JP2018531506A5 - - Google Patents

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Publication number
JP2018531506A5
JP2018531506A5 JP2018515554A JP2018515554A JP2018531506A5 JP 2018531506 A5 JP2018531506 A5 JP 2018531506A5 JP 2018515554 A JP2018515554 A JP 2018515554A JP 2018515554 A JP2018515554 A JP 2018515554A JP 2018531506 A5 JP2018531506 A5 JP 2018531506A5
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Japan
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layer
forming
line
different
different materials
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JP2018515554A
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JP2018531506A6 (ja
JP2018531506A (ja
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Priority claimed from PCT/US2016/052694 external-priority patent/WO2017053316A1/en
Publication of JP2018531506A publication Critical patent/JP2018531506A/ja
Publication of JP2018531506A6 publication Critical patent/JP2018531506A6/ja
Publication of JP2018531506A5 publication Critical patent/JP2018531506A5/ja
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JP2018515554A 2015-09-24 2016-09-20 サブ解像度基板パターニングのためのエッチングマスクを形成する方法 Pending JP2018531506A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562232005P 2015-09-24 2015-09-24
US62/232,005 2015-09-24
US201562258119P 2015-11-20 2015-11-20
US62/258,119 2015-11-20
PCT/US2016/052694 WO2017053316A1 (en) 2015-09-24 2016-09-20 Methods of forming etch masks for sub-resolution substrate patterning

Publications (3)

Publication Number Publication Date
JP2018531506A JP2018531506A (ja) 2018-10-25
JP2018531506A6 JP2018531506A6 (ja) 2018-12-13
JP2018531506A5 true JP2018531506A5 (enExample) 2019-10-31

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Family Applications (2)

Application Number Title Priority Date Filing Date
JP2018515554A Pending JP2018531506A (ja) 2015-09-24 2016-09-20 サブ解像度基板パターニングのためのエッチングマスクを形成する方法
JP2018515551A Active JP6726834B2 (ja) 2015-09-24 2016-09-20 サブ解像度基板パターニングのためのエッチングマスクを形成する方法

Family Applications After (1)

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JP2018515551A Active JP6726834B2 (ja) 2015-09-24 2016-09-20 サブ解像度基板パターニングのためのエッチングマスクを形成する方法

Country Status (6)

Country Link
US (2) US10020196B2 (enExample)
JP (2) JP2018531506A (enExample)
KR (2) KR102705674B1 (enExample)
CN (2) CN108292591A (enExample)
TW (2) TWI620995B (enExample)
WO (2) WO2017053296A1 (enExample)

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