JP7161269B2 - ハイブリッド・ランド・グリッド・アレイ・コネクタを製造するための方法およびそのコネクタ - Google Patents

ハイブリッド・ランド・グリッド・アレイ・コネクタを製造するための方法およびそのコネクタ Download PDF

Info

Publication number
JP7161269B2
JP7161269B2 JP2020515729A JP2020515729A JP7161269B2 JP 7161269 B2 JP7161269 B2 JP 7161269B2 JP 2020515729 A JP2020515729 A JP 2020515729A JP 2020515729 A JP2020515729 A JP 2020515729A JP 7161269 B2 JP7161269 B2 JP 7161269B2
Authority
JP
Japan
Prior art keywords
holes
conductive layer
conductive
connector
grid array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020515729A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020535636A (ja
JP2020535636A5 (enExample
Inventor
ヘジャセ、ノゼ、エール
ベッカー、ヴィレン
ドレプス、ダニエル
チュン、サンジュン
ベーマン、ブライアン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JP2020535636A publication Critical patent/JP2020535636A/ja
Publication of JP2020535636A5 publication Critical patent/JP2020535636A5/ja
Application granted granted Critical
Publication of JP7161269B2 publication Critical patent/JP7161269B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6588—Shielding material individually surrounding or interposed between mutually spaced contacts with through openings for individual contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/526—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures the printed circuits being on the same board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7082—Coupling device supported only by cooperation with PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/245—Contacts for co-operating by abutting resilient; resiliently-mounted by stamped-out resilient contact arm
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/18—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
JP2020515729A 2017-09-28 2018-09-26 ハイブリッド・ランド・グリッド・アレイ・コネクタを製造するための方法およびそのコネクタ Active JP7161269B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/717,978 2017-09-28
US15/717,978 US10128593B1 (en) 2017-09-28 2017-09-28 Connector having a body with a conductive layer common to top and bottom surfaces of the body as well as to wall surfaces of a plurality of holes in the body
PCT/IB2018/057444 WO2019064193A1 (en) 2017-09-28 2018-09-26 HYBRID TERRESTRIAL MATRIX GRID CONNECTOR FOR ENHANCED SIGNAL INTEGRITY

Publications (3)

Publication Number Publication Date
JP2020535636A JP2020535636A (ja) 2020-12-03
JP2020535636A5 JP2020535636A5 (enExample) 2021-01-21
JP7161269B2 true JP7161269B2 (ja) 2022-10-26

Family

ID=64050660

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020515729A Active JP7161269B2 (ja) 2017-09-28 2018-09-26 ハイブリッド・ランド・グリッド・アレイ・コネクタを製造するための方法およびそのコネクタ

Country Status (6)

Country Link
US (2) US10128593B1 (enExample)
JP (1) JP7161269B2 (enExample)
CN (1) CN111164835A (enExample)
DE (1) DE112018003635B4 (enExample)
GB (1) GB2579007B (enExample)
WO (1) WO2019064193A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10553515B2 (en) 2016-04-28 2020-02-04 Intel Corporation Integrated circuit structures with extended conductive pathways
US11291133B2 (en) 2018-03-28 2022-03-29 Intel Corporation Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket
CN110034430B (zh) * 2019-03-29 2021-05-25 番禺得意精密电子工业有限公司 电连接器及其组装方法
US10756009B1 (en) 2019-09-18 2020-08-25 International Business Machines Corporation Efficient placement of grid array components
CN111244701B (zh) * 2020-01-07 2021-05-25 番禺得意精密电子工业有限公司 电连接器
CN113764943B (zh) * 2020-06-02 2025-10-10 山一电机株式会社 插座
US11289836B2 (en) * 2020-07-23 2022-03-29 International Business Machines Corporation Land grid array electrical contact coating
US11196197B1 (en) * 2020-08-10 2021-12-07 Lotes Co., Ltd Electrical connector
US12439542B2 (en) 2022-06-29 2025-10-07 International Business Machines Corporation Standoff and support structures for reliable land grid array and hybrid land grid array interconnects

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003302441A (ja) 2002-04-10 2003-10-24 Suncall Corp テスト用ｉｃソケット
JP2005149854A (ja) 2003-11-13 2005-06-09 Nec Electronics Corp プローブ及びｉｃソケット並びに半導体回路
JP2007178165A (ja) 2005-12-27 2007-07-12 Yokowo Co Ltd 検査ユニット
WO2010027597A2 (en) 2008-09-04 2010-03-11 3M Innovative Properties Company Electronic device socket
CN202930669U (zh) 2012-04-10 2013-05-08 番禺得意精密电子工业有限公司 电连接器
US10050387B1 (en) 2017-05-05 2018-08-14 Lotes Co., Ltd Method for manufacturing shielded connector

