JP2019197920A - 半導体装置および半導体モジュール - Google Patents
半導体装置および半導体モジュール Download PDFInfo
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- JP2019197920A JP2019197920A JP2019138919A JP2019138919A JP2019197920A JP 2019197920 A JP2019197920 A JP 2019197920A JP 2019138919 A JP2019138919 A JP 2019138919A JP 2019138919 A JP2019138919 A JP 2019138919A JP 2019197920 A JP2019197920 A JP 2019197920A
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- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42356—Disposition, e.g. buried gate electrode
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- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
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- H01L29/4238—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the surface lay-out
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- H01L29/76—Unipolar devices, e.g. field effect transistors
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Abstract
Description
2 アクティブ領域
4 ゲートパッド
5 ゲートフィンガー
7 内側セル領域
12 パッド周辺部
13 第1フィンガー
14 第2フィンガー
15 主部位
16 枝部
18 トランジスタセル
19 ゲート電極
20 ゲートコンタクト
21 内蔵抵抗
22 パッド側コンタクト
23 セル側コンタクト
24 周縁部
27 SiC基板
28 SiCエピタキシャル層
29 p−型ボディ領域
30 n+型ボディ領域
31 p+型ボディコンタクト領域
32 チャネル領域
33 p+型領域
34 p−型領域
35 ゲート絶縁膜
36 層間膜
37 パッド側コンタクト
38 パッド側コンタクト
39 ゲートトレンチ
44 ゲートメタル
Claims (27)
- SiC半導体層と、
前記SiC半導体層の表面側に形成され、制御パッドに入力される制御電圧をその制御電極に受けてオン/オフ制御される複数のトランジスタセルと、
前記制御パッドよりも前記SiC半導体層側に配置され、前記制御パッドと前記制御電極とを電気的に接続するとともに、前記複数のトランジスタセルのオン抵抗値のばらつきを低減するための内蔵抵抗とを含み、
前記制御パッドの表面には、最表面に形成された表面絶縁膜から露出してボンディングワイヤが接続される第1のワイヤ領域が選択的に形成されており、
前記内蔵抵抗は、前記SiC半導体層の法線方向から見た平面視において、前記第1のワイヤ領域を回避した領域に選択的に配置され、
前記複数のトランジスタセルの上方には、前記複数のトランジスタセルの一方の主電極が接続されかつ前記制御パッドとは異なる主電極パッドが配置されており、
前記主電極パッドの表面には、前記表面絶縁膜から露出してボンディングワイヤが接続される第2のワイヤ領域が選択的に形成されている、半導体装置。 - 前記制御パッドは、前記表面絶縁膜に周囲を取り囲まれて独立して形成されており、
前記内蔵抵抗は、層間膜を介して前記制御パッドの下方領域の前記第1のワイヤ領域を外れた領域に配置されている、請求項1に記載の半導体装置。 - 前記内蔵抵抗の一部は、前記制御パッドの下方領域に配置されており、
前記制御パッドの下方領域のうち前記内蔵抵抗が配置されていない第1領域には、前記層間膜が埋設されている、請求項2に記載の半導体装置。 - 前記内蔵抵抗と前記SiC半導体層との間に配置された絶縁膜をさらに含み、
前記第1領域には、前記絶縁膜の延長部で構成された膜が前記層間膜と前記SiC半導体層との間に配置されている、請求項3に記載の半導体装置。 - 前記SiC半導体層において、前記絶縁膜を挟んで前記内蔵抵抗に対向する領域には、1×1019cm−3以下の濃度を有する不純物領域が選択的に形成されている、請求項4に記載の半導体装置。
- 前記内蔵抵抗の前記一部は、前記制御パッドの周縁部の下方に配置されており、
前記第1のワイヤ領域は、前記周縁部に取り囲まれた前記制御パッドの中央部に形成されている、請求項1〜5のいずれか一項に記載の半導体装置。 - 前記層間膜を貫通し、前記制御パッドと前記内蔵抵抗とを電気的に接続するコンタクトビアとを含む、請求項2〜5のいずれか一項に記載の半導体装置。
- 前記内蔵抵抗は、前記SiC半導体層の法線方向から見た平面視において、互いに対称性を持って複数配置されている、請求項1〜7のいずれか一項に記載の半導体装置。
- 前記制御電極は、p型のポリシリコンからなる、請求項1〜8のいずれか一項に記載の半導体装置。
- 前記制御電極は、p型不純物としてB(ホウ素)を含んでいる、請求項9に記載の半導体装置。
- 前記内蔵抵抗の抵抗値は、2Ω〜40Ωである、請求項1〜10のいずれか一項に記載の半導体装置。
