TW202248384A - 導電性糊及半導體裝置 - Google Patents
導電性糊及半導體裝置 Download PDFInfo
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- TW202248384A TW202248384A TW111110082A TW111110082A TW202248384A TW 202248384 A TW202248384 A TW 202248384A TW 111110082 A TW111110082 A TW 111110082A TW 111110082 A TW111110082 A TW 111110082A TW 202248384 A TW202248384 A TW 202248384A
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- Prior art keywords
- conductive paste
- mass
- meth
- ether
- silver powder
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Classifications
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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Abstract
一種導電性糊,其含有:銀粉;通式(1)所表示之化合物,
R
1-(環己基)-(CH
2)
n-OH (1),
在式(1)中,n為0~4的整數,R
1為氫原子、羥基、碳數1~6的有機基或被羥基取代之碳數1~6的有機基;及稀釋劑。
Description
本發明關於一種導電性糊及半導體裝置。更詳細而言,本發明關於一種可用作用以將半導體元件接著並固定於金屬框架等支撐構件上之半導體裝載用晶粒黏著糊之導電性糊及使用該導電性糊製造之半導體裝置。
通常,半導體裝置藉由利用晶粒黏合材料將半導體晶片等半導體元件接著於引線框、玻璃環氧配線板等支撐構件來製造。作為這樣的晶粒黏合材料,已知有在黏合劑樹脂中分散有導電性填料之樹脂糊及不含黏合劑樹脂的燒結型銀糊。
作為樹脂糊,公知丙烯酸酯化合物或甲基丙烯酸酯化合物、環氧樹脂及含有填充材料之(甲基)丙烯酸樹脂/環氧樹脂混合系糊組成物(例如,專利文獻1)。又,作為銀糊,提出了含有銀粒子及揮發性分散介質之糊狀組成物,例如,在專利文獻2中,提出了如下技術:藉由使用混合有微米級銀粒子和由沸點為130~250℃的具有胺基或羧基之有機物被覆之奈米級銀粒子之銀糊來確保銀燒結體的耐熱性、高緻密性。
[先前技術文獻]
[專利文獻]
[專利文獻1]日本特開2002-179769號公報
[專利文獻2]日本特開2012-119132號公報
[發明所欲解決之課題]
然而,本發明人對專利文獻1中所記載之(甲基)丙烯酸樹脂/環氧樹脂混合系糊、專利文獻2中所記載之銀糊進行探討之結果,明確了在該等中所包含之銀粉的燒結性的方面存在改善的餘地。
本發明鑑於該情況而完成,其目的為提供一種具有高燒結性和高導熱性之導電性糊及可靠性優異的半導體裝置,該半導體裝置藉由使用該導電性糊而與引線框等支撐構件的密接性得到改善,藉此能夠牢固地接著半導體元件和支撐構件。
[解決課題之技術手段]
本發明人發現藉由使用特定的添加劑,可促進銀粉的燒結,藉此可獲得具有高導熱性之導電性糊,從而完成本發明。
依本發明,提供一種導電性糊,其含有:
銀粉;
通式(1)所表示之化合物,
R
1-(環己基)-(CH
2)
n-OH (1)
(在式(1)中,n為0~4的整數,R
1為氫原子、羥基、碳數1~6的有機基或被羥基取代之碳數1~6的有機基);及
稀釋劑。
又,依本發明,提供一種半導體裝置,其具備:
支撐構件;及
半導體元件,經由接著層裝載於前述支撐構件上,
前述接著層由上述導電性糊構成。
[發明之效果]
依本發明,提供一種具有高燒結性和高導熱性之導電性糊及使用該導電性糊製造之可靠性優異的半導體裝置。
以下,對本發明的實施形態進行說明。
(導電性糊)
本實施形態的導電性糊為用以形成晶粒黏著層之晶粒黏著糊,該晶粒黏著層用以將半導體元件等電子零件接著於引線框或配線基板等支撐構件。本實施形態的導電性糊含有作為導電性金屬粉之銀粉、通式(1)所表示之化合物及稀釋劑。
R
1-(環己基)-(CH
2)
n-OH (1)
在式(1)中,n為0~4的整數,R
1為氫原子、羥基、碳數1~6的有機基或被羥基取代之碳數1~6的有機基。
本實施形態的導電性糊中,藉由熱處理,銀粉彼此相互凝集而形成銀粒子連接結構。如此對導電性糊進行加熱而獲得之晶粒黏著層具有導電性或熱導電性,並且具有與支撐構件的高密接性。
本實施形態的導電性糊藉由包含上述式(1)所表示之化合物,可促進銀粉的燒結,其結果,能夠作為具有高熱導電性之接著層發揮作用。雖然其理由尚不明確,但是認為藉由施加於銀粉之表面處理劑與式(1)的化合物或其分解物的相互作用而使存在於銀粉的表面之表面處理劑脫離,銀粉的表面被活化,可促進銀粉彼此的凝集及燒結。
以下,對本實施形態的導電性糊中所使用之各成分進行說明。
(銀粉)
本實施形態的導電性糊中所含有之銀粉藉由對導電性糊實施熱處理,凝集而形成銀粒子連接結構。亦即,在對導電性糊進行加熱而獲得之晶粒黏著糊層中,銀粉彼此相互凝集而存在。藉此,可顯現導電性、導熱性、與支撐構件的密接性。
