JP2700172B2 - パターンを有するストリップの連続組み立て方法及び装置 - Google Patents

パターンを有するストリップの連続組み立て方法及び装置

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Publication number
JP2700172B2
JP2700172B2 JP4506021A JP50602192A JP2700172B2 JP 2700172 B2 JP2700172 B2 JP 2700172B2 JP 4506021 A JP4506021 A JP 4506021A JP 50602192 A JP50602192 A JP 50602192A JP 2700172 B2 JP2700172 B2 JP 2700172B2
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JP
Japan
Prior art keywords
strip
pattern
strips
press
plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP4506021A
Other languages
English (en)
Japanese (ja)
Other versions
JPH06500204A (ja
Inventor
ジャン ピエール グロトン，
ラロッシュ，ダミアン
トュラン，ジョエル
ファラ，ミシェル
Original Assignee
ジェムプリュス カード アンテルナショナル ソシエテ アノニム
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Application filed by ジェムプリュス カード アンテルナショナル ソシエテ アノニム filed Critical ジェムプリュス カード アンテルナショナル ソシエテ アノニム
Publication of JPH06500204A publication Critical patent/JPH06500204A/ja
Application granted granted Critical
Publication of JP2700172B2 publication Critical patent/JP2700172B2/ja
Anticipated expiration legal-status Critical
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    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1712—Indefinite or running length work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1712—Indefinite or running length work
    • Y10T156/1737—Discontinuous, spaced area, and/or patterned pressing

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  • Engineering & Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Laminated Bodies (AREA)
JP4506021A 1991-02-19 1992-02-18 パターンを有するストリップの連続組み立て方法及び装置 Expired - Fee Related JP2700172B2 (ja)

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JPH06500204A (ja) 1994-01-06
WO1992015118A1 (fr) 1992-09-03
DE69229168T2 (de) 1999-10-14
US5569879A (en) 1996-10-29
FR2673041A1 (fr) 1992-08-21
ES2133318T3 (es) 1999-09-16
CA2104374C (fr) 2003-07-08
US5470411A (en) 1995-11-28
EP0734063A2 (fr) 1996-09-25
EP0734063A3 (fr) 1997-01-29
FR2673041B1 (US07223432-20070529-C00017.png) 1997-02-28
EP0572514B1 (fr) 1999-05-12
JPH1070147A (ja) 1998-03-10
JP3238094B2 (ja) 2001-12-10
EP0572514A1 (fr) 1993-12-08
DE69229168D1 (de) 1999-06-17
CA2104374A1 (fr) 1992-08-20

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