JP2020536402A - 低挿入損失rf伝送線路 - Google Patents
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
- C03C17/10—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals by deposition from the liquid phase
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- C03—GLASS; MINERAL OR SLAG WOOL
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- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
- C03C10/0009—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing silica as main constituent
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- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
- C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
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- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
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- C—CHEMISTRY; METALLURGY
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- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/40—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal all coatings being metal coatings
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- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/095—Glass compositions containing silica with 40% to 90% silica, by weight containing rare earths
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C4/00—Compositions for glass with special properties
- C03C4/04—Compositions for glass with special properties for photosensitive glass
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/003—Coplanar lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0153—Electrical filters; Controlling thereof
- H03H7/0161—Bandpass filters
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/38—Impedance-matching networks
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- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2214/00—Nature of the non-vitreous component
- C03C2214/08—Metals
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/11—Deposition methods from solutions or suspensions
- C03C2218/115—Deposition methods from solutions or suspensions electro-enhanced deposition
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H2007/013—Notch or bandstop filters
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Abstract
Description
なし
なし
Ce3++Ag+=Ce4++Ag0
Claims (30)
- 機械安定化RF伝送線路デバイスを作製する方法であって、
感光性ガラス基板に1又は2以上の伝送線路構造を形成する1又は2以上の構造を備える設計レイアウトをマスキングするステップと、
前記感光性ガラス基板の少なくとも1つの部分を活性化エネルギー源に露光するステップと、
前記感光性ガラス基板をそのガラス転移温度を超えて少なくとも10分間加熱するステップと、
前記感光性ガラス基板を冷却して、前記露光されたガラスの少なくとも一部をガラス結晶基板に変換するステップと、
前記ガラス結晶基板をエッチング液でエッチングして、電気伝導チャネルを伴う前記1又は2以上の伝送線路構造の前記設計レイアウト下に1又は2以上のトレンチ及び機械的支持体を形成するステップと、
前記1又は2以上の導電性伝送線路、接地面及び1又は2以上の入出力チャネルを形成する1又は2以上の金属又は金属媒体を印刷する又は堆積させるステップであって、前記金属が前記RF伝送線路デバイスを形成する回路網に接続され、且つ前記導電性伝送線路の少なくとも1つが前記機械的支持体によって機械的に支持されるステップとを含む、前記方法。 - デバイスが、金属又は金属媒体を伴う導電性伝送線路、接地面及び入出力チャネルのうち少なくとも1つの全部又は一部を覆う被覆又は蓋で覆われており、
