JP2871800B2 - ハイブリツド半導体ストラクチヤの製造法および合成ハイブリツド半導体ストラクチヤ - Google Patents

ハイブリツド半導体ストラクチヤの製造法および合成ハイブリツド半導体ストラクチヤ

Info

Publication number
JP2871800B2
JP2871800B2 JP2089258A JP8925890A JP2871800B2 JP 2871800 B2 JP2871800 B2 JP 2871800B2 JP 2089258 A JP2089258 A JP 2089258A JP 8925890 A JP8925890 A JP 8925890A JP 2871800 B2 JP2871800 B2 JP 2871800B2
Authority
JP
Japan
Prior art keywords
substrate
layer
pad
pads
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2089258A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0318040A (ja
Inventor
デイーター・ザイプラー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JPH0318040A publication Critical patent/JPH0318040A/ja
Application granted granted Critical
Publication of JP2871800B2 publication Critical patent/JP2871800B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W72/00—
    • H10W20/4473—
    • H10W70/09—
    • H10W74/012—
    • H10W74/15—
    • H10W70/60—
    • H10W70/655—
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/073—
    • H10W72/07331—
    • H10W72/20—
    • H10W72/252—
    • H10W72/325—
    • H10W72/351—
    • H10W72/352—
    • H10W72/354—
    • H10W72/856—
    • H10W90/724—

Landscapes

  • Wire Bonding (AREA)
JP2089258A 1989-04-05 1990-04-05 ハイブリツド半導体ストラクチヤの製造法および合成ハイブリツド半導体ストラクチヤ Expired - Fee Related JP2871800B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE3910910 1989-04-05
DE3910910.0 1989-04-05
US452110 1989-12-14
US3910910.0 1989-12-14
US07/452,110 US5068714A (en) 1989-04-05 1989-12-14 Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made

Publications (2)

Publication Number Publication Date
JPH0318040A JPH0318040A (ja) 1991-01-25
JP2871800B2 true JP2871800B2 (ja) 1999-03-17

Family

ID=25879520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2089258A Expired - Fee Related JP2871800B2 (ja) 1989-04-05 1990-04-05 ハイブリツド半導体ストラクチヤの製造法および合成ハイブリツド半導体ストラクチヤ

Country Status (4)

Country Link
US (1) US5068714A (OSRAM)
JP (1) JP2871800B2 (OSRAM)
KR (1) KR100196242B1 (OSRAM)
DE (1) DE4008624A1 (OSRAM)

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JP3781610B2 (ja) * 2000-06-28 2006-05-31 株式会社東芝 半導体装置
DE10046296C2 (de) * 2000-07-17 2002-10-10 Infineon Technologies Ag Elektronisches Chipbauteil mit einer integrierten Schaltung und Verfahren zu seiner Herstellung
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Also Published As

Publication number Publication date
KR100196242B1 (ko) 1999-06-15
KR900017160A (ko) 1990-11-15
US5068714A (en) 1991-11-26
JPH0318040A (ja) 1991-01-25
DE4008624A1 (de) 1990-10-11
DE4008624C2 (OSRAM) 1992-04-16

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