JP2020535636A5 - - Google Patents

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Publication number
JP2020535636A5
JP2020535636A5 JP2020515729A JP2020515729A JP2020535636A5 JP 2020535636 A5 JP2020535636 A5 JP 2020535636A5 JP 2020515729 A JP2020515729 A JP 2020515729A JP 2020515729 A JP2020515729 A JP 2020515729A JP 2020535636 A5 JP2020535636 A5 JP 2020535636A5
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JP
Japan
Prior art keywords
holes
conductive layer
subset
grid array
land grid
Prior art date
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Application number
JP2020515729A
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English (en)
Japanese (ja)
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JP2020535636A (ja
JP7161269B2 (ja
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Priority claimed from US15/717,978 external-priority patent/US10128593B1/en
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Publication of JP2020535636A publication Critical patent/JP2020535636A/ja
Publication of JP2020535636A5 publication Critical patent/JP2020535636A5/ja
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Publication of JP7161269B2 publication Critical patent/JP7161269B2/ja
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JP2020515729A 2017-09-28 2018-09-26 ハイブリッド・ランド・グリッド・アレイ・コネクタを製造するための方法およびそのコネクタ Active JP7161269B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/717,978 2017-09-28
US15/717,978 US10128593B1 (en) 2017-09-28 2017-09-28 Connector having a body with a conductive layer common to top and bottom surfaces of the body as well as to wall surfaces of a plurality of holes in the body
PCT/IB2018/057444 WO2019064193A1 (en) 2017-09-28 2018-09-26 HYBRID TERRESTRIAL MATRIX GRID CONNECTOR FOR ENHANCED SIGNAL INTEGRITY

Publications (3)

Publication Number Publication Date
JP2020535636A JP2020535636A (ja) 2020-12-03
JP2020535636A5 true JP2020535636A5 (enExample) 2021-01-21
JP7161269B2 JP7161269B2 (ja) 2022-10-26

Family

ID=64050660

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020515729A Active JP7161269B2 (ja) 2017-09-28 2018-09-26 ハイブリッド・ランド・グリッド・アレイ・コネクタを製造するための方法およびそのコネクタ

Country Status (6)

Country Link
US (2) US10128593B1 (enExample)
JP (1) JP7161269B2 (enExample)
CN (1) CN111164835A (enExample)
DE (1) DE112018003635B4 (enExample)
GB (1) GB2579007B (enExample)
WO (1) WO2019064193A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10553515B2 (en) 2016-04-28 2020-02-04 Intel Corporation Integrated circuit structures with extended conductive pathways
US11291133B2 (en) 2018-03-28 2022-03-29 Intel Corporation Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket
CN110034430B (zh) * 2019-03-29 2021-05-25 番禺得意精密电子工业有限公司 电连接器及其组装方法
US10756009B1 (en) 2019-09-18 2020-08-25 International Business Machines Corporation Efficient placement of grid array components
CN111244701B (zh) * 2020-01-07 2021-05-25 番禺得意精密电子工业有限公司 电连接器
CN113764943B (zh) * 2020-06-02 2025-10-10 山一电机株式会社 插座
US11289836B2 (en) * 2020-07-23 2022-03-29 International Business Machines Corporation Land grid array electrical contact coating
US11196197B1 (en) * 2020-08-10 2021-12-07 Lotes Co., Ltd Electrical connector
US12439542B2 (en) 2022-06-29 2025-10-07 International Business Machines Corporation Standoff and support structures for reliable land grid array and hybrid land grid array interconnects