前記金属又は金属媒体を接地に接続するステップをさらに含む、請求項1に記載の方法。 - 機械的支持体が、1又は2以上の導電性伝送線路の接触面積の100%以下である前記1又は2以上の導電性伝送線路下の低損失正接機械的及び熱安定化構造である、請求項1に記載の方法。
- 機械的支持体が、1又は2以上の導電性伝送線路の接触面積の50%未満の低損失正接機械的支持体である、請求項1に記載の方法。
- 機械的支持体が、1又は2以上の導電性伝送線路の接触面積の10%未満の低損失正接機械的支持体である、請求項1に記載の方法。
- 機械的支持体が、1又は2以上の導電性伝送線路の接触面積の1%未満の低損失正接機械的支持体である、請求項1に記載の方法。
- 機械的支持体が、ガラスクラッドを伴う一体型セラミックコアを伴う支持受けを形成する、請求項1に記載の方法。
- 支持受けが、前記受けの体積の40%未満であるガラスクラッドを有する、請求項7に記載の方法。
- 支持受けが、前記支持受けの体積の20%未満であるガラスクラッドを有する、請求項7に記載の方法。
- 支持受けが、前記支持受けの体積の10%未満であるガラスクラッドを有する、請求項7に記載の方法。
- 支持受けが、前記支持受けの体積の5%未満であるガラスクラッドを有する、請求項7に記載の方法。
- 機械安定化RF伝送線路デバイスが、バンドパス、シャントローパス、ハイパス又はノッチである、請求項1に記載の方法。
- 金属又は金属媒体が、チタン、チタン−タングステン、クロム、銅、ニッケル、金、パラジウム又は銀の少なくとも1つを含む、請求項8に記載の方法。
- エッチングするステップが、基板と1又は2以上の導電性伝送線路との間にエアギャップを形成しており、構造が1又は2以上のRF電子素子に接続される、請求項1に記載の方法。
- トレンチに隣接したガラス結晶基板がセラミック相に変換される、請求項1に記載の方法。
- 金属が、表面、埋込コンタクト、ブラインドバイア、ガラスバイア、直線コンタクト、矩形コンタクト、多角形コンタクト又は円形コンタクトを介して回路網に接続される、請求項1に記載の方法。
- 感光性ガラス基板が、60〜76重量%のシリカ;少なくとも3重量%のK2Oであって、K2O及びNa2Oの組合せが6重量%〜16重量%;0.003〜1重量%の、Ag2O及びAu2Oからなる群から選択される少なくとも1つの酸化物;0.003〜2重量%のCu2O;0.75重量%〜7重量%のB2O3及び6〜7重量%のAl2O3であって、B2O3及びAl2O3の組合せが13重量%を超えない;8〜15重量%のLi2O;並びに0.001〜0.1重量%のCeO2;の組成を備えるガラス基板である、請求項1に記載の方法。
- 感光性ガラス基板が、35〜76重量%のシリカ、3〜16重量%のK2O、0.003〜1重量%のAg2O、8〜15重量%のLi2O及び0.001〜0.1重量%のCeO2の組成を備えるガラス基板である、請求項1に記載の方法。
- 感光性ガラス基板が、光画定可能なガラス基板が少なくとも0.1重量%のSb2O3又はAs2O3を含む;光画定可能なガラス基板が0.003〜1重量%のAu2Oを含む;光画定可能なガラス基板が、1〜18重量%の、CaO、ZnO、PbO、MgO、SrO及びBaOからなる群から選択される酸化物を含む;並びに露光部分と未露光部分の異方性エッチング比が10〜20:1;21〜29:1;30〜45:1;20〜40:1;41〜45:1;及び30〜50:1の少なくとも1つであってもよい、の少なくとも1つである、請求項1に記載の方法。
- 感光性ガラス基板が、シリカ、酸化リチウム、酸化アルミニウム又は酸化セリウムの少なくとも1つを含む感光性ガラスセラミック複合基板である、請求項1に記載の方法。
- RF伝送線路デバイスが、信号入力対信号出力の50、40、30、25、20、15又は10%未満の損失を有する、請求項1に記載の方法。
- RF伝送線路デバイスが、30Ghzで0.4dB/cm未満の損失を有する、請求項1に記載の方法。
- 方法を使用する1又は2以上のRF機械的及び熱安定化交差指形共振構造をパッチアンテナ、伝送線路、遅延線路、バンドパス、ローパス、ハイパス又はノッチフィルタのうち少なくとも1つの特徴に形成するステップをさらに含む、請求項1に記載の方法。
- RF伝送線路が、RF交差指形共振構造の接触面積の10%未満の機械的支持体を有する、請求項20に記載のデバイス。
- RF伝送線路デバイスが、接触面積の5%未満の機械的及び熱安定化構造を有する、請求項20に記載のデバイス。
- RF伝送線路デバイスが、1又は2以上の導電性伝送線路の接触面積の1%未満の機械的及び熱安定化構造を有するRFフィルタ線路である、請求項20に記載のデバイス。
- 機械安定化RF伝送線路デバイスを作製する方法であって、
感光性ガラス基板に電気伝導チャネルを伴う1又は2以上の伝送線路構造を形成する1又は2以上の構造を備える設計レイアウトをマスキングするステップと、
前記感光性ガラス基板の少なくとも1つの部分を活性化エネルギー源に露光するステップと、
前記感光性ガラス基板をそのガラス転移温度を超えて少なくとも10分間加熱するステップと、
前記感光性ガラス基板を冷却して、前記露光されたガラスの少なくとも一部を結晶材料に変換してガラス結晶基板を形成するステップと、
前記ガラス結晶基板をエッチング液でエッチングして、機械的支持デバイスを形成するステップと、
前記1又は2以上の導電性交差指形伝送線路、接地面及び入出力チャネルを1又は2以上の金属で被覆するステップであり、前記金属が回路網に接続されるステップとを含む、前記方法。 - 方法を使用する1又は2以上のRF機械的及び熱安定化交差指形共振構造をパッチアンテナ、伝送線路、遅延線路、バンドパス、ローパス、ハイパス又はノッチフィルタのうち少なくとも1つの特徴に形成するステップをさらに含む、請求項27に記載の方法。
- エッチングされたウェルにおけるガラス受け上の1又は2以上の伝送線路構造及び前記1又は2以上の伝送線路構造から分離されて前記アンテナを形成する1又は2以上の接地を備える、アンテナ。
- エッチングされたウェルにおけるガラス又は金属受け上の1又は2以上の空洞構造及び1又は2以上の伝送線路構造から分離されて前記アンテナを形成する1又は2以上の接地を備える、アンテナ。
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JP (2) | JP6976409B2 (ja) |
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