JP2018524415A - 焼結可能フィルムおよびペーストおよびその使用方法 - Google Patents
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- JP2018524415A JP2018524415A JP2017558433A JP2017558433A JP2018524415A JP 2018524415 A JP2018524415 A JP 2018524415A JP 2017558433 A JP2017558433 A JP 2017558433A JP 2017558433 A JP2017558433 A JP 2017558433A JP 2018524415 A JP2018524415 A JP 2018524415A
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Abstract
Description
予期しないほど低い温度および圧力のラミネート特性を有する焼結フィルムを製造する組成物および方法が本明細書に記載される。具体的には、本明細書に記載の組成物は、結合剤、充填剤、および低温および低圧ラミネートフィルムをもたらす他の成分を含む。 フィルムは、半導体のダイアタッチ材料としてのフィルムの焼結能力を犠牲にすることなく、改善された加工性および濡れ性を示す。さらに、本明細書に記載の組成物から得られる焼結フィルムは、特に柔軟性があり、生産コーターによってロールとして調製することができる。
1種以上のエポキシモノマー、オリゴマーまたはポリマー、アクリルモノマー、オリゴマーまたはポリマー、フェノール系、ノボラック(novalac)、ポリウレタン、シアネートエステル、ポリビニルアルコール、ポリエステル、ポリ尿素、ポリビニルアセタール樹脂、フェノキシ樹脂、マレイミド、ビスマレイミド、ポリイミドまたはそれらの混合物を含む、少なくとも1種の熱硬化性樹脂または熱可塑性樹脂成分、
1種以上の導電性充填剤、および
任意に有機希釈剤を含む焼結フィルムのための組成物であって、組成物が、
100℃以下の温度および40psi以下の圧力でウエハー上にラミネートされ、
硬化または焼結時に、チタン−ニッケル−銀で金属化されたダイおよび銀リードフレーム基板を用いて測定して、260℃で少なくとも1.0kg/mm2のダイせん断強度を有する、組成物を提供する。
1種以上のエポキシモノマー、オリゴマーまたはポリマー、アクリルモノマー、オリゴマーまたはポリマー、フェノール系、ノボラック、ポリウレタン、シアネートエステル、ポリビニルアルコール、ポリエステル、ポリ尿素、ポリビニルアセタール樹脂、フェノキシ樹脂、マレイミド、ビスマレイミド、ポリイミドまたはそれらの混合物を含む、少なくとも1種の熱硬化性樹脂または熱可塑性樹脂成分、
1種以上の導電性充填剤、
任意に粒状充填剤、および
有機希釈剤を含む焼結ペーストのための組成物であって、組成物が、
硬化または焼結時に、チタン−ニッケル−銀で金属化されたダイおよび銀リードフレーム基板を用いて測定して、260℃で少なくとも1.0kg/mm2のダイせん断強度を有する、組成物を提供する。
HOOC[(Bu)x(ACN)y]mCOOH
式中、
各Buは、ブチレン部分(例えば、1,2−ブタジエニルまたは1,4−ブタジエニル)であり、
各ACNはアクリロニトリル部分であり、
Bu単位およびACN単位は、ランダムまたはブロックで配置することができ、
xおよびyの各々は0より大きく、x+yの合計は、1であり、
x:yの比は、約10:1〜1:10の範囲にあり、および
mは、約20〜約100の範囲にある。
(a)米国特許第4,020,036号(その全内容は参照により本明細書に組み込まれる)に記載され、重量平均分子量(Mw)が30,000〜400,000またはそれ以上であり、共役ジエンが1分子当たり4〜11個の炭素原子を含む(例えば、1,3−ブタジエン、イソプレンなど)共役ジエンのホモポリマーまたはコポリマー;
(b)エピハロヒドリンホモポリマー、2種以上のエピハロヒドリンモノマーのコポリマーまたはエピハロヒドリンモノマーと数平均分子量(Mn)が約800〜約50,000の酸化物モノマーとのコポリマー(米国特許第4,101,604号(全体の内容は参照により本明細書に組み込まれる)に記載される);
(c)エチレン/プロピレン/ヘキサジエン/ノルボルナジエンなどのエチレン/プロピレンコポリマーおよびエチレン/プロピレンと少なくとも1種の非共役ジエンとのコポリマーを含む炭化水素ポリマー(米国特許第4,161,471号に記載される。);または
(d)共役ジエンブチルエラストマー、例えば炭素原子数4〜14の共役マルチオレフィン約0.5〜約15重量%と組み合わせたC4〜C5オレフィン85〜99.5重量%からなるコポリマーであり、イソブチレンおよびイソプレンのコポリマーであり、その中で組み合わされたイソプレン単位の大部分が共役ジエン不飽和を有する共役ジエンブチルエラストマー(例えば、米国特許第4,160,759号明細書を参照し、その全内容は参照により本明細書に組み込まれる。)
R1およびR2は、それぞれ独立して、Hまたは低級アルキルであり、
R3は、H、飽和または不飽和ヒドロカルビル、またはエポキシであり、
上述した少なくとも1つのエポキシ含有繰り返し単位および少なくとも1つの上記のオレフィン繰り返し単位が各オリゴマー中に存在し、存在する場合、各繰り返し単位の1〜10の範囲で存在し、および
nは、2〜150の範囲にある。
10重量%までの1種類以上のエポキシモノマー、オリゴマーまたはポリマー、
10重量%までの前記アクリルモノマー、オリゴマーまたはポリマー、
任意に4重量%までの前記イミド含有モノマー、オリゴマー、またはポリマー、
少なくとも65重量%の前記導電性充填剤、
任意に、5重量%までの接着促進剤、導電性促進剤、および界面活性剤から選択される追加の成分、および
任意に20重量%までの粒状充填剤を含む。
任意に、組成物は30重量%までの有機希釈剤を含むことができる。
1〜10重量%の前記1種以上のエポキシモノマー、オリゴマーまたはポリマー、
1〜10重量%の前記アクリルモノマー、オリゴマーまたはポリマー、
65〜95重量%の前記導電性充填剤、
任意に、5重量%までの接着促進剤、導電性促進剤、および界面活性剤から選択される1種以上の追加の成分、
任意に3〜20質量%の粒子状充填剤の範囲である。
任意に、組成物は、5重量%までの有機希釈剤を含むことができる。
1〜6重量%の前記1種類以上のエポキシモノマー、オリゴマーまたはポリマー、
任意に3重量%まで(すなわち、0〜3重量%)の前記アクリルモノマー、オリゴマーまたはポリマー、
65〜95重量%の前記導電性充填剤、
任意に5重量%までの接着促進剤、導電性促進剤、および界面活性剤から選択される追加の成分、
3〜20重量%の粒状充填剤の範囲である。
任意に、組成物は、30重量%までの有機希釈剤を含むことができる。
本明細書に記載される焼結フィルムのための組成物をウエハーに適用する工程;
100℃以下の温度及び40psi以下の圧力で前記組成物を前記ウエハー上にラミネートする工程を含む方法を提供する。
本明細書に記載される焼結フィルムのための組成物をウエハーに適用する工程;
組成物を100℃以下の温度および40psi以下の圧力でウエハー上にラミネートして、ウエハーにフィルムを付着させる工程;
ウエハーに付着したフィルムをダイシングしてダイとフィルムを得る工程、および
0.2kg/mm2〜1kg/mm2の圧力下でダイとフィルムとを基板に接着する工程を含む方法を提供する。
本明細書に記載の焼結ペーストのための組成物を所定のパターンで基板(例えば、リードフレーム)に適用する工程;
組成物をダイおよび基板にダイ・アタッチする工程;および
組成物を硬化させる工程を含む方法を提供する。
焼結フィルム
本発明による配合物は、以下のように、表1に記載の成分を組み合わせることによって調製した。
焼結ペースト
本発明の配合物は、以下のように、表3に記載の成分を組み合わせることによって調製した。
Claims (23)
- 1種以上のエポキシモノマー、オリゴマーまたはポリマー、アクリルモノマー、オリゴマーまたはポリマー、フェノール系、ノボラック、ポリウレタン、シアネートエステル、ポリビニルアルコール、ポリエステル、ポリ尿素、ポリビニルアセタール樹脂、フェノキシ樹脂、マレイミド、ビスマレイミド、ポリイミドまたはそれらの混合物からなる群から選択される、熱硬化性樹脂または熱可塑性樹脂成分、
1種以上の導電性充填剤、および
任意に有機希釈剤を含む焼結フィルムのための組成物であって、組成物が、
100℃以下の温度および40psi以下の圧力でウエハー上にラミネートされ、
硬化または焼結時に260℃で少なくとも1.0kg/mm2のダイせん断強度を有する、組成物。 - 組成物が、ダイに取り付けられたときに、0.2kg/mm2〜1kg/mm2の圧力で基板に結合する、請求項1に記載の組成物。
- 1種以上のフラックス剤、流動添加剤、接着促進剤、レオロジー改良剤、導電性促進剤、界面活性剤、強化剤、フィルム柔軟化剤、エポキシ硬化触媒、硬化剤、ラジカル重合調節剤、ラジカル安定剤、またはそれらの混合物をさらに含む、請求項1に記載の組成物。
- 熱硬化性樹脂または熱可塑性樹脂成分が、1種以上のエポキシモノマー、オリゴマーまたはポリマーを含み、1種以上のエポキシモノマー、オリゴマーまたはポリマーが、脂肪族骨格、芳香族骨格またはそれらの混合物を有するエポキシを含む、請求項1に記載の組成物。
