ES2163043T3 - Matriz de rejilla de resaltes de polimero. - Google Patents
Matriz de rejilla de resaltes de polimero.Info
- Publication number
- ES2163043T3 ES2163043T3 ES96934620T ES96934620T ES2163043T3 ES 2163043 T3 ES2163043 T3 ES 2163043T3 ES 96934620 T ES96934620 T ES 96934620T ES 96934620 T ES96934620 T ES 96934620T ES 2163043 T3 ES2163043 T3 ES 2163043T3
- Authority
- ES
- Spain
- Prior art keywords
- polymer
- pct
- substrate
- connections
- date apr
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
- H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
- H01L2924/15157—Top view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Surface Heating Bodies (AREA)
- Pens And Brushes (AREA)
- Vehicle Interior And Exterior Ornaments, Soundproofing, And Insulation (AREA)
Abstract
SE PROPONE UN DISPOSITIVO EN REJILLA DE TACOS POLIMERICOS PARA MEJORAR LA EVACUACION DEL CALOR DE PERDIDA, CON UN SUSTRATO TRIDIMENSIONAL (S) DE FUNDICION INYECTADA A PARTIR DE UN POLIMERO ELECTRICAMENTE AISLANTE; TACOS POLIMERICOS (PS) DISPUESTOS SUPERFICIALMENTE SOBRE LA CARA INFERIOR DEL SUSTRATO (S) Y MOLDEADOS TAMBIEN DURANTE LA FUNDICION INYECTADA; CONEXIONES EXTERIORES FORMADAS SOBRE LOS TACOS POLIMERICOS (PS) MEDIANTE UNA SUPERFICIE EXTREMA SOLDABLE; APAREJOS ELECTRICOS CONFORMADOS AL MENOS SOBRE LA CARA INFERIOR DEL SUSTRATO (S), QUE UNEN LAS CONEXIONES EXTERIORES A LAS CONEXIONES INTERIORES; AL MENOS UN CUERPO TERMICAMENTE CONDUCTOR (WL) INYECTADO PARCIALMENTE DURANTE LA FUNDICION INYECTADA DEL SUSTRATO (S); Y CON AL MENOS UN CHIP O ELEMENTO DE CABLEADO (VE) DISPUESTO SOBRE EL CUERPO TERMICAMENTE CONDUCTOR (WL), CUYAS CONEXIONES ESTAN UNIDAS DE FORMA ELECTRICAMENTE CONDUCTORA A LAS CONEXIONES INTERIORES. LA NUEVA FORMA CONSTRUCTIVA ES ESPECIALMENTE APROPIADA PARA ELEMENTOS CONSTRUCTIVOS DE POTENCIA O GRUPOS CONSTRUCTIVOS DE POTENCIA EN EL DISPOSITIVO EN REJILLA DE TACOS POLIMERICOS.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19538464 | 1995-10-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2163043T3 true ES2163043T3 (es) | 2002-01-16 |
Family
ID=7774969
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES96934620T Expired - Lifetime ES2163043T3 (es) | 1995-10-16 | 1996-10-10 | Matriz de rejilla de resaltes de polimero. |
Country Status (8)
Country | Link |
---|---|
US (1) | US6122172A (es) |
EP (1) | EP0856199B1 (es) |
JP (1) | JP3037440B2 (es) |
KR (1) | KR100430325B1 (es) |
AT (1) | ATE204678T1 (es) |
DE (1) | DE59607546D1 (es) |
ES (1) | ES2163043T3 (es) |
WO (1) | WO1997015078A1 (es) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6705388B1 (en) * | 1997-11-10 | 2004-03-16 | Parker-Hannifin Corporation | Non-electrically conductive thermal dissipator for electronic components |
DE10030289B4 (de) * | 1999-06-29 | 2012-10-04 | Marquardt Gmbh | Träger für Bauteile und Herstellungsverfahren |
US6444489B1 (en) | 2000-12-15 | 2002-09-03 | Charles W. C. Lin | Semiconductor chip assembly with bumped molded substrate |
US6486549B1 (en) | 2001-11-10 | 2002-11-26 | Bridge Semiconductor Corporation | Semiconductor module with encapsulant base |
US6638082B2 (en) | 2001-11-20 | 2003-10-28 | Fci Americas Technology, Inc. | Pin-grid-array electrical connector |
US6666693B2 (en) | 2001-11-20 | 2003-12-23 | Fci Americas Technology, Inc. | Surface-mounted right-angle electrical connector |
US7052763B2 (en) * | 2003-08-05 | 2006-05-30 | Xerox Corporation | Multi-element connector |
US20050031840A1 (en) * | 2003-08-05 | 2005-02-10 | Xerox Corporation | RF connector |
DE102004032371A1 (de) | 2004-06-30 | 2006-01-26 | Robert Bosch Gmbh | Elektronische Schaltungseinheit |
US20090323295A1 (en) * | 2008-06-30 | 2009-12-31 | Houle Sabina J | Injection molded metal stiffener and integrated carrier for packaging applications |
US10128593B1 (en) | 2017-09-28 | 2018-11-13 | International Business Machines Corporation | Connector having a body with a conductive layer common to top and bottom surfaces of the body as well as to wall surfaces of a plurality of holes in the body |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3271507A (en) * | 1965-11-02 | 1966-09-06 | Alloys Unltd Inc | Flat package for semiconductors |
AU2073088A (en) * | 1987-07-01 | 1989-01-30 | Western Digital Corporation | Plated plastic castellated interconnect for electrical components |
WO1989000339A1 (en) * | 1987-07-03 | 1989-01-12 | Doduco Gmbh + Co. Dr. Eugen Dürrwächter | Flat bodies, in particular for use as heat sinks for electronic power components |
DE3732249A1 (de) * | 1987-09-24 | 1989-04-13 | Siemens Ag | Verfahren zur herstellung von dreidimensionalen leiterplatten |
US5152057A (en) * | 1987-11-17 | 1992-10-06 | Mold-Pac Corporation | Molded integrated circuit package |
US5438481A (en) * | 1987-11-17 | 1995-08-01 | Advanced Interconnections Corporation | Molded-in lead frames |
US5072283A (en) * | 1988-04-12 | 1991-12-10 | Bolger Justin C | Pre-formed chip carrier cavity package |
US4868349A (en) * | 1988-05-09 | 1989-09-19 | National Semiconductor Corporation | Plastic molded pin-grid-array power package |
US5081520A (en) * | 1989-05-16 | 1992-01-14 | Minolta Camera Kabushiki Kaisha | Chip mounting substrate having an integral molded projection and conductive pattern |
EP1020914B1 (en) * | 1989-10-09 | 2004-04-28 | Mitsubishi Materials Corporation | Ceramic substrate used for fabricating electric or electronic circuit |
US5012386A (en) * | 1989-10-27 | 1991-04-30 | Motorola, Inc. | High performance overmolded electronic package |
JPH03188654A (ja) * | 1989-12-18 | 1991-08-16 | Nippon Steel Corp | 樹脂モールド型半導体用放熱体 |
WO1992002040A1 (en) * | 1990-07-25 | 1992-02-06 | Dsm N.V. | Package for incorporating an integrated circuit and a process for the production of the package |
JPH04322452A (ja) * | 1991-04-23 | 1992-11-12 | Mitsubishi Electric Corp | 半導体装置、半導体素子収納容器および半導体装置の製造方法 |
JP2931741B2 (ja) * | 1993-09-24 | 1999-08-09 | 株式会社東芝 | 半導体装置 |
EP0645953B1 (de) * | 1993-09-29 | 1997-08-06 | Siemens NV | Verfahren zur Herstellung einer zwei- oder mehrlagigen Verdrahtung und danach hergestellte zwei- oder mehrlagige Verdrahtung |
PT782765E (pt) * | 1994-09-23 | 2000-12-29 | Imec Inter Uni Micro Electr | Embalagem matricial com saliencias de polimero |
US5609889A (en) * | 1995-05-26 | 1997-03-11 | Hestia Technologies, Inc. | Apparatus for encapsulating electronic packages |
-
1996
- 1996-10-10 DE DE59607546T patent/DE59607546D1/de not_active Expired - Fee Related
- 1996-10-10 AT AT96934620T patent/ATE204678T1/de not_active IP Right Cessation
- 1996-10-10 ES ES96934620T patent/ES2163043T3/es not_active Expired - Lifetime
- 1996-10-10 US US09/051,778 patent/US6122172A/en not_active Expired - Fee Related
- 1996-10-10 WO PCT/EP1996/004407 patent/WO1997015078A1/de active IP Right Grant
- 1996-10-10 JP JP09515493A patent/JP3037440B2/ja not_active Expired - Fee Related
- 1996-10-10 KR KR10-1998-0702732A patent/KR100430325B1/ko not_active IP Right Cessation
- 1996-10-10 EP EP96934620A patent/EP0856199B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP3037440B2 (ja) | 2000-04-24 |
ATE204678T1 (de) | 2001-09-15 |
EP0856199B1 (de) | 2001-08-22 |
KR100430325B1 (ko) | 2004-09-18 |
US6122172A (en) | 2000-09-19 |
WO1997015078A1 (de) | 1997-04-24 |
EP0856199A1 (de) | 1998-08-05 |
DE59607546D1 (de) | 2001-09-27 |
KR19990064244A (ko) | 1999-07-26 |
JPH11502064A (ja) | 1999-02-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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