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4838800A (en) * 1988-05-23 1989-06-13 Gte Products Corporation High density interconnect system
US5772451A (en) * 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
ES2163043T3 (es) 1995-10-16 2002-01-16 Siemens Nv Matriz de rejilla de resaltes de polimero.
JP4082750B2 (ja) * 1996-04-01 2008-04-30 スリーエム カンパニー Ｉｃソケット
US6086386A (en) 1996-05-24 2000-07-11 Tessera, Inc. Flexible connectors for microelectronic elements
JP3091159B2 (ja) * 1997-03-21 2000-09-25 イビデン株式会社 変換モジュール
US6725536B1 (en) * 1999-03-10 2004-04-27 Micron Technology, Inc. Methods for the fabrication of electrical connectors
US6621155B1 (en) 1999-12-23 2003-09-16 Rambus Inc. Integrated circuit device having stacked dies and impedance balanced transmission lines
FR2807208B1 (fr) * 2000-03-29 2003-09-05 St Microelectronics Sa Dispositif semi-conducteur de memoire non volatile et procede de fabrication correspondant
JP2003302441A (ja) * 2002-04-10 2003-10-24 Suncall Corp テスト用ｉｃソケット
US6870251B2 (en) 2002-05-29 2005-03-22 Intel Corporation High-power LGA socket
US7363688B2 (en) * 2002-07-25 2008-04-29 International Business Machines Corporation Land grid array structures and methods for engineering change
US6954984B2 (en) * 2002-07-25 2005-10-18 International Business Machines Corporation Land grid array structure
JP2004200452A (ja) 2002-12-19 2004-07-15 Toppan Printing Co Ltd Ｂｇａ基板
WO2004093252A2 (en) * 2003-04-11 2004-10-28 Neoconix, Inc. Electrical connector and method for making
US7244125B2 (en) * 2003-12-08 2007-07-17 Neoconix, Inc. Connector for making electrical contact at semiconductor scales
US6933596B2 (en) 2003-07-01 2005-08-23 Northrop Grumman Corporation Ultra wideband BGA
JP4602649B2 (ja) * 2003-07-23 2010-12-22 ティーエヌジー コーポレーション リミテッド 電子部品用ソケット
US7337537B1 (en) * 2003-09-22 2008-03-04 Alcatel Lucent Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board
JP2005149854A (ja) * 2003-11-13 2005-06-09 Nec Electronics Corp プローブ及びｉｃソケット並びに半導体回路
US7053729B2 (en) 2004-08-23 2006-05-30 Kyocera America, Inc. Impedence matching along verticle path of microwave vias in multilayer packages
US7621044B2 (en) * 2004-10-22 2009-11-24 Formfactor, Inc. Method of manufacturing a resilient contact
JP2007005087A (ja) 2005-06-22 2007-01-11 Matsushita Electric Ind Co Ltd インピーダンス整合コネクタ、およびインピーダンス整合コネクタの製造方法
JP2007178165A (ja) * 2005-12-27 2007-07-12 Yokowo Co Ltd 検査ユニット
CN2904368Y (zh) * 2006-03-17 2007-05-23 番禺得意精密电子工业有限公司 电连接器
CN201142393Y (zh) * 2007-08-18 2008-10-29 富士康(昆山)电脑接插件有限公司 电连接器
KR100943861B1 (ko) 2008-06-12 2010-02-24 주식회사 하이닉스반도체 임피던스 매칭된 양방향 멀티 드롭 버스 시스템, 그를이용한 메모리 시스템 및 메모리 모듈
US7695288B2 (en) * 2008-06-25 2010-04-13 Intel Corporation Land grid array (LGA) socket with cells and method of fabrication and assembly
JP5166176B2 (ja) * 2008-09-04 2013-03-21 スリーエム イノベイティブ プロパティズ カンパニー 電子デバイス用ソケット
US8157591B2 (en) 2008-12-05 2012-04-17 Tyco Electronics Corporation Electrical connector system
CN101997190B (zh) * 2009-08-14 2014-05-07 富士康(昆山)电脑接插件有限公司 电连接装置
WO2012045000A1 (en) 2010-09-30 2012-04-05 Aviat Networks, Inc. Systems and methods for improved chip device performance
TW201230260A (en) * 2011-01-14 2012-07-16 Subtron Technology Co Ltd Package carrier and manufacturing method thereof
CN102509958B (zh) * 2011-10-24 2014-02-12 番禺得意精密电子工业有限公司 屏蔽式绝缘本体、屏蔽式连接器及其制造方法
CN202930669U (zh) * 2012-04-10 2013-05-08 番禺得意精密电子工业有限公司 电连接器
TWI583068B (zh) * 2012-08-02 2017-05-11 鴻海精密工業股份有限公司 電連接器
CN203242847U (zh) * 2013-02-22 2013-10-16 番禺得意精密电子工业有限公司 电连接器
CN103441111B (zh) * 2013-06-25 2016-03-16 华进半导体封装先导技术研发中心有限公司 一种三维封装互连结构及其制作方法
US9252077B2 (en) 2013-09-25 2016-02-02 Intel Corporation Package vias for radio frequency antenna connections
CN103579805A (zh) * 2013-11-01 2014-02-12 番禺得意精密电子工业有限公司 导电体、电连接器及其成型方法
US20150170996A1 (en) 2013-12-18 2015-06-18 International Business Machines Corporation Through-mesh-plane vias in a multi-layered package
KR102129657B1 (ko) * 2014-09-26 2020-07-02 인텔 코포레이션 소켓 접촉 기법 및 구성
CN107196145B (zh) 2017-05-05 2019-07-30 番禺得意精密电子工业有限公司 屏蔽连接器的制造方法

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