- 熱硬化性樹脂または熱可塑性樹脂成分が、1種以上のエポキシモノマー、オリゴマーまたはポリマーを含み、1種以上のエポキシモノマー、オリゴマーまたはポリマーが、官能化エポキシモノマー、オリゴマーまたはポリマーを含む、請求項1に記載の組成物。
- 熱硬化性樹脂または熱可塑性樹脂成分が、アクリルモノマー、オリゴマーまたはポリマーを含む、請求項1に記載の組成物。
- 熱硬化性樹脂または熱可塑性樹脂成分が、組成物の全固形分の10重量%までの量で組成物中に存在する、請求項1に記載の組成物。
- 1種以上の導電性充填剤が、銀を含む、請求項1に記載の組成物。
- 1種以上の導電性充填剤が、1種以上のニッケル、銅、銀メッキ金属、ニッケルメッキ金属、銀メッキグラファイト、銀被覆ポリマー、ニッケルメッキグラファイト、またはニッケルメッキポリマーをさらに含む、請求項8に記載の組成物。
- 1種以上の導電性充填剤が、組成物の全固形分の少なくとも65重量%の量で組成物中に存在する、請求項1に記載の組成物。
- 粒状充填剤をさらに含む、請求項1に記載の組成物。
- 粒状充填剤が、ニッケル系合金、鉄系合金、タングステン酸ジルコニウム、シリカ、またはそれらの混合物を含む、請求項11に記載の組成物。
- 粒状充填剤が、10ppm/℃以下の熱膨張係数を有する、請求項11に記載の組成物。
- 粒状充填剤が、組成物の全固形分の20重量%までの量で組成物中に存在する、請求項11に記載の組成物。
- 有機希釈剤が、反応性有機希釈剤、非反応性有機希釈剤、またはそれらの混合物である、請求項1に記載の組成物。
- 請求項1に記載の組成物から形成されたフィルム。
- ウエハーに導電性フィルムをラミネートする方法であって、
請求項1に記載の組成物をウエハーに塗布する工程、および
100℃以下の温度および40psi以下の圧力で組成物をウエハー上にラミネートする工程を含む方法。 - 導電性ネットワークを調製する方法であって、
請求項1に記載の組成物をウエハーに塗布する工程、
組成物を100℃以下の温度および40psi以下の圧力でウエハー上にラミネートして、ウエハーにフィルムを付着させる工程、
ウエハーに付着したフィルムをダイシングしてダイとフィルムを得る工程、および
0.2kg/mm2〜1kg/mm2の圧力下でダイとフィルムを基板に接合する工程とを含む方法。 - 1種以上のエポキシモノマー、オリゴマーまたはポリマー、アクリルモノマー、オリゴマーまたはポリマー、フェノール系、ノボラック、ポリウレタン、シアネートエステル、ポリビニルアルコール、ポリエステル、ポリ尿素、ポリビニルアセタール樹脂、フェノキシ樹脂、マレイミド、ビスマレイミド、ポリイミドまたはそれらの混合物からなる群から選択される、熱硬化性樹脂または熱可塑性樹脂成分、
1種以上の導電性充填剤、
組成物の全固形分の20重量%までの量の粒状充填剤、および
有機希釈剤を含む焼結ペーストのための組成物であって、組成物が、
硬化または焼結時に260℃で少なくとも1.0kg/mm2のダイせん断強度を有する、組成物。 - 粒状充填剤が、ニッケル系合金、鉄系合金、タングステン酸ジルコニウム、シリカ、およびそれらの混合物からなる群から選択される、請求項19に記載の組成物。
- 粒状充填剤が、10ppm/℃以下の熱膨張係数を有する、請求項19に記載の組成物。
- 請求項19に記載の組成物から形成されたペースト。
- 導電性ネットワークを調製する方法であって、
請求項19に記載の組成物を基板に塗布する工程、および
組成物をダイおよび基板にダイアタッチする工程、および
組成物を硬化させる工程を含む方法。
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CN107709418B (zh) | 2021-04-27 |
US20180056449A1 (en) | 2018-03-01 |
WO2016182663A1 (en) | 2016-11-17 |
TWI721979B (zh) | 2021-03-21 |
US11745294B2 (en) | 2023-09-05 |
EP3294799A1 (en) | 2018-03-21 |
JP2023153928A (ja) | 2023-10-18 |
EP3294799A4 (en) | 2018-11-21 |
US20230321765A1 (en) | 2023-10-12 |
TW201703056A (zh) | 2017-01-16 |
CN107709418A (zh) | 2018-02-16 |
KR102360575B1 (ko) | 2022-02-09 |
KR20180004746A (ko) | 2018-01-12 |
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