WO2022113923A1 - 銀含有ペーストおよび接合体 - Google Patents
銀含有ペーストおよび接合体 Download PDFInfo
- Publication number
- WO2022113923A1 WO2022113923A1 PCT/JP2021/042727 JP2021042727W WO2022113923A1 WO 2022113923 A1 WO2022113923 A1 WO 2022113923A1 JP 2021042727 W JP2021042727 W JP 2021042727W WO 2022113923 A1 WO2022113923 A1 WO 2022113923A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- silver
- particles
- resin
- containing paste
- mass
- Prior art date
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- 229910052709 silver Inorganic materials 0.000 title claims abstract description 204
- 239000004332 silver Substances 0.000 title claims abstract description 204
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 202
- 239000002245 particle Substances 0.000 claims abstract description 122
- 229920005989 resin Polymers 0.000 claims abstract description 90
- 239000011347 resin Substances 0.000 claims abstract description 90
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 56
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 51
- 239000010703 silicon Substances 0.000 claims abstract description 51
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 239000003960 organic solvent Substances 0.000 claims abstract description 24
- 239000004065 semiconductor Substances 0.000 claims description 47
- 239000000463 material Substances 0.000 claims description 34
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- 230000001588 bifunctional effect Effects 0.000 claims description 26
- 150000001875 compounds Chemical class 0.000 claims description 23
- 239000003795 chemical substances by application Substances 0.000 claims description 20
- 239000012790 adhesive layer Substances 0.000 claims description 15
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 12
- 238000005245 sintering Methods 0.000 claims description 12
- 238000005259 measurement Methods 0.000 claims description 10
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- 210000003918 fraction a Anatomy 0.000 claims description 2
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- 150000003378 silver Chemical class 0.000 abstract 1
- -1 imide acrylate compound Chemical class 0.000 description 30
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 23
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 13
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- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 11
- 238000000034 method Methods 0.000 description 11
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
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- CUFXMPWHOWYNSO-UHFFFAOYSA-N 2-[(4-methylphenoxy)methyl]oxirane Chemical compound C1=CC(C)=CC=C1OCC1OC1 CUFXMPWHOWYNSO-UHFFFAOYSA-N 0.000 description 2
- CQOZJDNCADWEKH-UHFFFAOYSA-N 2-[3,3-bis(2-hydroxyphenyl)propyl]phenol Chemical compound OC1=CC=CC=C1CCC(C=1C(=CC=CC=1)O)C1=CC=CC=C1O CQOZJDNCADWEKH-UHFFFAOYSA-N 0.000 description 2
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- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
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- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
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- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Definitions
- the present invention relates to a silver-containing paste and a bonded body.
- thermosetting resin composition containing metal particles A technique for manufacturing a semiconductor device using a thermosetting resin composition containing metal particles is known with the intention of enhancing the heat dissipation of the semiconductor device.
- metal particles having a higher thermal conductivity than the resin in the heat-curable resin composition By including metal particles having a higher thermal conductivity than the resin in the heat-curable resin composition, the heat conductivity of the cured product can be increased.
- a thermosetting resin composition containing metal particles is used to bond / bond a semiconductor element and a substrate (support member). The technology is known.
- Patent Document 1 describes a thermosetting resin composition for semiconductor adhesion containing a (meth) acrylic acid ester compound having a predetermined structure, a radical initiator, silver fine particles, silver powder and a solvent, and the composition includes a semiconductor device and a base material. A semiconductor device to which a radical is bonded is disclosed. The document states that connection reliability for post-mounting temperature cycles can be improved (paragraph 0011).
- Patent Document 2 discloses a resin paste composition containing an imide acrylate compound, a radical initiator, a filler, and a liquid rubber component, and a semiconductor device in which a semiconductor element and a base material are bonded with the composition.
- the document describes that the occurrence of chip cracks and chip warpage can be suppressed by reducing the stress of the resin paste composition (paragraph 0003).
- Patent Document 3 describes a semiconductor having a structure in which a semiconductor element and a support member for mounting a semiconductor element are bonded to each other through a silver paste composition composed of silver particles satisfying predetermined physical property values, a solvent and an additive, and the composition.
- the device is disclosed.
- This document describes an example in which dipropylene glycol methyl ether acetate and isobonylcyclohexanol are used as a solvent.
- the present inventors use a silver-containing paste containing a predetermined amount of silver-containing particles, a bifunctional or higher-functional resin, and an organic solvent to dissipate heat when the silicon surface and the metal surface of the silicon chip are bonded. We have found that it has excellent diffusivity and completed the present invention. That is, the present invention can be shown below.
- a silver-containing paste that adheres the silicon surface of a silicon chip to the metal surface.
- (A) Silver-containing particles and (B) A resin with two or more functions and (C) Containing with an organic solvent It is possible to provide a silver-containing paste in which the content of the silver-containing particles (A) is 88% by mass or more and 98% by mass or less with respect to 100% by mass of the silver-containing paste excluding the organic solvent (C). ..
- a bonded body in which the silicon surface and the metal surface of the silicon chip are bonded with a cured product of the silver-containing paste It is possible to provide a bonded body in which the stored elastic modulus of the cured product in the dynamic viscoelasticity (DMA) measurement is 1,000 to 20,000 MPa.
- DMA dynamic viscoelasticity
- the adhesive layer can provide a semiconductor device obtained by sintering the silver-containing paste.
