GB2579007B - Hybrid land grid array connector for improved signal integrity - Google Patents

Hybrid land grid array connector for improved signal integrity Download PDF

Info

Publication number
GB2579007B
GB2579007B GB2003962.4A GB202003962A GB2579007B GB 2579007 B GB2579007 B GB 2579007B GB 202003962 A GB202003962 A GB 202003962A GB 2579007 B GB2579007 B GB 2579007B
Authority
GB
United Kingdom
Prior art keywords
grid array
signal integrity
improved signal
land grid
array connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB2003962.4A
Other languages
English (en)
Other versions
GB2579007A (en
GB202003962D0 (en
Inventor
Hejase Jose
Becker Wiren
Dreps Daniel
Chun Sungjun
Beaman Brian
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB202003962D0 publication Critical patent/GB202003962D0/en
Publication of GB2579007A publication Critical patent/GB2579007A/en
Application granted granted Critical
Publication of GB2579007B publication Critical patent/GB2579007B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6588—Shielding material individually surrounding or interposed between mutually spaced contacts with through openings for individual contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/526—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures the printed circuits being on the same board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7082—Coupling device supported only by cooperation with PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/18—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/245—Contacts for co-operating by abutting resilient; resiliently-mounted by stamped-out resilient contact arm
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
GB2003962.4A 2017-09-28 2018-09-26 Hybrid land grid array connector for improved signal integrity Active GB2579007B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/717,978 US10128593B1 (en) 2017-09-28 2017-09-28 Connector having a body with a conductive layer common to top and bottom surfaces of the body as well as to wall surfaces of a plurality of holes in the body
PCT/IB2018/057444 WO2019064193A1 (en) 2017-09-28 2018-09-26 HYBRID TERRESTRIAL MATRIX GRID CONNECTOR FOR ENHANCED SIGNAL INTEGRITY

Publications (3)

Publication Number Publication Date
GB202003962D0 GB202003962D0 (en) 2020-05-06
GB2579007A GB2579007A (en) 2020-06-03
GB2579007B true GB2579007B (en) 2020-09-16

Family

ID=64050660

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2003962.4A Active GB2579007B (en) 2017-09-28 2018-09-26 Hybrid land grid array connector for improved signal integrity

Country Status (6)

Country Link
US (2) US10128593B1 (enExample)
JP (1) JP7161269B2 (enExample)
CN (1) CN111164835A (enExample)
DE (1) DE112018003635B4 (enExample)
GB (1) GB2579007B (enExample)
WO (1) WO2019064193A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10553515B2 (en) * 2016-04-28 2020-02-04 Intel Corporation Integrated circuit structures with extended conductive pathways
US11291133B2 (en) 2018-03-28 2022-03-29 Intel Corporation Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket
CN110034430B (zh) * 2019-03-29 2021-05-25 番禺得意精密电子工业有限公司 电连接器及其组装方法
US10756009B1 (en) 2019-09-18 2020-08-25 International Business Machines Corporation Efficient placement of grid array components
CN111244701B (zh) * 2020-01-07 2021-05-25 番禺得意精密电子工业有限公司 电连接器
CN113764943B (zh) * 2020-06-02 2025-10-10 山一电机株式会社 插座
US11289836B2 (en) * 2020-07-23 2022-03-29 International Business Machines Corporation Land grid array electrical contact coating
US11196197B1 (en) * 2020-08-10 2021-12-07 Lotes Co., Ltd Electrical connector
US12439542B2 (en) 2022-06-29 2025-10-07 International Business Machines Corporation Standoff and support structures for reliable land grid array and hybrid land grid array interconnects

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004093252A2 (en) * 2003-04-11 2004-10-28 Neoconix, Inc. Electrical connector and method for making
US20060085976A1 (en) * 2004-10-22 2006-04-27 Formfactor, Inc. Electroform spring built on mandrel transferable to other surface
CN102593313A (zh) * 2011-01-14 2012-07-18 旭德科技股份有限公司 封装载板及其制作方法
US20130267118A1 (en) * 2012-04-10 2013-10-10 Lotes Co., Ltd. Electrical connector
CN103441111A (zh) * 2013-06-25 2013-12-11 华进半导体封装先导技术研发中心有限公司 一种三维封装互连结构及其制作方法
US20140242839A1 (en) * 2013-02-22 2014-08-28 Lotes Co., Ltd Electrical connector

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4838800A (en) * 1988-05-23 1989-06-13 Gte Products Corporation High density interconnect system
US5772451A (en) * 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
ATE204678T1 (de) 1995-10-16 2001-09-15 Siemens Nv Polymeres höcker-matrix-gehäuse
JP4082750B2 (ja) * 1996-04-01 2008-04-30 スリーエム カンパニー Icソケット
EP0901695A4 (en) 1996-05-24 2000-04-12 Tessera Inc CONNECTOR FOR MICROELECTRONIC ELEMENTS
JP3091159B2 (ja) * 1997-03-21 2000-09-25 イビデン株式会社 変換モジュール
US6725536B1 (en) * 1999-03-10 2004-04-27 Micron Technology, Inc. Methods for the fabrication of electrical connectors
US6621155B1 (en) 1999-12-23 2003-09-16 Rambus Inc. Integrated circuit device having stacked dies and impedance balanced transmission lines
FR2807208B1 (fr) * 2000-03-29 2003-09-05 St Microelectronics Sa Dispositif semi-conducteur de memoire non volatile et procede de fabrication correspondant
JP2003302441A (ja) * 2002-04-10 2003-10-24 Suncall Corp テスト用icソケット
US6870251B2 (en) 2002-05-29 2005-03-22 Intel Corporation High-power LGA socket
US6954984B2 (en) * 2002-07-25 2005-10-18 International Business Machines Corporation Land grid array structure
US7363688B2 (en) * 2002-07-25 2008-04-29 International Business Machines Corporation Land grid array structures and methods for engineering change
JP2004200452A (ja) 2002-12-19 2004-07-15 Toppan Printing Co Ltd Bga基板
US7244125B2 (en) * 2003-12-08 2007-07-17 Neoconix, Inc. Connector for making electrical contact at semiconductor scales
US6933596B2 (en) 2003-07-01 2005-08-23 Northrop Grumman Corporation Ultra wideband BGA
JP4602649B2 (ja) * 2003-07-23 2010-12-22 ティーエヌジー コーポレーション リミテッド 電子部品用ソケット
US7337537B1 (en) * 2003-09-22 2008-03-04 Alcatel Lucent Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board
JP2005149854A (ja) * 2003-11-13 2005-06-09 Nec Electronics Corp プローブ及びicソケット並びに半導体回路
US7053729B2 (en) 2004-08-23 2006-05-30 Kyocera America, Inc. Impedence matching along verticle path of microwave vias in multilayer packages
JP2007005087A (ja) 2005-06-22 2007-01-11 Matsushita Electric Ind Co Ltd インピーダンス整合コネクタ、およびインピーダンス整合コネクタの製造方法
JP2007178165A (ja) * 2005-12-27 2007-07-12 Yokowo Co Ltd 検査ユニット
CN2904368Y (zh) * 2006-03-17 2007-05-23 番禺得意精密电子工业有限公司 电连接器
CN201142393Y (zh) * 2007-08-18 2008-10-29 富士康(昆山)电脑接插件有限公司 电连接器
KR100943861B1 (ko) 2008-06-12 2010-02-24 주식회사 하이닉스반도체 임피던스 매칭된 양방향 멀티 드롭 버스 시스템, 그를이용한 메모리 시스템 및 메모리 모듈
US7695288B2 (en) * 2008-06-25 2010-04-13 Intel Corporation Land grid array (LGA) socket with cells and method of fabrication and assembly
JP5166176B2 (ja) * 2008-09-04 2013-03-21 スリーエム イノベイティブ プロパティズ カンパニー 電子デバイス用ソケット
US8157591B2 (en) 2008-12-05 2012-04-17 Tyco Electronics Corporation Electrical connector system
CN101997190B (zh) * 2009-08-14 2014-05-07 富士康(昆山)电脑接插件有限公司 电连接装置
WO2012045000A1 (en) 2010-09-30 2012-04-05 Aviat Networks, Inc. Systems and methods for improved chip device performance
CN102509958B (zh) * 2011-10-24 2014-02-12 番禺得意精密电子工业有限公司 屏蔽式绝缘本体、屏蔽式连接器及其制造方法
TWI583068B (zh) * 2012-08-02 2017-05-11 鴻海精密工業股份有限公司 電連接器
US9252077B2 (en) 2013-09-25 2016-02-02 Intel Corporation Package vias for radio frequency antenna connections
CN103579805A (zh) * 2013-11-01 2014-02-12 番禺得意精密电子工业有限公司 导电体、电连接器及其成型方法
US20150170996A1 (en) 2013-12-18 2015-06-18 International Business Machines Corporation Through-mesh-plane vias in a multi-layered package
JP6201168B2 (ja) * 2014-09-26 2017-09-27 インテル・コーポレーション ソケット接触子の技術および構成
CN107196145B (zh) * 2017-05-05 2019-07-30 番禺得意精密电子工业有限公司 屏蔽连接器的制造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004093252A2 (en) * 2003-04-11 2004-10-28 Neoconix, Inc. Electrical connector and method for making
US20060085976A1 (en) * 2004-10-22 2006-04-27 Formfactor, Inc. Electroform spring built on mandrel transferable to other surface
CN102593313A (zh) * 2011-01-14 2012-07-18 旭德科技股份有限公司 封装载板及其制作方法
US20130267118A1 (en) * 2012-04-10 2013-10-10 Lotes Co., Ltd. Electrical connector
US20140242839A1 (en) * 2013-02-22 2014-08-28 Lotes Co., Ltd Electrical connector
CN103441111A (zh) * 2013-06-25 2013-12-11 华进半导体封装先导技术研发中心有限公司 一种三维封装互连结构及其制作方法

Also Published As

Publication number Publication date
DE112018003635B4 (de) 2021-05-06
GB2579007A (en) 2020-06-03
GB202003962D0 (en) 2020-05-06
WO2019064193A1 (en) 2019-04-04
DE112018003635T5 (de) 2020-04-16
CN111164835A (zh) 2020-05-15
US10128593B1 (en) 2018-11-13
JP2020535636A (ja) 2020-12-03
JP7161269B2 (ja) 2022-10-26
US10135162B1 (en) 2018-11-20

Similar Documents

Publication Publication Date Title
GB202003962D0 (en) Hybrid land grid array connector for improved signal integrity
GB201618066D0 (en) Vehicle phased array antenna pattern generation
PL3212496T3 (pl) System połączeń dla przewodów sieciowych odłączalnych morskich urządzeń energetycznych
SG11201708497XA (en) Battery cell connector
GB2571236B (en) Fuel cell system
EP3134750A4 (en) Techniques for securing live positioning signals
IL277831A (en) Multipolar connector
GB2551002B (en) Fuel cell system
EP3291345A4 (en) Fuel cell system
GB201516773D0 (en) Electrical connector for a vehicle
SG11201510042RA (en) A system and method for receiving and processing array antenna signals
EP3231044A4 (en) Capacitively coupled connector junctions having parallel signal paths and related connectors and methods
EP3359771A4 (en) Electrical impedance tomography using a switchable array
DK3067994T3 (da) Konnektorstiksystem
EP3396759A4 (en) FUEL CELL SYSTEM
GB2587992B (en) High density connector
EP3267524A4 (en) Fuel cell system
GB2568930B (en) Mechanical connector for geogrids
GB201902963D0 (en) Improved connector arrangement
GB201713141D0 (en) Fuel cell unit
EP3260798B8 (en) Fuel cell system
EP3297079A4 (en) Fuel cell system
EP3322014A4 (en) Fuel cell system
GB201800553D0 (en) Improved underwater connector
GB201806883D0 (en) Fuel cell system

Legal Events

Date Code Title Description
746 Register noted 'licences of right' (sect. 46/1977)

Effective date: 20200923