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4838800A (en) * 1988-05-23 1989-06-13 Gte Products Corporation High density interconnect system
US5772451A (en) * 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
ES2163043T3 (es) 1995-10-16 2002-01-16 Siemens Nv Matriz de rejilla de resaltes de polimero.
JP4082750B2 (ja) * 1996-04-01 2008-04-30 スリーエム カンパニー Ｉｃソケット
US6086386A (en) 1996-05-24 2000-07-11 Tessera, Inc. Flexible connectors for microelectronic elements
JP3091159B2 (ja) * 1997-03-21 2000-09-25 イビデン株式会社 変換モジュール
US6725536B1 (en) * 1999-03-10 2004-04-27 Micron Technology, Inc. Methods for the fabrication of electrical connectors
US6621155B1 (en) 1999-12-23 2003-09-16 Rambus Inc. Integrated circuit device having stacked dies and impedance balanced transmission lines
FR2807208B1 (fr) * 2000-03-29 2003-09-05 St Microelectronics Sa Dispositif semi-conducteur de memoire non volatile et procede de fabrication correspondant
US6870251B2 (en) 2002-05-29 2005-03-22 Intel Corporation High-power LGA socket
US7363688B2 (en) * 2002-07-25 2008-04-29 International Business Machines Corporation Land grid array structures and methods for engineering change
US6954984B2 (en) * 2002-07-25 2005-10-18 International Business Machines Corporation Land grid array structure
JP2004200452A (ja) 2002-12-19 2004-07-15 Toppan Printing Co Ltd Ｂｇａ基板
WO2004093252A2 (en) * 2003-04-11 2004-10-28 Neoconix, Inc. Electrical connector and method for making
US7244125B2 (en) * 2003-12-08 2007-07-17 Neoconix, Inc. Connector for making electrical contact at semiconductor scales
US6933596B2 (en) 2003-07-01 2005-08-23 Northrop Grumman Corporation Ultra wideband BGA
JP4602649B2 (ja) * 2003-07-23 2010-12-22 ティーエヌジー コーポレーション リミテッド 電子部品用ソケット
US7337537B1 (en) * 2003-09-22 2008-03-04 Alcatel Lucent Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board
US7053729B2 (en) 2004-08-23 2006-05-30 Kyocera America, Inc. Impedence matching along verticle path of microwave vias in multilayer packages
US7621044B2 (en) * 2004-10-22 2009-11-24 Formfactor, Inc. Method of manufacturing a resilient contact
JP2007005087A (ja) 2005-06-22 2007-01-11 Matsushita Electric Ind Co Ltd インピーダンス整合コネクタ、およびインピーダンス整合コネクタの製造方法
CN2904368Y (zh) * 2006-03-17 2007-05-23 番禺得意精密电子工业有限公司 电连接器
CN201142393Y (zh) * 2007-08-18 2008-10-29 富士康(昆山)电脑接插件有限公司 电连接器
KR100943861B1 (ko) 2008-06-12 2010-02-24 주식회사 하이닉스반도체 임피던스 매칭된 양방향 멀티 드롭 버스 시스템, 그를이용한 메모리 시스템 및 메모리 모듈
US7695288B2 (en) * 2008-06-25 2010-04-13 Intel Corporation Land grid array (LGA) socket with cells and method of fabrication and assembly
US8157591B2 (en) 2008-12-05 2012-04-17 Tyco Electronics Corporation Electrical connector system
CN101997190B (zh) * 2009-08-14 2014-05-07 富士康(昆山)电脑接插件有限公司 电连接装置
WO2012045000A1 (en) 2010-09-30 2012-04-05 Aviat Networks, Inc. Systems and methods for improved chip device performance
TW201230260A (en) * 2011-01-14 2012-07-16 Subtron Technology Co Ltd Package carrier and manufacturing method thereof
CN102509958B (zh) * 2011-10-24 2014-02-12 番禺得意精密电子工业有限公司 屏蔽式绝缘本体、屏蔽式连接器及其制造方法
TWI583068B (zh) * 2012-08-02 2017-05-11 鴻海精密工業股份有限公司 電連接器
CN203242847U (zh) * 2013-02-22 2013-10-16 番禺得意精密电子工业有限公司 电连接器
CN103441111B (zh) * 2013-06-25 2016-03-16 华进半导体封装先导技术研发中心有限公司 一种三维封装互连结构及其制作方法
US9252077B2 (en) 2013-09-25 2016-02-02 Intel Corporation Package vias for radio frequency antenna connections
CN103579805A (zh) * 2013-11-01 2014-02-12 番禺得意精密电子工业有限公司 导电体、电连接器及其成型方法
US20150170996A1 (en) 2013-12-18 2015-06-18 International Business Machines Corporation Through-mesh-plane vias in a multi-layered package
KR102129657B1 (ko) * 2014-09-26 2020-07-02 인텔 코포레이션 소켓 접촉 기법 및 구성