- 前記制御電極の抵抗値および前記内蔵抵抗の抵抗値を合計した抵抗値は、4Ω〜50Ωである、請求項1〜11のいずれか一項に記載の半導体装置。
- 前記内蔵抵抗のシート抵抗は、10Ω/□以上である、請求項1〜12のいずれか一項に記載の半導体装置。
- 前記SiC半導体層の法線方向から見た平面視において前記内蔵抵抗の大きさは、1つ当たり200μm□以下である、請求項1〜13のいずれか一項に記載の半導体装置。
- 前記内蔵抵抗の厚さは、2μm以下である、請求項1〜14のいずれか一項に記載の半導体装置。
- 前記制御パッドと同様に前記半導体装置の表面側に配置され、前記複数のトランジスタセル領域を複数の領域に区画するように前記制御パッドから延びるフィンガーをさらに含み、
前記内蔵抵抗は、前記制御パッドと前記フィンガーとを電気的に接続している、請求項1〜15のいずれか一項に記載の半導体装置。 - 前記フィンガーは、前記制御パッドの周囲を囲むように配置された部分を有する、請求項16に記載の半導体装置。
- 前記フィンガーは、メタル配線からなる、請求項16に記載の半導体装置。
- 前記メタル配線は、AlまたはAlCuまたはCuのいずれか1つからなる、請求項17に記載の半導体装置。
- 前記トランジスタセルがMOSFETセルを構成しており、
前記制御パッドは、前記MOSFETセルの制御電極に接続され、
前記主電極パッドは前記MOSFETセルのソース電極に接続され、
前記SiC半導体層の裏面側に形成されたドレイン電極を含む、請求項1〜19のいずれか一項に記載の半導体装置。 - 前記MOSFETセルは、プレーナゲート構造を含む、請求項20に記載の半導体装置。
- 前記MOSFETセルは、トレンチゲート構造を含む、請求項20に記載の半導体装置。
- 前記トランジスタセルがIGBTセルを構成しており、
前記制御パッドは、前記IGBTセルの制御電極に接続され、
前記主電極パッドは前記IGBTセルのエミッタ電極に接続され、
前記SiC半導体層の裏面側に形成されたコレクタ電極を含む、請求項1〜19のいずれか一項に記載の半導体装置。 - 前記複数のトランジスタセルは、格子状に配置されている、請求項1〜23のいずれか一項に記載の半導体装置。
- 半導体層と、
前記半導体層の表面側に形成され、制御パッドに入力される制御電圧を制御電極に受けてオン/オフ制御される複数のトランジスタセルと、
前記複数のトランジスタセルが形成された領域を複数の領域に区画するように前記制御パッドから延び、前記制御パッドに電気的に接続されたフィンガーと、
前記制御パッドおよび前記フィンガーよりも前記半導体層側に配置され、前記制御パッドと前記フィンガーとを電気的に接続し、前記フィンガーと同じがそれよりも大きい抵抗値を有する材料からなる内蔵抵抗とを含み、
前記制御パッドの表面には、最表面に形成された表面絶縁膜から露出してボンディングワイヤがボンディングされる第1のワイヤ領域が選択的に形成されており、
前記内蔵抵抗は、前記半導体層の法線方向から見た平面視において、前記第1のワイヤ領域を回避した領域に選択的に配置され、
前記複数のトランジスタセルの上方には、前記複数のトランジスタセルの一方の主電極が接続されかつ前記制御パッドとは異なる主電極パッドが配置されており、
前記主電極パッドの表面には、前記表面絶縁膜から露出してボンディングワイヤが接続される第2のワイヤ領域が選択的に形成されている、半導体装置。 - 前記内蔵抵抗は、メタルからなる、請求項25に記載の半導体装置。
- 請求項1乃至請求項26のいずれか1項に記載の半導体装置を複数個並列接続したことを特徴とする半導体モジュール。
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Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015080162A1 (ja) | 2013-11-28 | 2015-06-04 | ローム株式会社 | 半導体装置 |
DE102015120747B4 (de) * | 2015-11-30 | 2020-10-22 | Infineon Technologies Austria Ag | Transistorbauelement mit erhöhter gate-drain-kapazität |
JP6941502B2 (ja) * | 2016-09-30 | 2021-09-29 | ローム株式会社 | 半導体装置および半導体パッケージ |
US10692863B2 (en) | 2016-09-30 | 2020-06-23 | Rohm Co., Ltd. | Semiconductor device and semiconductor package |
US10403623B2 (en) * | 2017-07-06 | 2019-09-03 | General Electric Company | Gate networks having positive temperature coefficients of resistance (PTC) for semiconductor power conversion devices |
US10665713B2 (en) * | 2017-09-28 | 2020-05-26 | Mitsubishi Electric Corporation | Silicon carbide semiconductor device |
JP6958474B2 (ja) * | 2017-09-28 | 2021-11-02 | 三菱電機株式会社 | 炭化珪素半導体装置 |
EP3531457B1 (en) * | 2018-02-26 | 2022-07-20 | Infineon Technologies Austria AG | Transistor device with gate resistor |
