JP2019220628A - 基板処理装置および基板処理方法 - Google Patents
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Abstract
Description
<全体構成>
第1実施形態に係る基板処理装置1について図1を参照し説明する。図1は、第1実施形態に係る基板処理装置1の概略構成を示す模式図である。
次に、現像ユニット40について図3を参照し説明する。図3は、第1実施形態に係る現像ユニット40の概略構成を示す模式図である。図3では、コロ搬送機構44などの一部構成は説明のため省略する。以下で用いる図においても同様である。
次に、第1実施形態に係る基板処理装置1の現像処理部50の変形例について説明する。
基板処理装置1は、現像液(処理液の一例)で濡れた基板Sを搬送可能なコロ搬送機構44(搬送機構の一例)を有する可動ステージ61と、可動ステージ61を少なくとも上下方向に移動させるステージ移動機構62とを備える。具体的には、可動ステージ61は、現像液を液盛りした基板Sを搬送する。
<現像処理部の構成>
次に、第2実施形態に係る基板処理装置1の現像処理部50について図7〜図9を参照し説明する。図7は、第2実施形態に係る現像処理部50の左側方視における概略構成を示す模式図である。図8は、第2実施形態に係る現像処理部50の上方視における概略構成を示す模式図である。図9は、第2実施形態に係る現像処理部50の後方視における概略構成を示す模式図である。なお、ここでは、第1実施形態と異なる箇所を中心に説明し、第1実施形態と同様の構成については、第1実施形態と同じ符号を付し、詳しい説明は省略する。また、第2実施形態において適用可能な第1実施形態の変形例や、効果についても省略する。
次に、第2実施形態に係る基板処理装置1の現像処理部50の変形例について説明する。
ステージ移動機構62は、可動ステージ61を左右方向に移動させる。これにより、基板処理装置1は、前後方向における基板処理装置1の長さを短くすることができる。
<現像処理部の構成>
次に、第3実施形態に係る基板処理装置1の現像処理部50について図12を参照し説明する。図12は、第3実施形態に係る現像処理部50の左側方視における概略構成を示す模式図である。なお、ここでは、第1実施形態と異なる箇所を中心に説明し、第1実施形態と同様の構成については、第1実施形態と同じ符号を付し、詳しい説明は省略する。また、第3実施形態において適用可能な第1実施形態の変形例や、効果についても省略する。
次に、第3実施形態に係る基板処理装置1の現像処理部50の変形例について説明する。
基板処理装置1は、可動ステージ70によって搬入された基板Sを現像液によって現像する複数の現像ステージ71、75と、現像ステージ75の下方に設けられ、可動ステージ70から搬入された基板Sを洗浄するリンス処理部51(洗浄処理部の一例)とを備える。
40 現像ユニット
44 コロ搬送機構(搬送機構)
44a コロ
50 現像処理部
51 リンス処理部(洗浄処理部)
60 固定ステージ
61 可動ステージ
62 ステージ移動機構
70 可動ステージ
71 現像ステージ
75 現像ステージ
76 現像液供給ノズル
77 揺動機構
78 現像液回収ライン
79 洗浄水供給ノズル(洗浄水供給部)
80 洗浄水回収ライン
81 仕切り板
Claims (11)
- 処理液で濡れた基板を搬送可能な搬送機構を有する可動ステージと、
前記可動ステージを少なくとも上下方向に移動させるステージ移動機構と
を備える基板処理装置。 - 前記可動ステージは、
現像液が液盛りされた前記基板を搬送する
請求項1に記載の基板処理装置。 - 前記ステージ移動機構は、
前記可動ステージを前後方向に移動させる
請求項2に記載の基板処理装置。 - 前記ステージ移動機構は、
前記可動ステージを左右方向に移動させる
請求項2に記載の基板処理装置。 - 前記可動ステージから搬入された前記基板を洗浄する洗浄処理部
を備え、
前記可動ステージは、
前記ステージ移動機構によって下方に移動された状態で前記洗浄処理部に前記基板を搬入する
請求項2〜4のいずれか一つに記載の基板処理装置。 - 前記可動ステージによって搬入された前記基板を現像液によって現像する複数の現像ステージと、
前記現像ステージの下方に設けられ、前記可動ステージから搬入された前記基板を洗浄する洗浄処理部と
を備える請求項1に記載の基板処理装置。 - 前記現像ステージは、
前記基板を前記現像液に浸漬して前記基板を現像する
請求項6に記載の基板処理装置。 - 前記現像ステージを揺動させる揺動機構と、
前記揺動機構によって前記現像ステージが揺動されることで、前記現像ステージから排出される前記現像液を回収する現像液回収ラインと、
前記揺動機構によって前記現像ステージが揺動され、前記現像液が排出された状態の前記現像ステージに洗浄水を供給する洗浄水供給部と、
前記現像ステージから排出される前記洗浄水を回収する洗浄水回収ラインと、
前記現像ステージから排出される前記現像液、または前記洗浄水を前記現像液回収ライン、または前記洗浄水回収ラインに選択的に流入させる可動式の仕切り板と
を備える
請求項7に記載の基板処理装置。 - 前記搬送機構は、
前記基板の搬送速度を変更可能である
請求項1〜8のいずれか一つに記載の基板処理装置。 - 前記搬送機構は、
前記基板を前記可動ステージで前進、および後退させる
請求項1〜9のいずれか一つに記載の基板処理装置。 - 処理液で濡れた基板を搬送可能な搬送機構を有する可動ステージ内で、前記基板を搬送する工程と、
前記可動ステージを少なくとも上下方向に移動させる工程と
を有する基板処理方法。
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JP2018118420A JP7097759B2 (ja) | 2018-06-22 | 2018-06-22 | 基板処理装置および基板処理方法 |
KR1020190071713A KR20200000349A (ko) | 2018-06-22 | 2019-06-17 | 기판 처리 장치 및 기판 처리 방법 |
CN201910530951.2A CN110634766A (zh) | 2018-06-22 | 2019-06-19 | 基片处理装置和基片处理方法 |
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JP2018118420A JP7097759B2 (ja) | 2018-06-22 | 2018-06-22 | 基板処理装置および基板処理方法 |
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Cited By (3)
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---|---|---|---|---|
WO2022019104A1 (ja) * | 2020-07-20 | 2022-01-27 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法およびプログラム |
KR20230124472A (ko) | 2022-02-18 | 2023-08-25 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 처리 방법 |
KR20230130525A (ko) | 2022-03-03 | 2023-09-12 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 처리 방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007227736A (ja) * | 2006-02-24 | 2007-09-06 | Tokyo Electron Ltd | 現像処理装置、現像処理方法、コンピュータ読取可能な記憶媒体 |
JP2008004898A (ja) * | 2006-06-26 | 2008-01-10 | Future Vision:Kk | 基板搬送装置、基板搬送方法および基板処理システム |
JP2013102153A (ja) * | 2011-10-21 | 2013-05-23 | Tokyo Electron Ltd | 処理ステージ装置及びそれを用いる塗布処理装置 |
JP2016114784A (ja) * | 2014-12-15 | 2016-06-23 | 東京応化工業株式会社 | 紫外線照射装置、紫外線照射方法、基板処理装置、及び基板処理装置の製造方法 |
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JP3850281B2 (ja) * | 2001-12-11 | 2006-11-29 | 東京応化工業株式会社 | 基板処理システム |
TWI234796B (en) * | 2002-03-04 | 2005-06-21 | Tokyo Electron Ltd | Solution treatment method and solution treatment unit |
JP4313284B2 (ja) * | 2004-11-15 | 2009-08-12 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP4554397B2 (ja) * | 2005-02-23 | 2010-09-29 | 東京エレクトロン株式会社 | ステージ装置および塗布処理装置 |
JP4413829B2 (ja) * | 2005-08-03 | 2010-02-10 | 東京エレクトロン株式会社 | 現像処理装置及び現像処理方法 |
JP5099054B2 (ja) * | 2009-03-13 | 2012-12-12 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法、塗布、現像装置、塗布、現像方法及び記憶媒体 |
JP5797532B2 (ja) * | 2011-02-24 | 2015-10-21 | 東京エレクトロン株式会社 | 有機溶剤を含有する現像液を用いた現像処理方法及び現像処理装置 |
KR101137447B1 (ko) * | 2011-08-31 | 2012-06-14 | (주)케이앤씨테크놀로지 | 기판 이동 장치 및 이를 이용한 기판 이동 방법 |
CN104425321B (zh) * | 2013-08-30 | 2017-09-29 | 细美事有限公司 | 基板处理装置以及方法、包括该装置的基板处理系统 |
JP5735161B1 (ja) * | 2014-07-08 | 2015-06-17 | 中外炉工業株式会社 | 塗布装置及びその改良方法 |
CN106125518A (zh) * | 2016-08-31 | 2016-11-16 | 武汉华星光电技术有限公司 | 显影设备 |
-
2018
- 2018-06-22 JP JP2018118420A patent/JP7097759B2/ja active Active
-
2019
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007227736A (ja) * | 2006-02-24 | 2007-09-06 | Tokyo Electron Ltd | 現像処理装置、現像処理方法、コンピュータ読取可能な記憶媒体 |
JP2008004898A (ja) * | 2006-06-26 | 2008-01-10 | Future Vision:Kk | 基板搬送装置、基板搬送方法および基板処理システム |
JP2013102153A (ja) * | 2011-10-21 | 2013-05-23 | Tokyo Electron Ltd | 処理ステージ装置及びそれを用いる塗布処理装置 |
JP2016114784A (ja) * | 2014-12-15 | 2016-06-23 | 東京応化工業株式会社 | 紫外線照射装置、紫外線照射方法、基板処理装置、及び基板処理装置の製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022019104A1 (ja) * | 2020-07-20 | 2022-01-27 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法およびプログラム |
KR20230124472A (ko) | 2022-02-18 | 2023-08-25 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 처리 방법 |
KR20230130525A (ko) | 2022-03-03 | 2023-09-12 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 처리 방법 |
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