 日立化成工業株式会社 Photosensitive resin composition, photosensitive element using the same, laminating method, laminated substrate and curing method
JP3469066B2 (en) * 1997-10-27 2003-11-25 日立化成工業株式会社 Photopolymerizable composition and photopolymerizable laminate
JP3281307B2 (en) * 1997-12-24 2002-05-13 日立化成工業株式会社 Photosensitive resin composition, photosensitive element using the same, method of laminating layers of photosensitive resin composition, layered substrate of photosensitive resin composition layer, and method of curing layer of photosensitive resin composition
JP4002658B2 (en) * 1998-02-04 2007-11-07 日本合成化学工業株式会社 Resist pattern forming method
US5922509A (en) 1998-03-18 1999-07-13 Morton International, Inc. Photoimageable compositions having improved stripping properties in aqueous alkaline solutions
JP2001159817A (en) * 1999-12-03 2001-06-12 Hitachi Chem Co Ltd Photosensitive resin composition, photosensitive element using same, method for producing resist pattern and method for producing printed wiring board
AU2001266324A1 (en) * 2000-06-22 2002-01-02 Hitachi Chemical Co. Ltd. Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board

Also Published As

Publication number Publication date
JP2011128629A (en) 2011-06-30
JP4983985B2 (en) 2012-07-25
US7067228B2 (en) 2006-06-27
WO2001098832A1 (en) 2001-12-27
JP4779284B2 (en) 2011-09-28
KR100537085B1 (en) 2005-12-16
TWI240149B (en) 2005-09-21
CN1437716A (en) 2003-08-20
CN1221860C (en) 2005-10-05
US20040101777A1 (en) 2004-05-27
JP4900514B2 (en) 2012-03-21
JP2011123505A (en) 2011-06-23
KR20030076239A (en) 2003-09-26

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