JP7172317B2 (ja) | 2018-09-11 | 2022-11-16 | 富士電機株式会社 | 半導体装置 |
CN117039796A (zh) * | 2018-11-02 | 2023-11-10 | 罗姆股份有限公司 | 半导体单元、半导体装置、电池单元以及车辆 |
JP7139232B2 (ja) * | 2018-12-07 | 2022-09-20 | ルネサスエレクトロニクス株式会社 | 半導体装置及び半導体装置の製造方法 |
JP7234713B2 (ja) | 2019-03-14 | 2023-03-08 | 富士電機株式会社 | 半導体装置 |
EP3716340A1 (en) * | 2019-03-25 | 2020-09-30 | Infineon Technologies Austria AG | Transistor device |
CN111403341B (zh) * | 2020-03-28 | 2023-03-28 | 电子科技大学 | 降低窄控制栅结构栅电阻的金属布线方法 |
JPWO2021200543A1 (ja) | 2020-03-30 | 2021-10-07 | ||
JPWO2022059597A1 (ja) | 2020-09-17 | 2022-03-24 | ||
US11664436B2 (en) * | 2021-03-01 | 2023-05-30 | Wolfspeed, Inc. | Semiconductor devices having gate resistors with low variation in resistance values |
KR102606591B1 (ko) * | 2021-03-29 | 2023-11-29 | 누보톤 테크놀로지 재팬 가부시키가이샤 | 반도체 장치, 전지 보호 회로, 및, 파워 매니지먼트 회로 |
US11810912B2 (en) | 2021-07-22 | 2023-11-07 | Wolfspeed, Inc. | Semiconductor devices having asymmetric integrated gate resistors for balanced turn-on/turn-off behavior |
JP2023017246A (ja) * | 2021-07-26 | 2023-02-07 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08288512A (ja) * | 1995-04-05 | 1996-11-01 | Siemens Ag | 電界効果により制御可能の半導体デバイス |
JPH11312786A (ja) * | 1998-04-30 | 1999-11-09 | Hitachi Ltd | 半導体集積回路 |
JP2001250948A (ja) * | 2000-03-03 | 2001-09-14 | Sanyo Electric Co Ltd | 絶縁ゲート型半導体装置 |
JP2002083964A (ja) * | 2000-09-06 | 2002-03-22 | Hitachi Ltd | 半導体素子及びこれを用いた半導体装置と変換器 |
JP2003197914A (ja) * | 2001-12-28 | 2003-07-11 | Fuji Electric Co Ltd | 半導体装置 |
JP2005228851A (ja) * | 2004-02-12 | 2005-08-25 | Mitsubishi Electric Corp | Igbtモジュール |
JP2009543324A (ja) * | 2006-07-03 | 2009-12-03 | フリースケール セミコンダクター インコーポレイテッド | 静電気放電保護装置及びそのための方法 |
JP2010016103A (ja) * | 2008-07-02 | 2010-01-21 | Panasonic Corp | 半導体装置 |
WO2011045834A1 (ja) * | 2009-10-14 | 2011-04-21 | 三菱電機株式会社 | 電力用半導体装置 |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0758781B2 (ja) | 1985-10-24 | 1995-06-21 | 三菱電機株式会社 | 電界効果型半導体装置 |
JPS62224074A (ja) * | 1986-03-26 | 1987-10-02 | Hitachi Ltd | 絶縁ゲ−ト半導体装置 |
JPH01305576A (ja) * | 1988-06-03 | 1989-12-08 | Fujitsu Ltd | Mis型電界効果トランジスタ |
US6236088B1 (en) | 1997-06-30 | 2001-05-22 | Intersil Corporation | Semiconductor device gate structure for thermal overload protection |
JP2000294770A (ja) | 1999-04-09 | 2000-10-20 | Rohm Co Ltd | 半導体装置 |
JP3881840B2 (ja) | 2000-11-14 | 2007-02-14 | 独立行政法人産業技術総合研究所 | 半導体装置 |
JP2002368218A (ja) | 2001-06-08 | 2002-12-20 | Sanyo Electric Co Ltd | 絶縁ゲート型半導体装置 |
KR100446293B1 (ko) * | 2002-01-07 | 2004-09-01 | 삼성전자주식회사 | 저항체를 포함하는 반도체 소자 제조 방법 |
JP2004172448A (ja) | 2002-11-21 | 2004-06-17 | Renesas Technology Corp | 半導体装置 |
KR100629357B1 (ko) * | 2004-11-29 | 2006-09-29 | 삼성전자주식회사 | 퓨즈 및 부하저항을 갖는 낸드 플래시메모리소자 형성방법 |
KR20070013132A (ko) * | 2005-07-25 | 2007-01-30 | 삼성전자주식회사 | 박막트랜지스터 기판과 박막트랜지스터 기판의 제조방법 |
JP2007042817A (ja) | 2005-08-02 | 2007-02-15 | Sanyo Electric Co Ltd | 絶縁ゲート型半導体装置およびその製造方法 |
US20070176295A1 (en) * | 2006-02-01 | 2007-08-02 | International Business Machines Corporation | Contact via scheme with staggered vias |
JP5048273B2 (ja) * | 2006-05-10 | 2012-10-17 | オンセミコンダクター・トレーディング・リミテッド | 絶縁ゲート型半導体装置 |
US7443225B2 (en) * | 2006-06-30 | 2008-10-28 | Alpha & Omega Semiconductor, Ltd. | Thermally stable semiconductor power device |
JP2008270492A (ja) | 2007-04-19 | 2008-11-06 | Sanyo Electric Co Ltd | 絶縁ゲート型半導体装置 |
JP5132977B2 (ja) | 2007-04-26 | 2013-01-30 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP5138274B2 (ja) * | 2007-05-25 | 2013-02-06 | 三菱電機株式会社 | 半導体装置 |
US7829374B2 (en) * | 2007-07-20 | 2010-11-09 | Panasonic Corporation | Silicon carbide semiconductor device and method for manufacturing the same |
JP4442698B2 (ja) * | 2007-07-25 | 2010-03-31 | 三菱電機株式会社 | 炭化珪素半導体装置の製造方法 |
JP2010087124A (ja) | 2008-09-30 | 2010-04-15 | Sanyo Electric Co Ltd | 絶縁ゲート型半導体装置 |
JP2010153636A (ja) * | 2008-12-25 | 2010-07-08 | Sanyo Electric Co Ltd | 絶縁ゲート型半導体装置 |
US8324686B2 (en) * | 2009-01-16 | 2012-12-04 | Infineon Technologies Austria Ag | Semiconductor device and method for manufacturing |
JP2010238885A (ja) | 2009-03-31 | 2010-10-21 | Renesas Electronics Corp | 半導体装置とその製造方法 |
JP5476028B2 (ja) * | 2009-04-17 | 2014-04-23 | 株式会社日立製作所 | パワー半導体スイッチング素子のゲート駆動回路及びインバータ回路 |
US8053809B2 (en) * | 2009-05-26 | 2011-11-08 | International Business Machines Corporation | Device including high-K metal gate finfet and resistive structure and method of forming thereof |
DE112011101254B4 (de) | 2010-04-06 | 2017-04-06 | Mitsubishi Electric Corporation | Leistungshalbleiterbauteile und Verfahren zu deren Herstellung |
JP5755533B2 (ja) | 2011-08-26 | 2015-07-29 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP5805585B2 (ja) | 2012-05-23 | 2015-11-04 | 日本電信電話株式会社 | 中継サーバおよび代理アクセス方法 |
CN105324833B (zh) * | 2013-06-14 | 2018-02-02 | 新电元工业株式会社 | 半导体装置的制造方法以及半导体装置 |
CN103367164B (zh) * | 2013-06-26 | 2015-11-11 | 株洲南车时代电气股份有限公司 | 一种栅极电极及其制备方法 |
WO2015080162A1 (ja) | 2013-11-28 | 2015-06-04 | ローム株式会社 | 半導体装置 |
-
2014
- 2014-11-26 WO PCT/JP2014/081273 patent/WO2015080162A1/ja active Application Filing
- 2014-11-26 CN CN201480065081.1A patent/CN106415837B/zh active Active
