FR2796203B1 - Module electronique sans contact et procede pour son obtention - Google Patents

Module electronique sans contact et procede pour son obtention

Info

Publication number
FR2796203B1
FR2796203B1 FR9909137A FR9909137A FR2796203B1 FR 2796203 B1 FR2796203 B1 FR 2796203B1 FR 9909137 A FR9909137 A FR 9909137A FR 9909137 A FR9909137 A FR 9909137A FR 2796203 B1 FR2796203 B1 FR 2796203B1
Authority
FR
France
Prior art keywords
electronic module
contactless electronic
obtaining same
obtaining
contactless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9909137A
Other languages
English (en)
Other versions
FR2796203A1 (fr
Inventor
Stephane Ayala
Gerard Bourneix
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Priority to FR9909137A priority Critical patent/FR2796203B1/fr
Priority to PCT/FR2000/001931 priority patent/WO2001004957A1/fr
Priority to AU62936/00A priority patent/AU6293600A/en
Publication of FR2796203A1 publication Critical patent/FR2796203A1/fr
Application granted granted Critical
Publication of FR2796203B1 publication Critical patent/FR2796203B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64Impedance arrangements
    • H01L23/645Inductive arrangements
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5388Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)
FR9909137A 1999-07-08 1999-07-08 Module electronique sans contact et procede pour son obtention Expired - Fee Related FR2796203B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR9909137A FR2796203B1 (fr) 1999-07-08 1999-07-08 Module electronique sans contact et procede pour son obtention
PCT/FR2000/001931 WO2001004957A1 (fr) 1999-07-08 2000-07-05 Module electronique sans contact et procede pour son obtention
AU62936/00A AU6293600A (en) 1999-07-08 2000-07-05 Contactless electronic module and method for obtaining same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9909137A FR2796203B1 (fr) 1999-07-08 1999-07-08 Module electronique sans contact et procede pour son obtention

Publications (2)

Publication Number Publication Date
FR2796203A1 FR2796203A1 (fr) 2001-01-12
FR2796203B1 true FR2796203B1 (fr) 2001-08-31

Family

ID=9548099

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9909137A Expired - Fee Related FR2796203B1 (fr) 1999-07-08 1999-07-08 Module electronique sans contact et procede pour son obtention

Country Status (3)

Country Link
AU (1) AU6293600A (fr)
FR (1) FR2796203B1 (fr)
WO (1) WO2001004957A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2002233232A1 (en) 2001-12-10 2003-06-23 Fractus, S.A. Contactless identification device
CN1723587A (zh) 2002-11-07 2006-01-18 碎云股份有限公司 含微型天线的集成电路封装
EP1771919A1 (fr) 2004-07-23 2007-04-11 Fractus, S.A. Antenne dans un boitier a interaction electromagnetique reduite avec des elements integres sur la puce
US8196829B2 (en) 2006-06-23 2012-06-12 Fractus, S.A. Chip module, sim card, wireless device and wireless communication method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2673041A1 (fr) * 1991-02-19 1992-08-21 Gemplus Card Int Procede de fabrication de micromodules de circuit integre et micromodule correspondant.
DE29521317U1 (de) * 1995-07-26 1997-02-20 Siemens AG, 80333 München Chipkarte

Also Published As

Publication number Publication date
FR2796203A1 (fr) 2001-01-12
WO2001004957A1 (fr) 2001-01-18
AU6293600A (en) 2001-01-30

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20100331