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003302441A (ja) 2002-04-10 2003-10-24 Suncall Corp テスト用ｉｃソケット
JP2005149854A (ja) 2003-11-13 2005-06-09 Nec Electronics Corp プローブ及びｉｃソケット並びに半導体回路
JP2007178165A (ja) 2005-12-27 2007-07-12 Yokowo Co Ltd 検査ユニット
WO2010027597A2 (en) 2008-09-04 2010-03-11 3M Innovative Properties Company Electronic device socket
JP2010062045A (ja) 2008-09-04 2010-03-18 Three M Innovative Properties Co 電子デバイス用ソケット
CN102197542A (zh) 2008-09-04 2011-09-21 3M创新有限公司 电子装置插座
CN202930669U (zh) 2012-04-10 2013-05-08 番禺得意精密电子工业有限公司 电连接器
US10050387B1 (en) 2017-05-05 2018-08-14 Lotes Co., Ltd Method for manufacturing shielded connector

Also Published As

Publication number Publication date
DE112018003635T5 (de) 2020-04-16
US10128593B1 (en) 2018-11-13
US10135162B1 (en) 2018-11-20
GB202003962D0 (en) 2020-05-06
JP2020535636A (ja) 2020-12-03
WO2019064193A1 (en) 2019-04-04
DE112018003635B4 (de) 2021-05-06
CN111164835A (zh) 2020-05-15
GB2579007A (en) 2020-06-03
GB2579007B (en) 2020-09-16

Similar Documents

Publication Publication Date Title
JP7161269B2 (ja) ハイブリッド・ランド・グリッド・アレイ・コネクタを製造するための方法およびそのコネクタ
US8367942B2 (en) Low profile electrical interposer of woven structure and method of making same
CN100370607C (zh) 半导体装置及其制造方法
US20070268105A1 (en) Electrical component having an inductor and a method of formation
CN107993987B (zh) 具有内置参考平面结构的封装对板互连结构
KR20090042841A (ko) 동일 평면 회로 및 접지 트레이스들을 갖고, 설정가능한 접지 링크를 갖는 회로 보드
JPH10172695A (ja) 電子相互接続装置およびその作成方法並びに電子相互接続装置用の同軸電気パッド
CN104956776A (zh) 具有正交信号通路的印刷电路板
TW201236132A (en) Semiconductor device
CN103871913B (zh) 安装在有机衬底上的凹入的分立组件
US20150214200A1 (en) Package assembly and method for manufacturing the same
US20150187738A1 (en) Package assembly and method for manufacturing the same
US7180182B2 (en) Semiconductor component
JP2025508517A (ja) 集積キャパシタを有する半導体パッケージ
US6278185B1 (en) Semi-additive process (SAP) architecture for organic leadless grid array packages
KR20110087437A (ko) 실리콘 러버 커넥터 및 그 제조방법
US20210057296A1 (en) Electric component embedded structure
US20150351229A1 (en) Printed circuit board comprising co-planar surface pads and insulating dielectric
EP4120339B1 (en) Space efficient flip chip joint design using different pillar designs
WO2001048819A2 (en) Interconnect structure and method of fabrication therefor
US20180122721A1 (en) Plug structure of a semiconductor chip and method of manufacturing the same
CN104715921A (zh) 电容器内嵌基板及其制造方法
KR100880187B1 (ko) 반도체 장치용 기판
US20070004256A1 (en) Method for fabricating microconnector and shape of terminals thereof
CN109326571A (zh) 芯片封装组件及其制造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20201117

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210222

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20220307

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20220502

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220510

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220725

RD12 Notification of acceptance of power of sub attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7432

Effective date: 20220725

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20221004

RD14 Notification of resignation of power of sub attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7434

Effective date: 20221006

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20221012

R150 Certificate of patent or registration of utility model

Ref document number: 7161269

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150