DE4008624C2 - - Google Patents

Info

Publication number
DE4008624C2
DE4008624C2 DE4008624A DE4008624A DE4008624C2 DE 4008624 C2 DE4008624 C2 DE 4008624C2 DE 4008624 A DE4008624 A DE 4008624A DE 4008624 A DE4008624 A DE 4008624A DE 4008624 C2 DE4008624 C2 DE 4008624C2
Authority
DE
Germany
Prior art keywords
pads
substrate
insulating layer
substrates
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE4008624A
Other languages
German (de)
English (en)
Other versions
DE4008624A1 (de
Inventor
Dieter Dipl.-Phys. Dr. 7410 Reutlingen De Seipler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE4008624A priority Critical patent/DE4008624A1/de
Publication of DE4008624A1 publication Critical patent/DE4008624A1/de
Application granted granted Critical
Publication of DE4008624C2 publication Critical patent/DE4008624C2/de
Granted legal-status Critical Current

Links

Classifications

    • H10W72/00—
    • H10W20/4473—
    • H10W70/09—
    • H10W74/012—
    • H10W74/15—
    • H10W70/60—
    • H10W70/655—
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/073—
    • H10W72/07331—
    • H10W72/20—
    • H10W72/252—
    • H10W72/325—
    • H10W72/351—
    • H10W72/352—
    • H10W72/354—
    • H10W72/856—
    • H10W90/724—

Landscapes

  • Wire Bonding (AREA)
DE4008624A 1989-04-05 1990-03-17 Verfahren zur herstellung einer hybriden halbleiterstruktur und nach dem verfahren hergestellte halbleiterstruktur Granted DE4008624A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE4008624A DE4008624A1 (de) 1989-04-05 1990-03-17 Verfahren zur herstellung einer hybriden halbleiterstruktur und nach dem verfahren hergestellte halbleiterstruktur

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE3910910 1989-04-05
US07/452,110 US5068714A (en) 1989-04-05 1989-12-14 Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made
DE4008624A DE4008624A1 (de) 1989-04-05 1990-03-17 Verfahren zur herstellung einer hybriden halbleiterstruktur und nach dem verfahren hergestellte halbleiterstruktur

Publications (2)

Publication Number Publication Date
DE4008624A1 DE4008624A1 (de) 1990-10-11
DE4008624C2 true DE4008624C2 (OSRAM) 1992-04-16

Family

ID=25879520

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4008624A Granted DE4008624A1 (de) 1989-04-05 1990-03-17 Verfahren zur herstellung einer hybriden halbleiterstruktur und nach dem verfahren hergestellte halbleiterstruktur

Country Status (4)

Country Link
US (1) US5068714A (OSRAM)
JP (1) JP2871800B2 (OSRAM)
KR (1) KR100196242B1 (OSRAM)
DE (1) DE4008624A1 (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10046296A1 (de) * 2000-07-17 2002-02-07 Infineon Technologies Ag Elektronisches Chipbauteil mit einer integrierten Schaltung und Verfahren zur Herstellung

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MXPA02006735A (es) * 2000-01-13 2002-10-11 Uv Specialties Inc Composiciones ferromagneticas que se pueden curar con luz uv.
JP2001217279A (ja) * 2000-02-01 2001-08-10 Mitsubishi Electric Corp 高密度実装装置
US6555414B1 (en) * 2000-02-09 2003-04-29 Interuniversitair Microelektronica Centrum, Vzw Flip-chip assembly of semiconductor devices using adhesives
JP3781610B2 (ja) * 2000-06-28 2006-05-31 株式会社東芝 半導体装置
US7323499B2 (en) 2000-09-06 2008-01-29 Allied Photochemical, Inc. UV curable silver chloride compositions for producing silver coatings
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US6704165B2 (en) * 2001-06-08 2004-03-09 Seagate Technology Llc Attachment of a head-gimbal assembly to a printed circuit board actuator arm using Z-axis conductive adhesive film
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US7495179B2 (en) * 2003-10-06 2009-02-24 Tessera, Inc. Components with posts and pads
US7709968B2 (en) * 2003-12-30 2010-05-04 Tessera, Inc. Micro pin grid array with pin motion isolation
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JP4712633B2 (ja) * 2005-08-04 2011-06-29 株式会社リコー 自動原稿搬送装置
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TWI892323B (zh) 2016-10-27 2025-08-01 美商艾德亞半導體科技有限責任公司 用於低溫接合的結構和方法
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10046296A1 (de) * 2000-07-17 2002-02-07 Infineon Technologies Ag Elektronisches Chipbauteil mit einer integrierten Schaltung und Verfahren zur Herstellung
DE10046296C2 (de) * 2000-07-17 2002-10-10 Infineon Technologies Ag Elektronisches Chipbauteil mit einer integrierten Schaltung und Verfahren zu seiner Herstellung

Also Published As

Publication number Publication date
KR100196242B1 (ko) 1999-06-15
KR900017160A (ko) 1990-11-15
US5068714A (en) 1991-11-26
JPH0318040A (ja) 1991-01-25
DE4008624A1 (de) 1990-10-11
JP2871800B2 (ja) 1999-03-17

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee