AU2002217554A1 - Photosensitive resin composition and printed wiring boards - Google Patents

Photosensitive resin composition and printed wiring boards

Info

Publication number
AU2002217554A1
AU2002217554A1 AU2002217554A AU2002217554A AU2002217554A1 AU 2002217554 A1 AU2002217554 A1 AU 2002217554A1 AU 2002217554 A AU2002217554 A AU 2002217554A AU 2002217554 A AU2002217554 A AU 2002217554A AU 2002217554 A1 AU2002217554 A1 AU 2002217554A1
Authority
AU
Australia
Prior art keywords
resin composition
printed wiring
photosensitive resin
wiring boards
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002217554A
Inventor
Yuan Chien Lin
Toru Nakada
Kazunori Nishio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of AU2002217554A1 publication Critical patent/AU2002217554A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/064—Polymers containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1494—Polycondensates modified by chemical after-treatment followed by a further chemical treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4292—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with monocarboxylic acids
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Materials For Photolithography (AREA)
AU2002217554A 2001-12-28 2001-12-28 Photosensitive resin composition and printed wiring boards Abandoned AU2002217554A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2001/011645 WO2003059975A1 (en) 2001-12-28 2001-12-28 Photosensitive resin composition and printed wiring boards

Publications (1)

Publication Number Publication Date
AU2002217554A1 true AU2002217554A1 (en) 2003-07-30

Family

ID=11738097

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002217554A Abandoned AU2002217554A1 (en) 2001-12-28 2001-12-28 Photosensitive resin composition and printed wiring boards

Country Status (4)

Country Link
JP (1) JPWO2003059975A1 (en)
AU (1) AU2002217554A1 (en)
TW (1) TWI263115B (en)
WO (1) WO2003059975A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4649212B2 (en) * 2005-01-07 2011-03-09 太陽ホールディングス株式会社 Photo-curable thermosetting one-component solder resist composition and printed wiring board using the same
CN101663617B (en) 2007-04-24 2013-05-08 三井化学株式会社 Photosensitive resin composition, dry film, and processed work made with the same
JP5238342B2 (en) * 2008-05-07 2013-07-17 太陽ホールディングス株式会社 Thermosetting resin composition for hole filling of printed wiring board and printed wiring board using the same
JP5814691B2 (en) * 2011-08-11 2015-11-17 互応化学工業株式会社 Resin resin composition
CN103324029B (en) 2012-03-23 2016-01-13 太阳油墨（苏州）有限公司 Photosensitive polymer combination and solidfied material thereof and printed circuit board (PCB)
JP5797680B2 (en) * 2013-03-04 2015-10-21 株式会社タムラ製作所 Active energy ray-curable resin composition
ES2834740T3 (en) * 2016-05-13 2021-06-18 Nanya Plastics Corp Low Dk / Df Solder Resistant Composition Used for Printed Circuit Board
US10527936B2 (en) 2016-06-17 2020-01-07 Nan Ya Plastics Corporation Low Dk/Df solder resistant composition use for printed circuit board

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0823694B2 (en) * 1988-08-04 1996-03-06 富士写真フイルム株式会社 Liquid photosensitive resin composition
JPH04151158A (en) * 1990-05-18 1992-05-25 Arakawa Chem Ind Co Ltd Alkali development type liquid photosolder-resist ink composition
JPH04166944A (en) * 1990-10-31 1992-06-12 Mitsubishi Kasei Corp Photosensitive resin composition
JPH0767008B2 (en) * 1991-09-21 1995-07-19 太陽インキ製造株式会社 Solder resist pattern forming method
JPH06107752A (en) * 1992-10-01 1994-04-19 Daicel Chem Ind Ltd Curable resin composition
JPH06332170A (en) * 1993-05-20 1994-12-02 Unitika Ltd Resist ink composition
JPH10274849A (en) * 1997-03-31 1998-10-13 Nikka Chem Co Ltd Solder photoresist ink composition
JP2000109541A (en) * 1998-10-06 2000-04-18 Nippon Poritekku Kk Photosensitive and thermosetting resin composition

Also Published As

Publication number Publication date
WO2003059975A1 (en) 2003-07-24
JPWO2003059975A1 (en) 2005-05-19
TWI263115B (en) 2006-10-01

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase