JP2020505769A5 - - Google Patents
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- Publication number
- JP2020505769A5 JP2020505769A5 JP2019538671A JP2019538671A JP2020505769A5 JP 2020505769 A5 JP2020505769 A5 JP 2020505769A5 JP 2019538671 A JP2019538671 A JP 2019538671A JP 2019538671 A JP2019538671 A JP 2019538671A JP 2020505769 A5 JP2020505769 A5 JP 2020505769A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor
- microns
- layer
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1750646 | 2017-01-26 | ||
| FR1750646A FR3062238A1 (fr) | 2017-01-26 | 2017-01-26 | Support pour une structure semi-conductrice |
| PCT/EP2018/050677 WO2018137937A1 (en) | 2017-01-26 | 2018-01-11 | Support for a semiconductor structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2020505769A JP2020505769A (ja) | 2020-02-20 |
| JP2020505769A5 true JP2020505769A5 (enExample) | 2020-12-24 |
Family
ID=59253590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019538671A Pending JP2020505769A (ja) | 2017-01-26 | 2018-01-11 | 半導体構造用の支持体 |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US11373856B2 (enExample) |
| EP (1) | EP3574519B1 (enExample) |
| JP (1) | JP2020505769A (enExample) |
| KR (1) | KR20190108138A (enExample) |
| CN (1) | CN110199375A (enExample) |
| FR (1) | FR3062238A1 (enExample) |
| SG (1) | SG11201906017UA (enExample) |
| TW (1) | TW201841341A (enExample) |
| WO (1) | WO2018137937A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3062517B1 (fr) | 2017-02-02 | 2019-03-15 | Soitec | Structure pour application radiofrequence |
| FR3098342B1 (fr) | 2019-07-02 | 2021-06-04 | Soitec Silicon On Insulator | structure semi-conductrice comprenant une couche poreuse enterrée, pour applications RF |
| CN110687138B (zh) * | 2019-09-05 | 2022-08-05 | 长江存储科技有限责任公司 | 半导体结构的测量与边界特征提取方法及其装置 |
| FR3104322B1 (fr) | 2019-12-05 | 2023-02-24 | Soitec Silicon On Insulator | Procédé de formation d'un substrat de manipulation pour une structure composite ciblant des applications rf |
| CN115777139A (zh) * | 2020-07-28 | 2023-03-10 | 索泰克公司 | 将薄层转移到设有电荷俘获层的载体衬底的方法 |
| FR3113184B1 (fr) * | 2020-07-28 | 2022-09-16 | Soitec Silicon On Insulator | Procede de preparation d’un substrat support, et procede de report d’une couche mince sur ce substrat support |
| US11522516B2 (en) * | 2020-08-27 | 2022-12-06 | RF360 Europe GmbH | Thin-film surface-acoustic-wave filter using lithium niobate |
| CN116783719A (zh) * | 2020-12-31 | 2023-09-19 | 华为技术有限公司 | 一种集成电路、功率放大器及电子设备 |
| FR3127588B1 (fr) | 2021-09-28 | 2025-01-17 | Lynred | Procede de realisation d’au moins une fenetre optique, fenetre optique et detecteur infrarouge associes |
| FR3138239B1 (fr) * | 2022-07-19 | 2024-06-21 | Soitec Silicon On Insulator | Procédé de fabrication d’un substrat support pour application radiofréquences |
| WO2024134916A1 (ja) | 2022-12-19 | 2024-06-27 | 新電元工業株式会社 | 半導体装置 |
| JP7437568B1 (ja) | 2022-12-19 | 2024-02-22 | 新電元工業株式会社 | 半導体装置 |
| CN117594521A (zh) * | 2023-12-25 | 2024-02-23 | 中国科学院微电子研究所 | 一种低衬底漏电的rfsoi晶圆及其制备方法 |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6910A (en) * | 1849-11-27 | Abraham johnson and henry johnson | ||
| US269976A (en) * | 1883-01-02 | John watters | ||
| US347597A (en) * | 1886-08-17 | habyey | ||
| US10A (en) * | 1836-08-10 | Bariah Swift | Dye-wood and dye-stuff cutting and shaving machine | |
| EP2037009B1 (en) | 1999-03-16 | 2013-07-31 | Shin-Etsu Handotai Co., Ltd. | Method for producing a bonded SOI wafer |
| ES2287126T3 (es) | 2000-04-27 | 2007-12-16 | Verion Inc. | Microcapsulas de liberacion de orden cero y controladas por la temperatura y procedimiento para su preparacion. |
| FR2838865B1 (fr) | 2002-04-23 | 2005-10-14 | Soitec Silicon On Insulator | Procede de fabrication d'un substrat avec couche utile sur support de resistivite elevee |
| FR2860341B1 (fr) | 2003-09-26 | 2005-12-30 | Soitec Silicon On Insulator | Procede de fabrication de structure multicouche a pertes diminuees |
| CN1856873A (zh) * | 2003-09-26 | 2006-11-01 | 卢万天主教大学 | 制造具有降低的欧姆损耗的多层半导体结构的方法 |
| FR2880189B1 (fr) | 2004-12-24 | 2007-03-30 | Tracit Technologies Sa | Procede de report d'un circuit sur un plan de masse |
| US7217629B2 (en) * | 2005-07-15 | 2007-05-15 | International Business Machines Corporation | Epitaxial imprinting |
| FR2911431B1 (fr) * | 2007-01-16 | 2009-05-15 | Soitec Silicon On Insulator | Procede de fabrication de structures soi a couche isolante d'epaisseur controlee |
| FR2933233B1 (fr) * | 2008-06-30 | 2010-11-26 | Soitec Silicon On Insulator | Substrat de haute resistivite bon marche et procede de fabrication associe |
| US8252653B2 (en) * | 2008-10-21 | 2012-08-28 | Applied Materials, Inc. | Method of forming a non-volatile memory having a silicon nitride charge trap layer |
| FR2953640B1 (fr) | 2009-12-04 | 2012-02-10 | S O I Tec Silicon On Insulator Tech | Procede de fabrication d'une structure de type semi-conducteur sur isolant, a pertes electriques diminuees et structure correspondante |
| KR101913322B1 (ko) | 2010-12-24 | 2018-10-30 | 퀄컴 인코포레이티드 | 반도체 소자들을 위한 트랩 리치 층 |
| FR2973158B1 (fr) * | 2011-03-22 | 2014-02-28 | Soitec Silicon On Insulator | Procédé de fabrication d'un substrat de type semi-conducteur sur isolant pour applications radiofréquences |
| US8772059B2 (en) * | 2011-05-13 | 2014-07-08 | Cypress Semiconductor Corporation | Inline method to monitor ONO stack quality |
| FR2985812B1 (fr) | 2012-01-16 | 2014-02-07 | Soitec Silicon On Insulator | Procede et dispositif de test de substrats semi-conducteurs pour applications radiofrequences |
| JP5978986B2 (ja) * | 2012-12-26 | 2016-08-24 | 信越半導体株式会社 | 高周波半導体装置及び高周波半導体装置の製造方法 |
| US9601591B2 (en) * | 2013-08-09 | 2017-03-21 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US9768056B2 (en) | 2013-10-31 | 2017-09-19 | Sunedison Semiconductor Limited (Uen201334164H) | Method of manufacturing high resistivity SOI wafers with charge trapping layers based on terminated Si deposition |
| US9299736B2 (en) | 2014-03-28 | 2016-03-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Hybrid bonding with uniform pattern density |
| FR3019373A1 (fr) | 2014-03-31 | 2015-10-02 | St Microelectronics Sa | Procede de fabrication d'une plaque de semi-conducteur adaptee pour la fabrication d'un substrat soi et plaque de substrat ainsi obtenue |
| FR3024587B1 (fr) * | 2014-08-01 | 2018-01-26 | Soitec | Procede de fabrication d'une structure hautement resistive |
| US9853133B2 (en) * | 2014-09-04 | 2017-12-26 | Sunedison Semiconductor Limited (Uen201334164H) | Method of manufacturing high resistivity silicon-on-insulator substrate |
| US10381260B2 (en) * | 2014-11-18 | 2019-08-13 | GlobalWafers Co., Inc. | Method of manufacturing high resistivity semiconductor-on-insulator wafers with charge trapping layers |
| FR3029682B1 (fr) | 2014-12-04 | 2017-12-29 | Soitec Silicon On Insulator | Substrat semi-conducteur haute resistivite et son procede de fabrication |
| US9618474B2 (en) * | 2014-12-18 | 2017-04-11 | Edico Genome, Inc. | Graphene FET devices, systems, and methods of using the same for sequencing nucleic acids |
| US10006910B2 (en) * | 2014-12-18 | 2018-06-26 | Agilome, Inc. | Chemically-sensitive field effect transistors, systems, and methods for manufacturing and using the same |
| EP4120320A1 (en) * | 2015-03-03 | 2023-01-18 | GlobalWafers Co., Ltd. | Charge trapping polycrystalline silicon films on silicon substrates with controllable film stress |
| JP6344271B2 (ja) * | 2015-03-06 | 2018-06-20 | 信越半導体株式会社 | 貼り合わせ半導体ウェーハ及び貼り合わせ半導体ウェーハの製造方法 |
| US9881832B2 (en) * | 2015-03-17 | 2018-01-30 | Sunedison Semiconductor Limited (Uen201334164H) | Handle substrate for use in manufacture of semiconductor-on-insulator structure and method of manufacturing thereof |
| FR3037438B1 (fr) * | 2015-06-09 | 2017-06-16 | Soitec Silicon On Insulator | Procede de fabrication d'un element semi-conducteur comprenant une couche de piegeage de charges |
| KR101666753B1 (ko) | 2015-06-18 | 2016-10-14 | 주식회사 동부하이텍 | 고비저항 기판 상에 형성된 반도체 소자 및 무선 주파수 모듈 |
-
2017
- 2017-01-26 FR FR1750646A patent/FR3062238A1/fr not_active Withdrawn
-
2018
- 2018-01-11 EP EP18700172.2A patent/EP3574519B1/en active Active
- 2018-01-11 WO PCT/EP2018/050677 patent/WO2018137937A1/en not_active Ceased
- 2018-01-11 JP JP2019538671A patent/JP2020505769A/ja active Pending
- 2018-01-11 CN CN201880007067.4A patent/CN110199375A/zh active Pending
- 2018-01-11 US US16/476,415 patent/US11373856B2/en active Active
- 2018-01-11 SG SG11201906017UA patent/SG11201906017UA/en unknown
- 2018-01-11 KR KR1020197024048A patent/KR20190108138A/ko not_active Ceased
- 2018-01-12 TW TW107101223A patent/TW201841341A/zh unknown
-
2022
- 2022-06-02 US US17/805,206 patent/US20220301847A1/en active Pending