銀粉的形狀並無特別限定,例如能夠舉出球狀、片狀及鱗片狀等。在本實施形態中,銀粉含有球狀粒子更佳。藉此,能夠提高銀粉凝集的均勻性。又,就減少成本之觀點而言,還能夠採用銀粉含有片狀粒子之態樣。進而,就提高減少成本和凝集均勻的平衡之觀點而言,銀粉可以含有球狀粒子和片狀粒子的雙方。
銀粉的平均粒徑(D
50)例如為0.1μm以上且10μm以下。藉由銀粉的平均粒徑為上述下限值以上,能夠抑制比表面積的過度增加,能夠抑制由接觸熱阻引起之導熱性下降。又,藉由銀粉的平均粒徑為上述上限值以下,能夠提高銀粉之間的銀粒子連接結構體的形成性。又,就提高導電性糊的滴塗(dispense)性之觀點而言,銀粉的平均粒徑(D
50)為0.6μm以上且2.7μm以下更佳,0.6μm以上且2.0μm以下尤佳。另外,關於銀粉的平均粒徑(D
50),例如,能夠使用市售的雷射式粒度分佈計(例如,Shimadzu Corporation製造,SALD-7000等)進行測量。
又,銀粉的最大粒徑並無特別限定,例如能夠設為1μm以上且50μm以下,3μm以上且30μm以下更佳,4μm以上且18μm以下尤佳。藉此,能夠更有效地提高銀粉凝集的均勻性和滴塗性的平衡。
相對於導電性糊整體,導電性糊中的銀粉的含量例如為40質量%以上且90質量%以下,較佳為50質量%以上且80質量%以下。藉由設為上述下限值以上,能夠有助於提高對導電性糊進行熱處理而獲得之晶粒黏著糊層的導熱性和導電性。另一方面,藉由設為上述上限值以下,能夠有助於提高所獲得之導電性糊的塗佈作業性、對導電性糊進行熱處理而獲得之晶粒黏著糊層的機械強度等。
本實施形態的導電性糊中所使用之銀粉可以含有利用脂肪酸進行了表面處理之銀粉。作為銀粉的表面處理中所使用之脂肪酸,可舉出己酸、辛酸、月桂酸、肉豆蔻酸、棕櫚酸、硬脂酸、二十二酸、棕櫚油酸、油酸、芥子酸等。就製造容易性及獲得容易性的觀點而言,使用利用硬脂酸或油酸進行了表面處理之銀粒子較佳。作為利用硬脂酸等脂肪酸對銀粒子進行表面處理之方法,例如,可舉出與銀粒子一起利用球磨機等對稀釋於溶劑中之脂肪酸進行處理之後使溶劑乾燥之方法等,但是並不限定於該等。
在使用利用脂肪酸進行了表面處理之銀粒子之情況,其量相對於所使用之銀粉整體例如為0.05質量%以上且1質量%以下,較佳為0.2質量%以上且0.7質量%以下。藉由以上述範圍內的量使用脂肪酸處理銀粒子,所獲得之導電性糊與支撐構件的密接性能夠得到提高。
本實施形態的導電性糊除了上述銀粉以外,還可以含有其他導電性金屬粉。作為其他導電性金屬粉,能夠使用金粉、鉑粉、鈀粉、銅粉或鎳粉、或者該等的合金。在使用其他導電性金屬粉之情況,相對於上述銀粒子,例如為0.05質量%以上且1質量%以下,較佳為0.2質量%以上且0.7質量%以下。藉由以上述範圍內的量使用其他導電性金屬粉,銀粒子和其他導電性金屬粉能夠良好地形成金屬粒子連接結構體。
(式(1)所表示之化合物)
本實施形態的導電性糊含有式(1)所表示之化合物。
R
1-(環己基)-(CH
2)
n-OH (1)
在式(1)中,n為0~4的整數,較佳為1~3的整數,更佳為1或2,R
1為氫原子、羥基、碳數1~6的有機基或被羥基取代之碳數1~6的有機基。
本實施形態的導電性糊具有良好的燒結性,其結果,具有高導熱性和高接著性如上所述,認為這是因為式(1)的化合物作用於存在於銀粉的表面之表面處理劑。
本實施形態的導電性糊中所使用之式(1)所表示之化合物在大氣壓下具有100℃以上且300℃以下的範圍的沸點為較佳。式(1)所表示之化合物的沸點更佳為在大氣壓下在120℃以上且280℃以下的範圍內,進一步較佳為在大氣壓下在140℃以上且260℃以下的範圍內。本實施形態中所使用之式(1)所表示之化合物在0.2kPa的壓力下具有80℃以上且200℃以下的範圍的沸點為較佳,在1.3kPa的壓力下具有120℃以上且300℃以下的範圍的沸點為較佳。藉由使用具有上述範圍內的沸點之式(1)所表示之化合物,在對導電性糊進行加熱時,可提高式(1)所表示之化合物與存在於銀粉表面之表面處理劑的相互作用,可促進表面處理劑從銀粉表面脫離,其結果,銀粉的燒結性得到提高。
在較佳的實施形態中,式(1)所表示之化合物中,R
1為(甲基)丙烯醯基。在另一較佳的實施形態中,式(1)所表示之化合物中,R
1為羥甲基。在另一較佳的實施形態中,式(1)所表示之化合物為n係1之化合物。藉由使用上述特定的化合物作為式(1)所表示之化合物,能夠進一步改善銀粉的燒結性。
在本實施形態的導電性糊中,式(1)所表示之化合物以溶解或分散於以下說明之稀釋劑中之形態存在較佳。藉由式(1)所表示之化合物以溶解或分散於稀釋劑中之狀態存在,能夠進一步增強式(1)的化合物對存在於銀粉表面之表面處理劑之作用。
相對於導電性糊整體,導電性糊中的式(1)所表示之化合物的含量例如為0.1質量%以上且10質量%以下,較佳為0.5質量%以上且5質量%以下,更佳為1質量%以上且3質量%以下。藉由式(1)所表示之化合物的含量在上述範圍內,可更顯著地獲得導電性糊與支撐構件的密接性的效果。
(稀釋劑)
關於本實施形態的導電性糊,考慮針對支撐構件的塗佈性、針對細微部分的填充性,為了使導電性糊成為適合的黏度,含有稀釋劑。作為稀釋劑,能夠使用反應性稀釋劑或非反應性溶劑。在此,反應性稀釋劑係指藉由加熱處理硬化而促進銀粒子的凝集之聚合性單體,或者,在導電性糊中含有作為黏合劑樹脂之熱硬化性樹脂之情況,反應性稀釋劑係指具有參與與該樹脂的交聯反應之反應性基之化合物。非反應性溶劑係指不具有具有聚合性或交聯性之反應性基並且能夠藉由加熱處理而揮發之溶劑。
作為可用作反應性稀釋劑之聚合性單體,例如,可舉出二醇單體、丙烯酸單體、環氧單體、順丁烯二醯亞胺單體及醯亞胺單體等。
作為可用作聚合性單體之二醇單體,例如,可舉出乙二醇、乙二醇單甲醚、乙二醇單乙醚、乙二醇單正丙醚、乙二醇單異丙醚、乙二醇單正丁醚、乙二醇單異丁醚、乙二醇單己醚、乙二醇單2-乙基己醚、乙二醇單烯丙基醚、乙二醇單苯基醚、乙二醇單苄基醚、二乙二醇、二乙二醇單甲醚、二乙二醇單乙醚、二乙二醇單正丙醚、二乙二醇單異丙醚、二乙二醇單正丁醚、二乙二醇單異丁醚、二乙二醇單己醚、二乙二醇單2-乙基己醚、二乙二醇單苄基醚、三乙二醇、三乙二醇單甲醚、三乙二醇單乙醚、三乙二醇單正丁醚、四乙二醇、四乙二醇單甲醚、四乙二醇單乙醚、四乙二醇單正丁醚、丙二醇、丙二醇單甲醚、丙二醇單乙醚、丙二醇單正丙醚、丙二醇單異丙醚、丙二醇單正丁醚、丙二醇單苯基醚、二丙二醇、二丙二醇單甲醚、二丙二醇單乙醚、二丙二醇單正丙醚、二丙二醇單正丁醚、三丙二醇、三丙二醇單甲醚、三丙二醇單乙醚、三丙二醇單正丁醚等。該等可以單獨使用1種,亦可以組合2種以上來使用。
就在對導電性糊進行熱處理之情況,其中所含有之銀粒子彼此凝集而良好地形成銀粒子連接結構之觀點而言,作為二醇單體,使用三丙二醇單-正丁醚或乙二醇單-正丁基乙酸酯較佳。
作為可用作聚合性單體之丙烯酸單體,能夠使用僅具有1個(甲基)丙烯酸基之單官能丙烯酸單體、或具有2個以上的(甲基)丙烯酸基之多官能丙烯酸單體。
作為單官能丙烯酸單體,例如,可舉出(甲基)丙烯酸2-苯氧乙酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸三級丁酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸正月桂酯、(甲基)丙烯酸正十三烷基酯、(甲基)丙烯酸正硬脂酯、(甲基)丙烯酸異硬脂酯、乙氧基二乙二醇(甲基)丙烯酸酯、丁氧基二乙二醇(甲基)丙烯酸酯、甲氧基三乙二醇(甲基)丙烯酸酯、2-乙基己基二乙二醇(甲基)丙烯酸酯、甲氧基聚乙二醇(甲基)丙烯酸酯、甲氧基二丙二醇(甲基)丙烯酸酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸四氫糠酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸苯氧乙酯、苯氧基二乙二醇(甲基)丙烯酸酯、苯氧基聚乙二醇(甲基)丙烯酸酯、壬基酚環氧乙烷改質(甲基)丙烯酸酯、苯基苯酚環氧乙烷改質(甲基)丙烯酸酯、(甲基)丙烯酸異莰酯、(甲基)丙烯酸二甲胺基乙酯、(甲基)丙烯酸二乙胺基乙酯、(甲基)丙烯酸二甲胺基乙酯四級化合物、(甲基)丙烯酸環氧丙酯、新戊二醇(甲基)丙烯酸苯甲酸酯、(甲基)丙烯酸2-羥乙酯、(甲基)丙烯酸2-羥丙酯、(甲基)丙烯酸2-羥丁酯、(甲基)丙烯酸2-羥基-3-苯氧丙酯、2-(甲基)丙烯醯氧乙基丁二酸、2-(甲基)丙烯醯氧乙基六氫酞酸、2-(甲基)丙烯醯氧乙基酞酸、2-(甲基)丙烯醯氧乙基-2-羥乙基酞酸及2-(甲基)丙烯醯氧乙基酸性磷酸酯等。作為單官能丙烯酸單體,能夠使用上述具體例中的1種或組合2種以上來使用。
作為單官能丙烯酸單體,使用上述具體例中的甲基丙烯酸2-苯氧乙酯較佳。藉此,能夠提高所獲得之導電性糊與支撐構件的密接性。
作為多官能丙烯酸單體,具體而言,可舉出乙二醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、丙氧基化雙酚A二(甲基)丙烯酸酯、己烷-1,6-二醇雙(2-(甲基)丙烯酸甲酯)、4,4’-異亞丙基二苯酚二(甲基)丙烯酸酯、1,3-丁二醇二(甲基)丙烯酸酯、1,6-雙((甲基)丙烯醯氧基)-2,2,3,3,4,4,5,5-八氟己烷、1,4-雙((甲基)丙烯醯氧基)丁烷、1,6-雙((甲基)丙烯醯氧基)己烷、三乙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、N,N’-二(甲基)丙烯醯基乙二胺、N,N’-(1,2-二羥基伸乙基)雙(甲基)丙烯醯胺或1,4-雙((甲基)丙烯醯基)哌𠯤等。
作為可用作聚合性單體之環氧單體,能夠使用僅具有1個環氧基之單官能環氧單體、或具備2個以上的環氧基之多官能環氧單體。
作為單官能環氧單體,可舉出4-三級丁基苯基環氧丙基醚、間甲苯酚基環氧丙基醚、對甲苯酚基環氧丙基醚、苯基環氧丙基醚、甲苯酚基環氧丙基醚等。作為單官能環氧單體,能夠使用上述具體例中的1種或組合2種以上來使用。
作為多官能環氧單體,可舉出:雙酚A、雙酚F、聯苯酚等雙酚化合物或該等的衍生物;氫化雙酚A、氫化雙酚F、氫化聯苯酚、環己烷二醇、環己烷二甲醇、環己烷二乙醇等具有脂環結構之二醇或該等的衍生物;使丁二醇、己二醇、辛二醇、壬二醇、癸二醇等脂肪族二醇或該等的衍生物等環氧化而得之2官能者;具有三羥基苯基甲烷骨架、胺基苯酚骨架之3官能者;使苯酚酚醛清漆樹脂、甲酚酚醛清漆樹脂、苯酚芳烷基樹脂、聯苯芳烷基樹脂、萘酚芳烷基樹脂等環氧化而得之多官能者等。作為多官能環氧單體,能夠使用上述具體例中的1種或組合2種以上來使用。
作為可用作聚合性單體之順丁烯二醯亞胺單體,可舉出聚四亞甲基醚二醇-二(2-順丁烯二醯亞胺乙酸酯)等。
作為可用作聚合性單體之醯亞胺單體,可舉出焦蜜石酸二酐等酸酐、4,4’-二胺基二苯醚等二胺等。
在本實施形態中,相對於導電性糊整體,導電性糊中的聚合性單體的含量為3質量%以上較佳,4質量%以上更佳。藉此,能夠更有效地提高導電性糊的塗佈作業性、所獲得之接著層的平坦性。另一方面,相對於導電性糊整體,導電性糊中的聚合性單體的含量為20質量%以下較佳,15質量%以下更佳。藉此,能夠抑制塗佈作業中的漏液的發生等,而謀求塗佈作業性的提高。又,還能夠提高導電性糊的硬化性。
本實施形態的導電性糊可以含有非反應性溶劑。藉由含有非反應性溶劑,能夠調節所獲得之導電性糊的流動性,而提高處理性、作業性。作為非反應性溶劑,可舉出乙醇、丙醇、丁醇、戊醇、己醇、庚醇、辛醇、壬醇、癸醇、乙二醇單甲醚、乙二醇單乙醚、乙二醇單丙醚、乙二醇單丁醚、丙二醇單甲醚、丙二醇單乙醚、丙二醇單丙醚、丙二醇單丁醚、甲基甲氧基丁醇、α-萜品醇、β-萜品醇、己二醇、苄醇、2-苯乙醇、異棕櫚醇、異硬脂醇、月桂醇、乙二醇、丙二醇或丙三醇等醇類;丙酮、甲基乙基酮、甲基異丁基酮、環己酮、二丙酮醇(4-羥基-4-甲基-2-戊酮)、2-辛酮、異佛酮(3,5,5-三甲基-2-環己烯-1-酮)或二異丁基酮(2,6-二甲基-4-庚酮)等酮類;乙酸乙酯、乙酸丁酯、酞酸二乙酯、酞酸二丁酯、乙醯氧基乙烷、丁酸甲酯、己酸甲酯、辛酸甲酯、癸酸甲酯、乙酸甲賽璐蘇、乙二醇單丁醚乙酸酯、丙二醇單甲醚乙酸酯、1,2-二乙醯氧基乙烷、磷酸三丁酯、磷酸三甲苯酯或磷酸三戊酯等酯類;四氫呋喃、二丙醚、乙二醇二甲醚、乙二醇二乙醚、乙二醇二丁醚、丙二醇二甲醚、乙氧基乙醚、1,2-雙(2-二乙氧基)乙烷或1,2-雙(2-甲氧基乙氧基)乙烷等醚類;乙酸2-(2丁氧基乙氧基)乙烷等酯醚類;2-(2-甲氧基乙氧基)乙醇等醚醇類;甲苯、二甲苯、正烷烴、異烷烴、十二基苯、松節油、煤油或輕油等烴類;乙腈或丙腈等腈類;乙醯胺或N,N-二甲基甲醯胺等醯胺類;低分子量的揮發性聚矽氧油或揮發性有機改質聚矽氧油等。
本實施形態的導電性糊亦可不含有非反應性溶劑。在此,不含有非反應性溶劑係指實質上不含有,並且係指相對於導電性糊整體之非反應性溶劑的含量為0.1質量%以下之情形。
(熱硬化性樹脂)
本實施形態的導電性糊依需要可以含有作為黏合劑樹脂之熱硬化性樹脂。作為熱硬化性樹脂,能夠使用選自氰酸酯樹脂、環氧樹脂、在1分子內具有2個以上的自由基聚合性碳-碳雙鍵之樹脂、烯丙基樹脂及順丁烯二醯亞胺樹脂中之一種或二種以上。
作為可用作熱硬化性樹脂之環氧樹脂,能夠使用在1分子內具有2個以上的環氧丙基之單體、低聚物、聚合物全部,其分子量和分子結構並無特別限定。作為本實施形態中所使用之環氧樹脂,例如可舉出聯苯型環氧樹脂;雙酚A型環氧樹脂、雙酚F型環氧樹脂、四甲基雙酚F型環氧樹脂等雙酚型環氧樹脂;茋型環氧樹脂;苯酚酚醛清漆型環氧樹脂、甲酚酚醛清漆型環氧樹脂等酚醛清漆型環氧樹脂;三酚甲烷型環氧樹脂、烷基改質三酚甲烷型環氧樹脂等多官能環氧樹脂;具有伸苯基骨架之苯酚芳烷基型環氧樹脂、具有聯伸苯基(biphenylene)骨架之苯酚芳烷基型環氧樹脂等芳烷基(aralkyl)型環氧樹脂;二羥基萘型環氧樹脂、將二羥基萘的二聚物進行環氧丙基醚化而獲得之環氧樹脂等萘酚型環氧樹脂;三聚異氰酸三環氧丙酯、單烯丙基二環氧丙基三聚異氰酸酯等含有三𠯤核之環氧樹脂;二環戊二烯改質苯酚型環氧樹脂等橋聯環狀烴化合物改質苯酚型環氧樹脂。又,作為環氧樹脂,例如還能夠使用在1分子內含有2個以上的環氧丙基之化合物中的雙酚A、雙酚F、聯苯酚等雙酚化合物或該等的衍生物;氫化雙酚A、氫化雙酚F、氫化聯苯酚、環己烷二醇、環己烷二甲醇、環己烷二乙醇等具有脂環結構之二醇或該等的衍生物;使丁二醇、己二醇、辛二醇、壬二醇、癸二醇等脂肪族二醇或該等的衍生物等環氧化而得之2官能者;具有三羥基苯基甲烷骨架、胺基苯酚骨架之3官能者。作為熱硬化性樹脂的環氧樹脂能夠含有選自上述例示者中之一種或二種以上。
該等中,就提高所獲得之導電性糊的塗佈作業性、接著性之觀點而言,含有雙酚型環氧樹脂更佳,含有雙酚F型環氧樹脂尤佳。又,在本實施形態中,就更有效地提高導電性糊的塗佈作業性之觀點而言,含有在室溫(25℃)為液狀之液狀環氧樹脂更佳。
可用作熱硬化性樹脂之氰酸酯樹脂並無特別限定,例如能夠含有選自1,3-二氰氧基苯、1,4-二氰氧基苯、1,3,5-三氰氧基苯、1,3-二氰氧基萘、1,4-二氰氧基萘、1,6-二氰氧基萘、1,8-二氰氧基萘、2,6-二氰氧基萘、2,7-二氰氧基萘、1,3,6-三氰氧基萘、4,4’-二氰氧基聯苯、雙(4-氰氧基苯基)甲烷、雙(3,5-二甲基-4-氰氧基苯基)甲烷、2,2-雙(4-氰氧基苯基)丙烷、2,2-雙(3,5-二溴-4-氰氧基苯基)丙烷、雙(4-氰氧基苯基)醚、雙(4-氰氧基苯基)硫醚、雙(4-氰氧基苯基)碸、三(4-氰氧基苯基)亞磷酸酯、三(4-氰氧基苯基)磷酸酯、藉由酚醛清漆樹脂與鹵化氰的反應獲得之氰酸酯類、與藉由將該等多官能氰酸酯樹脂的氰酸酯基進行三聚化而形成之具有三𠯤環之預聚物中之一種或二種以上。上述預聚物能夠藉由例如以礦酸、路易斯酸等酸、鈉醇化物(sodium alcoholate)、三級胺類等鹼基或碳酸鈉等鹽類作為觸媒而使上述多官能氰酸酯樹脂單體聚合而獲得。
作為可用作熱硬化性樹脂之在1分子內具有2個以上的自由基聚合性碳-碳雙鍵之樹脂,例如能夠使用在分子內具有兩個以上的(甲基)丙烯醯基之自由基聚合性丙烯酸樹脂。在本實施形態中,作為上述丙烯酸樹脂,能夠含有分子量為500~10000的聚醚、聚酯、聚碳酸酯或聚(甲基)丙烯酸酯並且具有(甲基)丙烯酸基之化合物。另外,在作為熱硬化性樹脂而使用在1分子內具有2個以上的自由基聚合性碳-碳雙鍵之樹脂之情況,導熱性糊例如能夠含有熱自由基聚合起始劑等聚合起始劑。
關於可用作熱硬化性樹脂之烯丙基樹脂,可舉出藉由使二羧酸、烯丙醇及具備烯丙基之化合物進行反應而獲得之烯丙酯樹脂。在此,作為上述二羧酸,具體而言,可舉出草酸、丙二酸、丁二酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、順丁烯二酸、反丁烯二酸、酞酸、四氫酞酸、六氫酞酸等。作為二羧酸,能夠使用上述具體例中的1種或組合2種以上來使用。
又,作為上述具備烯丙基之化合物,具體而言,可舉出具備烯丙基之聚醚、聚酯、聚碳酸酯、聚丙烯酸酯、聚甲基丙烯酸酯、聚丁二烯、丁二烯丙烯腈共聚物等。作為具備烯丙基之化合物,能夠使用上述具體例中的1種或組合2種以上來使用。作為烯丙基樹脂,具體而言,能夠使用1,2-環己烷二羧酸雙(2-丙烯基)與丙烷-1,2-二醇的聚合物等。
可用作熱硬化性樹脂之順丁烯二醯亞胺樹脂並無特別限定,例如能夠含有選自N,N’-(4,4’-二苯基甲烷)雙順丁烯二醯亞胺、雙(3-乙基-5-甲基-4-順丁烯二醯亞胺苯基)甲烷、2,2-雙[4-(4-順丁烯二醯亞胺苯氧基)苯基]丙烷等雙順丁烯二醯亞胺樹脂中之一種或二種以上。
熱硬化性樹脂能夠含有具有聯苯骨架之環氧樹脂(聯苯型環氧樹脂)作為具有聯苯骨架之樹脂。藉此,能夠提高導電性糊的金屬密接性。
關於具有聯苯骨架之環氧樹脂,只要係在其分子結構內具有聯苯骨架,並且具有2個以上的環氧基者,則其結構並無特別限定,例如可舉出利用表氯醇對聯苯酚或其衍生物進行處理而得之2官能環氧樹脂、具有聯伸苯基骨架之苯酚芳烷基型環氧樹脂、具有聯伸苯基骨架之萘酚芳烷基型環氧樹脂等,該等可以單獨使用,亦可以混合使用。該等中,尤其係在分子內具有2個環氧基之環氧樹脂具有優異的耐熱性,因此較佳。作為這樣的環氧樹脂,可舉出:聯苯型環氧樹脂、四甲基聯苯型環氧樹脂等用表氯醇對聯苯酚衍生物進行處理而得之2官能環氧樹脂;具有聯伸苯基骨架之苯酚芳烷基型環氧樹脂中環氧基為2個者(有時亦表現為酚核體數係2個);具有聯伸苯基骨架之萘酚芳烷基型樹脂中環氧基為2個者;等。
在本實施形態的導電性糊中摻合熱硬化性樹脂之情況,相對於導電性糊整體,熱硬化性樹脂的含量的下限值例如為1質量%以上,較佳為3質量%以上,更佳為5質量%以上。藉此,能夠改善導電性糊的處理性。又,能夠將導電性糊的黏度設為適合於使用之程度。又,相對於導電性糊整體,熱硬化性樹脂的含量的上限值例如為15質量%以下,較佳為12質量%以下,更佳為10質量%以下。藉此,能夠謀求導電性糊的導電性、與支撐構件的密接性等各種特性的平衡的提高。
(硬化劑)
本實施形態的導電性糊可以含有硬化劑。藉此,能夠提高導電性糊的硬化性。作為硬化劑,例如,能夠使用選自脂肪族胺、芳香族胺、二氰二胺、二醯肼化合物、酸酐及酚化合物中之一種或二種以上。該等中,就提高製造穩定性之觀點而言,含有二氰二胺及酚化合物中的至少一者尤佳。
作為可用作硬化劑之二醯肼化合物,可舉出己二酸二醯肼、十二烷酸二醯肼、間苯二甲酸二醯肼、對羥苯甲酸二醯肼等羧酸二醯肼等。又,作為可用作硬化劑之酸酐,可舉出鄰苯二甲酸酐、四氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐、內亞甲基四氫鄰苯二甲酸酐(endomethylene tetrahydrophthalic anhydride)、十二烯基琥珀酸酐、順丁烯二酸酐與聚丁二烯的反應物、順丁烯二酸酐與苯乙烯的共聚物等。
可用作硬化劑之酚化合物為在1分子內具有2個以上的酚性羥基之化合物。更佳為1分子內的酚性羥基的數量為2~5個,特佳為1分子內的酚性羥基的數量為2個或3個。藉此,能夠更有效地提高導電性糊的塗佈作業性,並且能夠在硬化時形成交聯結構而使導電性糊的固化物特性優異。上述酚化合物例如能夠含有選自雙酚F、雙酚A、雙酚S、四甲基雙酚A、四甲基雙酚F、四甲基雙酚S、二羥基二苯醚、二羥基二苯基酮、四甲基聯苯酚、亞乙基雙酚、甲基亞乙基雙(甲基苯酚)、亞環己基雙酚(cyclohexylidenebisphenol)、聯苯酚等雙酚類及其衍生物、三(羥基苯基)甲烷、三(羥基苯基)乙烷等3官能的酚類及其衍生物、藉由使苯酚酚醛清漆、甲酚酚醛清漆等酚類與甲醛進行反應而獲得之化合物中二核體或三核體為主者及其衍生物中之一種或二種以上。該等中,含有雙酚類更佳,含有雙酚F尤佳。
又,在本實施形態中,作為硬化劑之具有聯苯骨架之樹脂,能夠使用具有聯苯骨架之酚樹脂(酚化合物)。藉此,能夠提高導電性糊的導電性及與支撐構件的密接性。作為具有聯苯骨架之酚樹脂,只要係在其分子結構內具有聯苯骨架,並且具有2個以上的苯酚基者,則其結構並無特別限定。
在本實施形態中,相對於導熱性糊整體,導電性糊中的硬化劑的含量為0.5質量%以上較佳,1.0質量%以上更佳。藉此,能夠更有效地提高導電性糊的硬化性。另一方面,相對於導電性糊整體,導電性糊中的硬化劑的含量為10質量%以下較佳,7質量%以下更佳。藉此,能夠提高使用導電性糊形成之接著層的低熱膨脹性、耐濕性。
(其他成分)
本實施形態的導電性糊除了上述成分以外,依需要還可以含有在該領域中通常使用之各種其他成分。作為其他成分,可舉出矽烷偶合劑、硬化促進劑、自由基聚合起始劑、低應力劑、無機填料等,但是不限定於該等,能夠依據所期望的性能來選擇。
矽烷偶合劑用以提高導電性糊與支撐構件的密接性。作為矽烷偶合劑,例如,可舉出:乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷等乙烯基矽烷;2-(3,4-環氧環己基)乙基三甲氧基矽烷、3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基甲基二甲氧基矽烷、3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基甲基二乙氧基矽烷、3-環氧丙氧基丙基三乙氧基矽烷等環氧矽烷;對苯乙烯基三甲氧基矽烷等苯乙烯基矽烷;3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二乙氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷等甲基丙烯醯基矽烷;甲基丙烯酸3-(三甲氧基矽基)丙酯、3-丙烯醯氧基丙基三甲氧基矽烷等丙烯酸矽烷;N-2-(胺乙基)-3-胺丙基甲基二甲氧基矽烷、N-2-(胺乙基)-3-胺丙基三甲氧基矽烷、3-胺丙基三甲氧基矽烷、3-胺丙基三乙氧基矽烷、3-三乙氧基矽基-N-(1,3-二甲基-亞丁基)丙胺、N-苯基-γ-胺丙基三甲氧基矽烷等胺基矽烷;三聚異氰酸基矽烷;烷基矽烷;3-脲基丙基三烷氧基矽烷等脲基矽烷;3-巰基丙基甲基二甲氧基矽烷、3-巰基丙基三甲氧基矽烷等巰基矽烷;3-異氰酸基丙基三乙氧基矽烷等異氰酸基矽烷等。
硬化促進劑用以促進可用作聚合性單體之環氧單體、或可用作黏合劑樹脂之環氧樹脂與硬化劑的反應。作為硬化促進劑,例如,可舉出:有機膦、四取代鏻化合物、磷酸酯甜菜鹼(phosphobetaine)化合物、膦化合物和醌化合物的加成物、鏻化合物和矽烷化合物的加成物等含有磷原子之化合物;二氰二胺、1,8-二吖雙環[5.4.0]十一烯-7(1,8-diazabicyclo [5.4.0]-undecene-7)、苄基二甲胺等脒、三級胺;上述脒或上述三級胺的四級銨鹽等含有氮原子之化合物等。
作為自由基聚合起始劑,具體而言,能夠使用偶氮化合物、過氧化物等。
作為低應力劑,例如,能夠使用聚矽氧油、聚矽氧橡膠等聚矽氧化合物;聚丁二烯順丁烯二酸酐加成物等聚丁二烯化合物;丙烯腈丁二烯共聚化合物等。
作為無機填料,可舉出熔融破碎二氧化矽、熔融球狀二氧化矽等熔融二氧化矽;結晶二氧化矽、非晶質二氧化矽等二氧化矽;二氧化矽;氧化鋁;氫氧化鋁;氮化矽;及氮化鋁等。
(導電性糊之製備)
導電性糊之製備方法並無特別限定,例如藉由預混合上述之各成分之後,使用三輥進行混練,進而進行真空消泡,能夠獲得糊狀的組成物。此時,例如在減壓下進行預混合等,適當地調節製備條件,藉此能夠提高導電性糊的長期作業性。
關於本實施形態的導電性糊,能夠依據用途來調節黏度。導電性糊的黏度能夠藉由調節所使用之黏合劑樹脂的種類、稀釋劑的種類、該等的摻合量等來控制。本實施形態的導電性糊的黏度的下限值例如為10Pa.s以上,較佳為20Pa.s以上,更佳為30Pa.s以上。藉此,能夠提高導電性糊的作業性。另一方面,導電性糊的黏度的上限值例如為1×10
3Pa.s以下,較佳為5×10
2Pa.s以下,更佳為2×10
2Pa.s以下。藉此,能夠提高塗佈性。
(用途)
對本實施形態的導電性糊的用途進行說明。
本實施形態之導電性糊例如用以接著基板和半導體元件。在此,作為半導體元件,例如,可舉出半導體封裝、LED等。
本實施形態之導電性糊與以往的糊狀接著劑組成物相比,能夠提高連接可靠性和外觀。藉此,能夠較佳地用於將發熱量大的半導體元件裝載於基板上之用途。另外,在本實施形態中,LED表示發光二極體(Light Emitting Diode)。
作為使用了LED之半導體裝置,具體而言,可舉出砲彈型LED、表面安裝型(Surface Mount Device:SMD)LED、COB(Chip On Board:晶片板)、功率發光二極體(Power LED)等。
另外,作為上述半導體封裝的種類,具體而言,可舉出CMOS影像感測器、中空封裝、MAP(Mold Array Package:模具陣列封裝)、QFP(Quad Flat Package:四面扁平封裝)、SOP(Small Outline Package:小型封裝)、CSP(Chip Size Package:晶片尺寸封裝)、QFN(Quad Flat Non-leaded Package:四面扁平無引線封裝)、SON(Small Outline Non-leaded Package:小型無引線封裝)、BGA(Ball Grid Array:球柵陣列)、LF-BGA(Lead Frame BGA:引線框球柵陣列)、FC-BGA(Flip Chip BGA:覆晶球柵陣列)、MAP-BGA(Molded Array Process BGA:模具陣列製程球柵陣列)、eWLB(Embedded Wafer-Level BGA:嵌入式晶圓級球柵陣列)、Fan-In型eWLB(扇入型嵌入式晶圓級球柵陣列)、Fan-Out型eWLB(扇出型嵌入式晶圓級球柵陣列)等種類。
以下,對使用了本實施形態之導電性糊之半導體裝置的一例進行說明。
圖1係表示本實施形態之半導體裝置的一例之截面圖。
本實施形態之半導體裝置100具備:支撐構件30;及半導體元件20,經由作為導電性糊的固化物之接著劑層10裝載於支撐構件30上。半導體元件20和支撐構件30例如經由接合線(bonding wire)40等電性連接。又,半導體元件20例如由密封樹脂50密封。
在此,接著劑層10的厚度的下限值例如為5μm以上較佳,10μm以上更佳。藉此,能夠提高導電性糊的固化物的熱容量,並能夠提高散熱性。又,接著劑層10的厚度的上限值例如50μm以下較佳,30μm以下更佳。藉此,導電性糊能夠在提高散熱性之基礎上顯現適合的密接力。
在圖1中,支撐構件30例如為引線框。此時,半導體元件20經由接著劑層10裝載於晶片墊32或支撐構件30上。又,半導體元件20例如經由接合線40與外引線34(支撐構件30)電性連接。作為引線框的支撐構件30例如由42合金、Cu框架構成。
支撐構件30亦可以為有機基板、陶瓷基板。作為有機基板,例如由環氧樹脂、氰酸酯樹脂、順丁烯二醯亞胺樹脂等構成者較佳。另外,支撐構件30的表面例如可以由銀、金等金屬被覆。藉此,能夠提高接著劑層10和支撐構件30的接著性。
圖2係圖1的變形例,且表示本實施形態之半導體裝置100的一例之截面圖。在本變形例之半導體裝置100中,支撐構件30例如為中介層(interposer)。在作為中介層之支撐構件30中與裝載有半導體元件20之一面相反的一側的另一面例如形成複數個焊球52。此時,半導體裝置100經由焊球52與其他配線基板連接。
(半導體裝置之製造方法)
對本實施形態之半導體裝置之製造方法的一例進行說明。
首先,在支撐構件30上塗佈導電性糊,接著,在其上配置半導體元件20。亦即,依序積層有支撐構件30、糊狀接著劑組成物、半導體元件20。作為塗佈導電性糊之方法並無限定,具體而言,能夠使用滴塗法(dispensing)、印刷法、噴墨法等。
接著,藉由使導電性糊預硬化,接著後硬化,而使導電性糊硬化。藉由預硬化及後硬化等熱處理而導電性糊中的銀粒子凝集,在接著劑層10中形成複數個銀粒子彼此的界面消失而成之導熱層。藉此,經由接著劑層10,接著支撐構件30和半導體元件20。接著,使用接合線(bonding wire)40電性連接半導體元件20和支撐構件30。接著,用密封樹脂50密封半導體元件20。藉此,能夠製造半導體裝置。
以上,對本發明的實施形態進行了敘述,但是該等為本發明的示例,亦能夠使用除了上述以外的各式各樣的構成。
[實施例]
以下,依據實施例及比較例對本發明進行說明,但是本發明並不限定於該等。
以下示出實施例及比較例中所使用之成分。
(熱硬化性樹脂)
-環氧樹脂1:雙酚-F-二環氧丙基醚(Nippon Kayaku Co.,Ltd.製造,RE-303SL,環氧當量為160g/eq)
(稀釋劑)
-環氧單體1:間環氧丙基醚和對環氧丙基醚的混合物(Sakamoto Yakuhin Kogyo Co., Ltd.製造,m、p-CGE,Mw=165,環氧當量為165g/eq)
(硬化劑)
-硬化劑1:二羥基二苯基甲烷(DIC CORPORATION製造,DIC-BPF)
-硬化劑2:二氰胺(ADEKA CORPORATION製造,EH-3636AS)
(硬化促進劑)
-硬化促進劑1:咪唑(SHIKOKU CHEMICALS CORPORATION.製造,CUREZOL 2PZ-PW)
(添加劑)
-添加劑1:1,4-環己烷二甲醇單丙烯酸酯(CHDMMA,沸點:140℃/2mmHg,Mitsubishi Chemical Corporation.製造)
-添加劑2:對環己烷二甲醇(沸點:162℃/1.3kPa,Tokyo Chemical Industry Co., Ltd.製造)
-添加劑3:對二甲基環己烷(沸點:120℃,Tokyo Chemical Industry Co., Ltd.製造)
-添加劑4:甲基丙烯酸-2-羥乙酯(沸點:85℃/0.7kPa,Tokyo Chemical Industry Co., Ltd.製造)
-添加劑5:丙二醇單苯基醚(沸點:244℃,NIPPON NYUKAZAI CO., LTD.製造)
-添加劑6:二乙二醇(沸點:245℃,Tokyo Chemical Industry Co., Ltd.製造)
-添加劑7:三乙二醇(沸點:276℃,Tokyo Chemical Industry Co., Ltd.製造)
-添加劑8:聚乙二醇(平均分子量:260~340,Tokyo Chemical Industry Co., Ltd.製造,PEG300)
(導電性金屬粉)
-銀粉1:球狀銀粉(平均粒徑:0.7μm,DOWA HIGHTECH CO.,LTD.製造,AG-DSB-114)
-銀粉2:片狀銀粉(平均粒徑:2.0μm,Fukuda Metal Foil&Powder Co., Ltd.製造,HKD-16)
(實施例1~4、比較例1~7)
<糊狀接著劑組成物的製作>
首先,在常溫使用三輥研磨機混練表1的「清漆狀樹脂組成物的組成」中所記載之摻合量的成分,藉此製作了清漆狀樹脂組成物。接著,以表1的「糊狀接著劑組成物的組成」中所記載之摻合量使用所獲得之清漆狀樹脂組成物,混合銀粉,在常溫下使用三輥研磨機進行混練,藉此獲得了糊狀的組成物(導電性糊)。
針對各實施例及各比較例的導電性糊,測量了以下項目。將結果示於表1。
<導熱率>
將所獲得之糊狀樹脂組成物塗佈於Teflon板上,在氮氣環境下,經60分鐘從30℃升溫至200℃,接著在200℃進行了120分鐘熱處理。藉此,獲得了厚度為1mm的糊狀樹脂組成物熱處理後的試驗片(「Teflon」為與氟樹脂有關之註冊商標)。
接著,藉由雷射閃光法,測量了熱處理體的厚度方向的熱擴散係數α。測量溫度設為25℃。
又,藉由示差掃描熱量(Differential scanning calorimetry:DSC)測量,測量了比熱Cp。
進而,依照JIS K 6911,測量了密度ρ。
使用該等值,依據下式,計算出導熱率λ。
導熱率λ[W/(m.K)]=α[m
2/sec]×Cp[J/kg.K]×ρ[g/cm
3]
<有無剝離、孔隙>
藉由SAT(超音波探傷)觀察上述糊狀樹脂組成物熱處理後的試驗片,確認了在Teflon板與樹脂層的界面有無發生之剝離。依據以下評價標準,將結果示於表1。
OK:完全未觀察到剝離。
NG:觀察到剝離。
<彈性模數(室溫)>
將所獲得之糊狀樹脂組成物塗佈於Teflon板上,經60分鐘從30℃升溫至200℃,接著在200℃進行了120分鐘熱處理。藉此,獲得了厚度為0.3mm的導熱性組成物熱處理後的試驗片。
從Teflon板剝離所獲得之熱處理體,設置於測量裝置(Hitachi High-Tech Science Corporation製造,DMS6100),在拉伸模式下以1Hz的頻率進行了動態黏彈性測量(DMA)。藉此,測量了25℃的儲存彈性模數E'(MPa)。
【表1】
<清漆狀樹脂組成物的組成> | 單位 | 實施例1 | 實施例2 | 實施例3 | 實施例4 | 比較例1 | 比較例2 | 比較例3 | 比較例4 | 比較例5 | 比較例6 | 比較例7 | |
熱硬化性樹脂 | 環氧樹脂1 | 質量份 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 |
稀釋劑 | 稀釋劑1 | 質量份 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
硬化劑 | 硬化劑1 | 質量份 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
硬化劑2 | 質量份 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | |
硬化促進劑 | 硬化促進劑1 | 質量份 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
添加劑 | 添加劑1 | 質量份 | 10 | 30 | - | - | - | - | - | - | - | - | - |
添加劑2 | 質量份 | - | - | 10 | 30 | - | - | - | - | - | - | - | |
添加劑3 | 質量份 | - | - | - | - | 10 | 30 | - | - | - | - | - | |
添加劑4 | 質量份 | - | - | - | - | - | - | - | 10 | - | - | - | |
添加劑5 | 質量份 | - | - | - | - | - | - | - | - | - | - | - | |
添加劑6 | 質量份 | - | - | - | - | - | - | - | - | 10 | - | - | |
添加劑7 | 質量份 | - | - | - | - | - | - | - | - | 10 | - | ||
添加劑8 | 質量份 | - | - | - | - | - | - | - | - | 10 | |||
<糊狀接著劑組成物的組成> | - | - | - | - | - | - | - | - | - | - | - | ||
清漆狀樹脂組成物 | 質量份 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | |
導電性金屬粉 | 銀粉1 | 質量份 | 66.1 | 66.1 | 66.1 | 66.1 | 66.1 | 66.1 | 66.1 | 66.1 | 66.1 | 66.1 | 66.1 |
銀粉2 | 質量份 | 21.9 | 21.9 | 21.9 | 21.9 | 21.9 | 21.9 | 21.9 | 21.9 | 21.9 | 21.9 | 21.9 | |
總計 | 質量份 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | |
<糊狀接著劑樹脂組成物的物性評價> | |||||||||||||
導熱率 | W/mK | 25 | 29 | 24 | 29 | 12 | 14 | 14 | 15 | 13 | 14 | 12 | |
有無剝離、孔隙 | - | OK | OK | OK | OK | OK | OK | OK | OK | OK | OK | OK | |
彈性模數@RT | MPa | 13874 | 12351 | 13346 | 10641 | 14205 | 15652 | 15770 | 14100 | 14700 | 20000 | 19900 |
含有上述式(1)的化合物之實施例的樹脂組成物可促進其中所包含之銀粉的燒結,藉此具有高導熱性。
本申請主張基於2021年3月24日申請之日本申請特願2021-049634號之優先權,並將其揭示的全部內容援用於此。
100:半導體裝置
10:接著劑層
20:半導體元件
30:支撐構件
32:晶片墊
34:外引線
40:接合線
50:密封樹脂
52:焊球
200:銅框架
210:導電性糊
220:聚矽氧晶片
230:夾具
[圖1]係表示本實施形態之半導體裝置的一例之截面圖。
[圖2]係表示本實施形態之半導體裝置的一例之截面圖。
10:接著劑層
20:半導體元件
30:支撐構件
32:晶片墊
34:外引線
40:接合線
50:密封樹脂
100:半導體裝置
Claims (11)
- 一種導電性糊,其含有: 銀粉; 通式(1)所表示之化合物, R 1-(環己基)-(CH 2) n-OH (1) 在式(1)中,n為0~4的整數,R 1為氫原子、羥基、碳數1~6的有機基或被羥基取代之碳數1~6的有機基;及 稀釋劑。
- 如請求項1之導電性糊,其中, 在前述式(1)所表示之化合物中,R 1為(甲基)丙烯醯基。
- 如請求項1之導電性糊,其中, 在前述式(1)所表示之化合物中,R 1為羥甲基。
- 如請求項1之導電性糊,其中, 在前述式(1)所表示之化合物中,n為1。
- 如請求項1之導電性糊,其中, 相對於該導電性糊整體,前述式(1)所表示之化合物的量為5質量%以上且50質量%以下。
- 如請求項1之導電性糊,其中, 相對於該導電性糊整體,前述銀粉的量為40質量%以上且90質量%以下。
- 如請求項1之導電性糊,其還含有熱硬化性樹脂。
- 如請求項1之導電性糊,其還含有反應性稀釋劑。
- 如請求項1之導電性糊,其還含有硬化劑。
- 如請求項1之導電性糊,其中, 前述銀粉含有利用脂肪酸進行了表面處理之銀粉。
- 一種半導體裝置,其具備: 支撐構件;及 半導體元件,經由接著層裝載於前述支撐構件上, 前述接著層由請求項1至10中任一項之導電性糊構成。
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