- 2014-11-26 EP EP19215868.1A patent/EP3644363B1/en active Active
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- 2014-11-26 US US15/039,725 patent/US9917102B2/en active Active
- 2014-11-26 CN CN201910879948.1A patent/CN110634825B/zh active Active
- 2014-11-26 JP JP2015550968A patent/JP6595915B2/ja active Active
- 2014-11-26 EP EP22199701.8A patent/EP4141953A1/en active Pending
-
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- 2018-01-30 US US15/883,690 patent/US10438971B2/en active Active
-
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- 2019-07-29 JP JP2019138919A patent/JP2019197920A/ja active Pending
- 2019-08-29 US US16/555,843 patent/US10886300B2/en active Active
-
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- 2020-12-02 US US17/109,676 patent/US11367738B2/en active Active
-
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- 2021-09-21 JP JP2021152878A patent/JP7413329B2/ja active Active
-
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- 2022-05-19 US US17/748,633 patent/US11908868B2/en active Active
-
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- 2023-12-27 JP JP2023221217A patent/JP2024038171A/ja active Pending
-
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- 2024-01-17 US US18/414,540 patent/US20240153955A1/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08288512A (ja) * | 1995-04-05 | 1996-11-01 | Siemens Ag | 電界効果により制御可能の半導体デバイス |
JPH11312786A (ja) * | 1998-04-30 | 1999-11-09 | Hitachi Ltd | 半導体集積回路 |
JP2001250948A (ja) * | 2000-03-03 | 2001-09-14 | Sanyo Electric Co Ltd | 絶縁ゲート型半導体装置 |
JP2002083964A (ja) * | 2000-09-06 | 2002-03-22 | Hitachi Ltd | 半導体素子及びこれを用いた半導体装置と変換器 |
JP2003197914A (ja) * | 2001-12-28 | 2003-07-11 | Fuji Electric Co Ltd | 半導体装置 |
JP2005228851A (ja) * | 2004-02-12 | 2005-08-25 | Mitsubishi Electric Corp | Igbtモジュール |
JP2009543324A (ja) * | 2006-07-03 | 2009-12-03 | フリースケール セミコンダクター インコーポレイテッド | 静電気放電保護装置及びそのための方法 |
JP2010016103A (ja) * | 2008-07-02 | 2010-01-21 | Panasonic Corp | 半導体装置 |
WO2011045834A1 (ja) * | 2009-10-14 | 2011-04-21 | 三菱電機株式会社 | 電力用半導体装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11756863B2 (en) | 2020-09-18 | 2023-09-12 | Kabushiki Kaisha Toshiba | Semiconductor device |
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JP2024038171A (ja) | 2024-03-19 |
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CN110634825B (zh) | 2023-04-18 |
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EP3644363A1 (en) | 2020-04-29 |
JP6595915B2 (ja) | 2019-10-23 |
US20240153955A1 (en) | 2024-05-09 |
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