- the silver-containing paste of the present invention can improve heat dissipation and diffusivity when the silicon surface of the silicon chip and the metal surface are adhered to each other.
- the silver-containing paste (paste-like resin composition) of the present embodiment adheres the silicon surface of the silicon chip to the metal surface, and (A) silver-containing particles and (B) a bifunctional or higher-functional resin. And (C) an organic solvent.
- the content of the silver-containing particles (A) is 88% by mass or more and 98% by mass or less, preferably 88% by mass or more and 96% by mass or less with respect to 100% by mass of the silver-containing paste excluding the organic solvent (C). , More preferably 88% by mass or more and 93% by mass or less, further preferably 89% by mass or more and 93% by mass or less, and particularly preferably 91% by mass or more and 93% by mass or less.
- the heat dissipation diffusivity can be improved even when the silicon surface of the silicon chip and the metal surface are adhered to each other.
- the silicon chip is provided with an element having a function such as a transistor, a resistor (electrical resistance), and a capacitor on one surface.
- the silver-containing paste of the present embodiment can bond the silicon surface of the other surface of the silicon chip to the metal surface of a lead frame, a metal layer on various substrates, a base material such as a heat spreader or a heat sink. , The heat dissipation diffusivity between these can be improved.
- the silver-containing particles (A) can be sintered (sintered) by an appropriate heat treatment to form a particle connecting structure (sintering structure).
- the silver-containing particles contained in the silver-containing paste and in particular, the silver particles having a relatively small particle size and a relatively large specific surface area are contained, so that even heat treatment at a relatively low temperature (about 180 ° C.) can be performed. Sintering structure is likely to be formed.
- the preferred particle size will be described later.
- the shape of the silver-containing particles (A) is not particularly limited.
- the preferred shape is spherical, but may be non-spherical, such as ellipsoidal, flat, plate, flake, needle-like, scaly, agglomerated, and polyhedral.
- the silver-containing particles (A) can contain at least one kind of silver-containing particles having these shapes.
- the contact rate between the silver-containing particles is further improved, so that a network is easily formed after the silver-containing paste is sintered, and the thermal conductivity and the electrical conductivity are further improved.
- the silver-containing particles (A) contain the silver-containing particles (A2), resin cracks in the molded product obtained from the silver-containing paste can be further suppressed, and the linear expansion coefficient can be further suppressed.
- the "spherical shape” is not limited to a perfect true sphere, but also includes a shape having some irregularities on the surface.
- the surface of the silver-containing particles (A) may be treated with a carboxylic acid, a saturated fatty acid having 4 to 30 carbon atoms, an unsaturated fatty acid having a monovalent carbon number of 4 to 30, a long-chain alkylnitrile, or the like.
- the silver-containing particles (A) may be (i) silver particles (silver powder) substantially composed of only silver, or (ii) silver and particles composed of components other than silver. Further, (i) and (ii) may be used in combination as the metal-containing particles.
- the silver-containing particles (A) particularly preferably include silver-coated resin particles whose surfaces are coated with silver. This makes it possible to prepare a silver-containing paste that can obtain a cured product having excellent thermal conductivity and excellent storage elastic modulus.
- the silver-containing particles (A) of the present embodiment can contain at least one selected from silver particles and silver-coated resin particles.
- the surface of the silver-coated resin particles is silver and the inside is a resin, it is considered that the silver-coated resin particles have good thermal conductivity and are softer than the particles composed only of silver. Therefore, it is considered easy to design the thermal conductivity and storage elastic modulus to appropriate values by using the silver-coated resin particles.
- the silver layer covers at least a part of the surface of the resin particles.
- silver may cover the entire surface of the resin particles.
- the silver layer covers preferably 50% or more, more preferably 75% or more, still more preferably 90% or more of the surface of the resin particles.
- the silver layer covers substantially the entire surface of the resin particles.
- the mass ratio of resin / silver in the silver-coated resin particles is preferably 90/10 to 10/90, more preferably 80/20 to 20/80, and further preferably 70/30 to 30/90. It is 70.
- the "resin" in the silver-coated resin particles examples include silicone resin, (meth) acrylic resin, phenol resin, polystyrene resin, melamine resin, polyamide resin, polytetrafluoroethylene resin and the like. Of course, resins other than these may be used. Further, only one kind of resin may be used, or two or more kinds of resins may be used in combination. From the viewpoint of elastic properties and heat resistance, the resin is preferably a silicone resin or a (meth) acrylic resin.
- the silicone resin may be particles composed of organopolysiloxane obtained by polymerizing organochlorosilane such as methylchlorosilane, trimethyltrichlorosilane, and dimethyldichlorosilane. Further, a silicone resin having a structure in which organopolysiloxane is further three-dimensionally crosslinked may be used as a basic skeleton.
- the (meth) acrylic resin is a resin obtained by polymerizing a monomer containing a (meth) acrylic acid ester as a main component (50% by weight or more, preferably 70% by weight or more, more preferably 90% by weight or more). be able to.
- a (meth) acrylic acid ester include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and lauryl (meth) acrylate.
- the monomer component of the acrylic resin may contain a small amount of other monomers. Examples of such other monomer components include styrene-based monomers.
- silver-coated (meth) acrylic resin refer to the description in JP-A-2017-126463.
- Various functional groups may be introduced into the silicone resin or (meth) acrylic resin.
- the functional groups that can be introduced are not particularly limited.
- an epoxy group, an amino group, a methoxy group, a phenyl group, a carboxyl group, a hydroxyl group, an alkyl group, a vinyl group, a mercapto group and the like can be mentioned.
- the portion of the resin particles in the silver-coated resin particles may contain various additive components such as a low stress modifier.
- the low stress modifier include butadiene styrene rubber, butadiene acrylonitrile rubber, polyurethane rubber, polyisoprene rubber, acrylic rubber, fluororubber, liquid organopolysiloxane, liquid synthetic rubber such as liquid polybutadiene, and the like.
- the portion of the resin particles contains a silicone resin
- the elastic properties of the silver-coated resin particles can be made preferable by containing a low stress modifier.
- the shape of the resin particles in the silver-coated resin particles is not particularly limited.
- the specific gravity of the silver-coated resin particles is not particularly limited, but the lower limit is preferably 2 or more, more preferably 2.5 or more, and further preferably 3 or more.
- the upper limit of the specific gravity is preferably 10 or less, more preferably 9 or less, still more preferably 8 or less.
- the appropriate specific gravity is preferable in terms of the dispersibility of the silver-coated resin particles themselves and the uniformity when the silver-coated resin particles and other silver-containing particles are used in combination.
- it is preferably less than 0.6, more preferably 0.5 or less, still more preferably 0.4 or less.
- the lower limit of the ratio b / a is not particularly limited, but is 0.05 or more.
- the ratio d / c of the fraction d is preferably less than 0.25, more preferably 0.20 or less, still more preferably 0.15 or less.
- the lower limit of the ratio d / c is not particularly limited, but is 0.01 or more.
- the silver-containing particles other than the silver-coated resin particles are, for example, particles (silver particles) substantially composed of only silver. Is.
- the median diameter D 50 of the silver-containing particles (A) is preferably 0.001 to 1000 ⁇ m, more preferably 0.01 to 100 ⁇ m, and even more preferably 0.1 to 20 ⁇ m.
- D 50 is easy to balance thermal conductivity, sinterability, heat cycle resistance, and the like. Further, by setting D 50 to an appropriate value, it may be possible to improve the workability of coating / bonding.
- the particle size distribution (horizontal axis: particle diameter, vertical axis: frequency) of the silver-containing particles may be monomodal or multimodal.
- the median diameter D 50 of the particles substantially composed of only silver is preferably 0.8 ⁇ m or more, more preferably 1.0 ⁇ m or more, still more preferably 1.2 ⁇ m or more. Thereby, the thermal conductivity can be further enhanced.
- the median diameter D 50 of the particles substantially composed of only silver is preferably 7.0 ⁇ m or less, more preferably 5.0 ⁇ m or less, still more preferably 4.0 ⁇ m or less. As a result, it is possible to further improve the ease of sintering and improve the uniformity of sintering.
- the median diameter D 50 of the silver-containing particles (A) is preferably 0.5 ⁇ m or more, more preferably 1.5 ⁇ m or more, still more preferably 2.0 ⁇ m or more. This makes it easy to set the storage elastic modulus E'to an appropriate value.
- the median diameter D 50 of the silver-containing particles (A) is preferably 20 ⁇ m or less, more preferably 15 ⁇ m or less, still more preferably 10 ⁇ m or less. This makes it easy to sufficiently increase the thermal conductivity.
- the median diameter D 50 of the silver-containing particles (A) can be determined, for example, by performing particle image measurement using a flow-type particle image analyzer FPIA (registered trademark) -3000 manufactured by Sysmex Corporation. More specifically, the particle diameter of the silver-containing particles (A) can be determined by measuring the volume-based median diameter in a wet manner using this device.
- FPIA flow-type particle image analyzer
- the content of the silver-containing particles (A) is 70% by mass or more, 98% by mass or less, preferably 75% by mass or more and 96% by mass, based on 100% by mass of the silver-containing paste excluding the organic solvent (C) described later. Hereinafter, it is more preferably 80% by mass or more and 93% by mass or less. According to the silver-containing paste of the present embodiment, the heat dissipation diffusivity can be improved even when the silicon surface of the silicon chip and the metal surface are adhered to each other.
- particles consisting substantially only of silver can be obtained from, for example, DOWA Hightech Co., Ltd., Fukuda Metal Leaf Powder Industry Co., Ltd., and the like.
- the silver-coated resin particles can be obtained from, for example, Mitsubishi Materials Corporation, Sekisui Chemical Co., Ltd., Sanno Co., Ltd., and the like.
- the silver-containing paste of the present embodiment contains a bifunctional or higher functional resin (B).
- a bifunctional or higher functional resin (B) By containing the bifunctional or higher functional resin (B) in the silver-containing paste of the present embodiment, the adhesion between the cured product of the silver-containing paste and the silicon surface of the silicon chip is improved, and the silicon surface and the metal surface of the silicon chip are improved. It is possible to improve the heat dissipation and diffusivity in the case of bonding.
- the bifunctional or higher functional resin (B) usually contains a group that polymerizes / crosslinks by the action of an active chemical species such as a radical, and / or a chemical structure that reacts with the curing agent D described later.
- the bifunctional or higher functional resin (B) contains, for example, an epoxy group, an oxetanyl group, a group containing an ethylenic carbon-carbon double bond, a hydroxy group, an isocyanate group, a maleimide structure, and the like.
- the bifunctional or higher functional resin (B) preferably includes a bifunctional or higher functional epoxy resin.
- bifunctional or higher functional epoxy resin examples include bifunctional or crystalline epoxy resins such as biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, stilben type epoxy resin, and hydroquinone type epoxy resin; Novolak type epoxy resin such as type epoxy resin, phenol novolac type epoxy resin, naphthol novolak type epoxy resin; phenol aralkyl type epoxy resin containing phenylene skeleton, phenol aralkyl type epoxy resin containing biphenylene skeleton, naphthol aralkyl type epoxy resin containing phenylene skeleton, etc.
- biphenyl type epoxy resin bisphenol A type epoxy resin, bisphenol F type epoxy resin, stilben type epoxy resin, and hydroquinone type epoxy resin
- Novolak type epoxy resin such as type epoxy resin, phenol novolac type epoxy resin, naphthol novolak type epoxy resin
- phenol aralkyl type epoxy resin containing phenylene skeleton phenol aralkyl type epoxy
- Phenolic aralkyl type epoxy resin such as triphenol methane type epoxy resin and alkyl modified triphenol methane type epoxy resin; modified phenol type epoxy such as dicyclopentadiene modified phenol type epoxy resin and terpene modified phenol type epoxy resin Resin: Epoxy resin containing a heterocycle such as an epoxy resin containing a triazine nucleus can be mentioned, and one type or a mixture of two or more types can be used. As the bifunctional or higher functional epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin and the like are preferable.
- It may also contain a monofunctional epoxy group-containing compound such as 4-tert-butylphenyl glycidyl ether, m, p-cresyl glycidyl ether, phenyl glycidyl ether, cresyl glycidyl ether, etc. together with a bifunctional or higher functional epoxy resin.
- a monofunctional epoxy group-containing compound such as 4-tert-butylphenyl glycidyl ether, m, p-cresyl glycidyl ether, phenyl glycidyl ether, cresyl glycidyl ether, etc.
- the amount of the bifunctional or higher resin (B) in the silver-containing paste of the present embodiment is preferably 1% by mass or more, 15% by mass, based on 100% by mass of the silver-containing paste excluding the organic solvent (C) described later. It is mass% or less, more preferably 2 mass% or more and 10 mass% or less.
- the silver-containing paste of this embodiment contains an organic solvent (C).
- the organic solvent (C) for example, the fluidity of the silver-containing paste can be adjusted, and the workability when forming the adhesive layer on the substrate can be improved.
- organic solvent (C) examples include methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, and ethylene glycol monobutyl ether.
- the amount of the organic solvent (C) is not particularly limited.
- the amount used may be appropriately adjusted based on the desired fluidity and the like.
- the organic solvent (C) is used in an amount such that the concentration of the non-volatile component of the silver-containing paste is 50 to 90% by mass.
- the silver-containing paste of the present embodiment can further contain a curing agent (D).
- Examples of the curing agent (D) include those having a reactive group that reacts with the bifunctional or higher functional resin (B).
- the curing agent (D) contains, for example, a reactive group that reacts with a functional group such as an epoxy group, a maleimide group, or a hydroxy group contained in the bifunctional or higher functional resin (B).
- the curing agent (D) preferably contains a phenol-based curing agent and / or an imidazole-based curing agent. These curing agents are particularly preferable when the thermosetting component contains an epoxy group.
- the phenolic curing agent may be a low molecular weight compound or a high molecular weight compound (that is, a phenol resin).
- phenolic curing agent which is a low molecular weight compound
- bisphenol compounds such as bisphenol A and bisphenol F (dihydroxydiphenylmethane) (phenol resins having a bisphenol F skeleton); compounds having a biphenylene skeleton such as 4,4'-biphenol. And so on.
- a novolak type phenol resin such as a phenol novolac resin, a cresol novolak resin, a bisphenol novolak resin, a phenol-biphenylnovolak resin; a polyvinylphenol; a polyfunctional phenol resin such as a triphenylmethane type phenol resin; a terpene.
- Modified phenol resins such as modified phenol resins and dicyclopentadiene modified phenol resins; phenol aralkyl resins having a phenylene skeleton and / or biphenylene skeleton, phenol aralkyl-type phenol resins such as naphthol aralkyl resins having phenylene and / or biphenylene skeletons, and the like. be able to.
- the curing agent (D) only one type may be used, or two or more types may be used in combination.
- the amount thereof is preferably 20 parts by mass or more and 150 parts by mass or less when the amount of the bifunctional or higher resin (B) is 100 parts by mass. More preferably, it is 30 parts by mass or more and 80 parts by mass or less.
- the silver-containing paste of the present embodiment can further contain the (meth) acrylic group-containing compound (E).
- the (meth) acrylic group-containing compound (E) any compound having a (meth) acrylic group having two or more functionalities and having two or more repeating units of a linear or branched oxyalkylene group is the present invention. It can be used without particular limitation as long as it can exert its effect.
- the material obtained by sintering the silver-containing paste is stress-relieved and becomes tough. Also excellent (high breaking energy and difficult to break). Therefore, in the semiconductor device in which the semiconductor element and the base material are bonded by the silver-containing paste of the present embodiment, peeling of the bonded portion and the like are suppressed, good conductivity is exhibited over a long period of time, and long-term reliability is excellent. it is conceivable that.
- the number of repeating units of the oxyalkylene group can be 2 or more, preferably 4 or more, more preferably 4 to 30, particularly preferably 8 to 30, from the viewpoint of the effect of the present invention.
- the oxyalkylene group is a linear or branched oxyalkylene group having 2 to 10 carbon atoms, preferably a linear or branched oxyalkylene group having 2 to 8 carbon atoms, and more preferably a linear or branched oxyalkylene group having 2 to 8 carbon atoms. 5 oxyalkylene groups can be mentioned.
- Examples of the (meth) acrylic group-containing compound (E) include diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, polyethylene glycol # 200 di (meth) acrylate (n: 4), and polyethylene glycol #. Examples thereof include 400 di (meth) acrylate (n: 9), polyethylene glycol # 600 di (meth) acrylate (n: 14), polyethylene glycol # 1000 di (meth) acrylate (n: 23) and the like.
- the (meth) acrylic group-containing compound (E) is preferably 0.1% by mass or more, 15% by mass, based on 100% by mass of the silver-containing paste excluding the organic solvent (C) described later. It can be contained in an amount of mass% or less, more preferably 0.5% by mass or more and 10% by mass or less, still more preferably 1.0% by mass or more and 8% by mass or less.
- a monofunctional (meth) acrylic monomer having only one (meth) acrylic group in one molecule may be contained within a range that does not affect the effect of the present invention. can.
- the bifunctional or higher functional resin (B) and the (meth) acryloyl group-containing compound (D) are used in combination.
- the silver-containing paste of the present embodiment can further contain a silane coupling agent (F). As a result, the adhesive strength can be further improved.
- silane coupling agent (F) examples include known silane coupling agents, and specifically, vinylsilanes such as nyltrimethoxysilane and vinyltriethoxysilane; 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidyloxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyl Epoxysilanes such as methyldiethoxysilane, 3-glycidoxypropyltriethoxysilane; Styrylsilanes such as p-styryltrimethoxysilane; Methylsilanes such as 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-meth
- the amount thereof is 100, which is the amount of the thermosetting component (the total amount of the bifunctional or higher resin (B) and the curing agent (D)).
- the amount of the thermosetting component the total amount of the bifunctional or higher resin (B) and the curing agent (D)
- parts by mass it is preferably 0.1 parts by mass or more and 10 parts by mass or less, and more preferably 0.5 parts by mass or more and 5 parts by mass or less.
- the silver-containing paste of this embodiment can contain a radical initiator.
- the radical initiator can, for example, prevent insufficient curing, sufficiently promote the curing reaction at a relatively low temperature (for example, 180 ° C.), and further improve the adhesive strength. May be created.
- Examples of the radical initiator include peroxides and azo compounds.
- peroxide examples include organic peroxides such as diacyl peroxide, dialkyl peroxide and peroxyketal, and more specifically, ketone peroxides such as methyl ethyl ketone peroxide and cyclohexanone peroxide; Peroxyketals such as 1,1-di (t-butylperoxy) cyclohexane, 2,2-di (4,4-di (t-butylperoxy) cyclohexyl) propane; Hydroperoxides such as p-menthane hydroperoxide, diisopropylbenzene hydroperoxide, 1,1,3,3-tetramethylbutylhydroperoxide, cumene hydroperoxide, t-butylhydroperoxide; To di (2-t-butylperoxyisopropyl) benzene, dicumyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane,
- azo compound examples include 2,2'-azobis (4-methoxy-2,4-dimethylvaleronitrile), 2,2'-azobis (2-cyclopropylpropionitrile), and 2,2'-azobis (2,). 4-Dimethylvaleronitrile) and the like can be mentioned.
- a radical initiator only one type may be used, or two or more types may be used in combination.
- the amount thereof is 100 parts by mass based on the amount of the thermosetting component (total amount of the bifunctional or higher functional resin (B) and the curing agent (D)). Sometimes, it is preferably 1 part by mass or more, 15 parts by mass or less, and more preferably 2 parts by mass or more and 10 parts by mass or less.
- the silver-containing paste of the present embodiment may further contain a curing accelerator.
- the curing accelerator typically accelerates the reaction between the bifunctional or higher functional resin (B) and the curing agent (D).
- phosphorus atom-containing compounds such as organic phosphine, tetra-substituted phosphonium compound, phosphobetaine compound, adduct of phosphine compound and quinone compound, adduct of phosphonium compound and silane compound; dicyandiamide, 1 , 8-diazabicyclo [5.4.0] Undecene-7, amidines and tertiary amines such as benzyldimethylamine; nitrogen atom-containing compounds such as the amidine or the quaternary ammonium salt of the tertiary amines.
- a curing accelerator When a curing accelerator is used, only one type may be used, or two or more types may be used in combination.
- the amount thereof is preferably 0.1 part by mass or more and 10 parts by mass or less when the amount of the bifunctional or higher resin (B) is 100 parts by mass. It is preferably 0.5 parts by mass or more and 5 parts by mass or less.
- the silver-containing paste of the present embodiment can contain a plasticizer. Due to the plasticizer, the storage elastic modulus is low and it is easy to design. Then, it becomes easier to suppress the decrease in the adhesive force due to the heat cycle.
- plasticizer examples include polyester compounds, silicone oils, silicone compounds such as silicone rubber, polybutadiene compounds such as polybutadiene anhydride maleic acid adducts, and acrylonitrile butadiene copolymer compounds.
- plasticizer When a plasticizer is used, only one type may be used, or two or more types may be used in combination.
- the amount thereof is 100 parts by mass when the amount of the thermosetting component (total amount of the bifunctional or higher functional resin (B) and the curing agent (D)) is 100 parts by mass. It is preferably 5 parts by mass or more and 50 parts by mass or less, and more preferably 10 parts by mass or more and 30 parts by mass or less.
- the silver-containing paste of the present embodiment is preferably in the form of a paste at 20 ° C. That is, the silver-containing paste of the present embodiment can be preferably applied to a substrate or the like at 20 ° C. like glue. As a result, the silver-containing paste of the present embodiment can be preferably used as an adhesive for semiconductor devices and the like. Of course, depending on the process to be applied, the silver-containing paste of the present embodiment may be in the form of a varnish having a relatively low viscosity.
- a high thermal conductivity material can be obtained by sintering the silver-containing paste of the present embodiment. By changing the shape of the highly thermally conductive material, it can be applied to various parts that require heat dissipation in the fields of automobiles and electric appliances.
- a bonded body in which the silicon surface and the metal surface of the silicon chip are bonded with a cured body (high thermal conductive material) of the silver-containing paste of the present embodiment.
- the cured product can have a storage elastic modulus of 20 or less, preferably 15 or less, and more preferably 10 or less in the dynamic viscoelasticity (DMA) measurement.
- DMA dynamic viscoelasticity
- a semiconductor device can be manufactured using the silver-containing paste of the present embodiment.
- a semiconductor device can be manufactured by using the silver-containing paste of the present embodiment as an "adhesive" between a base material containing a metal and a semiconductor element (silicon chip).
- the semiconductor device of the present embodiment includes, for example, a base material containing a metal, a silicon chip, and an adhesive layer for joining the metal surface of the base material and the silicon surface of the silicon chip. It is obtained by sintering the above-mentioned silver-containing paste by heat treatment.
- the semiconductor device of this embodiment has excellent heat dissipation and diffusivity, and has excellent product reliability.
- Examples of the silicon chip include ICs, LSIs, power semiconductor devices (power semiconductors), and various other devices.
- Examples of the substrate include a lead frame, a BGA substrate, a mounting substrate, a heat spreader, a heat sink, and the like, and the metal surface of these substrates and the silicon surface of the silicon chip can be bonded by an adhesive layer.
- FIG. 1 is a cross-sectional view showing an example of a semiconductor device.
- the semiconductor device 100 includes a base material 30 and a semiconductor element (silicon chip) 20 mounted on the base material 30 via an adhesive layer 10 (diatack material) which is a heat-treated body of a silver-containing paste.
- an adhesive layer 10 (diatack material) which is a heat-treated body of a silver-containing paste.
- the semiconductor element 20 and the base material 30 are electrically connected via, for example, a bonding wire 40 or the like. Further, the semiconductor element 20 is sealed with, for example, a sealing resin 50.
- the thickness of the adhesive layer 10 is preferably 5 ⁇ m or more, more preferably 10 ⁇ m or more, still more preferably 20 ⁇ m or more. As a result, the stress absorption capacity of the silver-containing paste can be improved, and the heat cycle resistance can be improved.
- the thickness of the adhesive layer 10 is, for example, 100 ⁇ m or less, preferably 50 ⁇ m or less.
- the base material 30 is, for example, a lead frame.
- the semiconductor element 20 is mounted on the die pad 32 or the base material 30 via the adhesive layer 10. Further, the semiconductor element 20 is electrically connected to the outer lead 34 (base material 30) via, for example, a bonding wire 40.
- the base material 30 which is a lead frame is composed of, for example, a 42 alloy, a Cu frame, or the like.
- the base material 30 may be an organic substrate or a ceramic substrate coated with a metal such as silver or gold. This improves the adhesiveness between the adhesive layer 10 and the base material 30.
- the organic substrate include those made of an epoxy resin, a cyanate resin, a maleimide resin, or the like.
- FIG. 2 is a cross-sectional view showing an example of a semiconductor device 100 different from that of FIG.
- the base material 30 is, for example, an interposer.
- a metal layer made of Au, Cu, Ti, etc. is provided on the surface on which the semiconductor element 20 is mounted, and for example, a plurality of solder balls 52 are formed on the opposite surface.
- the semiconductor device 100 is connected to another wiring board via the solder balls 52.
- a silver-containing paste is applied onto the metal layer of the base material 30, and then the silicon elements 20 are arranged so as to face each other on the silver-containing paste. That is, the base material 30, the silver-containing paste, and the semiconductor element 20 are laminated in this order.
- the method of applying the silver-containing paste is not particularly limited. Specific examples thereof include a dispensing method, a printing method, and an inkjet method.
- the silver-containing paste is thermoset.
- the thermosetting is preferably performed by pre-curing and post-curing.
- the silver-containing paste becomes a heat-treated body (cured product).
- heat treatment heat treatment
- the metal-containing particles in the silver-containing paste are aggregated, and a structure in which the interface between the plurality of metal-containing particles disappears is formed in the adhesive layer 10.
- the base material 30 and the semiconductor element 20 are adhered to each other via the adhesive layer 10.
- the semiconductor element 20 and the base material 30 are electrically connected using the bonding wire 40.
- the semiconductor element 20 is sealed with the sealing resin 50. In this way, the semiconductor device can be manufactured.
- Epoxy resin 1 Bisphenol F type liquid epoxy resin (manufactured by Nippon Kayaku Co., Ltd., RE-303S)
- Phenol resin having a bisphenol F skeleton solid at room temperature 25 ° C, manufactured by DIC, DIC-BPF
- ((Meta) acrylic group-containing compound) -Acrylic monomer 1 Ethylene glycol dimethacrylate (manufactured by Kyoei Kagaku Co., Ltd., light ester EG)
- (Curing accelerator) -Imidazole curing agent 1 2-phenyl-1H-imidazole-4,5-dimethanol (manufactured by Shikoku Chemicals Corporation, 2PHZ-PW)
- -Silver-containing particles 1 HKD-13A, D 50 : 6 ⁇ m, manufactured by Fukuda Metal Leaf Powder Industry Co., Ltd.
- -Silver-containing particles 2 Ag-DSB-114, D 50 : 0.7 ⁇ m, manufactured by DOWA Hightech Co., Ltd.
- -Silver-containing particles 3 Silver-plated silicone resin particles (manufactured by Mitsubishi Materials, heat-resistant and surface-treated 10 ⁇ m product, spherical shape, D 50 : 10 ⁇ m, specific gravity: 2.3, silver weight ratio 50 wt%, resin weight ratio 50 wt) %)
- ⁇ Measurement of thermal conductivity ⁇ > The obtained silver-containing paste was applied onto a Teflon plate, heated from 30 ° C. to 200 ° C. over 60 minutes under a nitrogen atmosphere, and then heat-treated at 200 ° C. for 120 minutes. As a result, a heat-treated body of a silver-containing paste having a thickness of 1 mm was obtained (“Teflon” is a registered trademark of fluororesin). Next, the thermal diffusivity ⁇ in the thickness direction of the heat-treated body was measured by a laser flash method. The measurement temperature was 25 ° C. In addition, the specific heat Cp was measured by differential scanning calorimetry (DSC) measurement. Furthermore, the density ⁇ was measured according to JIS K 6911.
- thermal conductivity ⁇ was calculated based on the following equation.
- Thermal conductivity ⁇ [W / (m ⁇ K)] ⁇ [m 2 / sec] ⁇ Cp [J / kg ⁇ K] ⁇ ⁇ [g / cm 3 ]
- the thermal conductivity between the two silicon chips was measured.
- the obtained silver-containing paste was applied to the surface of one silicon chip, and the silver-containing paste coated with the other silicon chip was pressed. Then, in a nitrogen atmosphere, the temperature was raised from 30 ° C. to 200 ° C. over 60 minutes, and then heat treatment was performed at 200 ° C. for 120 minutes.
- a test sample containing a heat-treated body of a silver-containing paste having a thickness of 20 ⁇ m was obtained between the two silicon chips.
- the thermal diffusivity ⁇ in the thickness direction of the heat-treated body was measured by a laser flash method. The measurement temperature was 25 ° C.
- Storage modulus (Storage modulus) Using the heat-treated body of the paste-like polymerizable composition, it was cut out to a size of about 0.1 mm ⁇ about 10 mm ⁇ about 4 mm to obtain a strip-shaped sample for evaluation. Using this sample, the storage elastic modulus (E') at 25 ° C. was measured by DMA (dynamic viscoelasticity measurement, tensile mode) under the conditions of a heating rate of 5 ° C./min and a frequency of 1 Hz.
- DMA dynamic viscoelasticity measurement, tensile mode
- the silver-containing paste described in the examples contains silver-containing particles, a bifunctional or higher functional resin, and an organic solvent, and the silver-containing paste is 100% by mass excluding the organic solvent.
- the content of the silver-containing particles (A) is in the range of 88% by mass or more and 98% by mass or less, the thermal conductivity is excellent, and the thermal conductivity between the two silicon chips is also excellent. From this, it was clarified that the heat dissipation and diffusivity can be improved when the silicon surface and the metal surface of the silicon chip are adhered to each other.
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Abstract
Description
半導体装置への適用の具体例として、以下の特許文献1および2のように、金属粒子を含む熱硬化型の樹脂組成物を用いて、半導体素子と基板(支持部材)とを接着/接合する技術が知られている。
すなわち、本発明は、以下に示すことができる。
シリコンチップのシリコン表面と、金属表面と、を接着する銀含有ペーストであって、
(A)銀含有粒子と、
(B)2官能以上の樹脂と、
(C)有機溶剤と、を含み、
有機溶剤(C)を除いた当該銀含有ペースト100質量%に対して、銀含有粒子(A)の含有量が88質量%以上、98質量%以下である、銀含有ペーストを提供することができる。
前記銀含有ペーストを焼結して得られる高熱伝導性材料を提供することができる。
シリコンチップのシリコン表面と金属表面とが前記銀含有ペーストの硬化体で接着された接合体であって、
動的粘弾性(DMA)測定における前記硬化体の貯蔵弾性率が1,000~20,000MPaである接合体を提供することができる。
金属を含む基材と、
シリコンチップと、
前記基材の金属表面と前記シリコンチップのシリコン表面とを接合する接着層と、
を備え、前記接着層は、前記銀含有ペーストを焼結してなる、半導体装置を提供することができる。
有機溶剤(C)を除いた当該銀含有ペースト100質量%に対して、銀含有粒子(A)の含有量が88質量%以上、98質量%以下、好ましくは88質量%以上、96質量%以下,より好ましくは88質量%以上、93質量%以下、さらに好ましくは89質量%以上、93質量%以下、特に好ましくは91質量%以上、93質量%以下である。
本実施形態の銀含有ペーストによれば、シリコンチップのシリコン表面と、金属表面と、を接着する場合においても放熱拡散性を改善することができる。
銀含有粒子(A)は、適切な熱処理によってシンタリング(焼結)を起こし、粒子連結構造(シンタリング構造)を形成することができる。
本実施形態においては、球状、鱗片状、凝集状、および多面体形状の銀含有粒子から選択される2種以上を含むことが好ましく、球状の銀含有粒子(A1)と、鱗片状、凝集状、および多面体形状から選択される1種以上の銀含有粒子(A2)とを含むことがより好ましい。これにより、銀含有粒子同士の接触率がさらに向上することから、当該銀含有ペーストの焼結後においてネットワークが容易に形成され熱伝導性および電気伝導性がさらに向上する。
銀含有粒子(A)が銀含有粒子(A2)を含むことにより、銀含有ペーストから得られる成形物の樹脂クラックをより抑制したり、線膨張係数をより抑制することができる。
銀含有粒子(A)は、その表面がカルボン酸、炭素数4~30の飽和脂肪酸、または一価の炭素数4~30の不飽和脂肪酸、長鎖アルキルニトリル等処理されていてもよい。
本実施形態の銀含有粒子(A)は、銀粒子および銀被覆樹脂粒子から選択される少なくとも1種を含むことができる。
別観点として、銀被覆樹脂粒子をある断面で切断したときには、その断面の周囲全部に銀層が確認されることが好ましい。
弾性特性や耐熱性の観点から、樹脂は、シリコーン樹脂または(メタ)アクリル樹脂が好ましい。
銀含有粒子の粒度分布(横軸:粒子径、縦軸:頻度)は、単峰性であっても多峰性であってもよい。
本実施形態の銀含有ペーストによれば、シリコンチップのシリコン表面と、金属表面と、を接着する場合においても放熱拡散性を改善することができる。
本実施形態の銀含有ペーストは、2官能以上の樹脂(B)を含む。本実施形態の銀含有ペーストが2官能以上の樹脂(B)を含むことにより、銀含有ペーストの硬化体とシリコンチップのシリコン表面との密着性が改善され、シリコンチップのシリコン表面と金属表面を接着する場合において放熱拡散性を改善することができる。
2官能以上の樹脂(B)としては、好ましくは、2官能以上のエポキシ樹脂を挙げることができる。
2官能以上のエポキシ樹脂としては、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂等が好ましい。
本実施形態の銀含有ペーストは有機溶剤(C)を含む。有機溶剤(C)により、例えば、銀含有ペーストの流動性の調整、基材上に接着層を形成する際の作業性の向上などを図ることができる。
アセトン、メチルエチルケトン、メチルイソブチルケトン、シクロヘキサノン、ジアセトンアルコール(4-ヒドロキシ-4-メチル-2-ペンタノン)、2-オクタノン、イソホロン(3、5、5-トリメチル-2-シクロヘキセン-1-オン)、ジイソブチルケトン(2、6-ジメチル-4-ヘプタノン)等のケトン類;
酢酸エチル、酢酸ブチル、ジエチルフタレート、ジブチルフタレート、アセトキシエタン、酪酸メチル、ヘキサン酸メチル、オクタン酸メチル、デカン酸メチル、メチルセロソルブアセテート、エチレングリコールモノブチルエーテルアセテート、プロピレングリコールモノメチルエーテルアセテート、1,2-ジアセトキシエタン、リン酸トリブチル、リン酸トリクレジル、リン酸トリペンチル等のエステル類;
テトラヒドロフラン、ジプロピルエーテル、エチレングリコールジメチルエーテル、エチレングリコールジエチルエーテル、エチレングリコールジブチルエーテル、プロピレングリコールジメチルエーテル、エトキシエチルエーテル、1,2-ビス(2-ジエトキシ)エタン、1,2-ビス(2-メトキシエトキシ)エタン等のエーテル類;
酢酸2-(2ブトキシエトキシ)エタン等のエステルエーテル類;
2-(2-メトキシエトキシ)エタノール等のエーテルアルコール類;
トルエン、キシレン、n-パラフィン、イソパラフィン、ドデシルベンゼン、テレピン油、ケロシン、軽油等の炭化水素類;
アセトニトリルもしくはプロピオニトリル等のニトリル類;
アセトアミド、N,N-ジメチルホルムアミド等のアミド類;
低分子量の揮発性シリコーンオイル、揮発性有機変成シリコーンオイル等のシリコーンオイル類;など、を挙げることができる。
有機溶剤(C)は、1種のみの有機溶剤を用いてもよいし、2種以上の有機溶剤を併用してもよい。
本実施形態の銀含有ペーストは、さらに硬化剤(D)を含むことができる。
フェノール系硬化剤は、低分子化合物あってもよいし、高分子化合物(すなわちフェノール樹脂)であってもよい。
硬化剤(D)を用いる場合、1種のみを用いてもよいし、2種以上を併用してもよい。
本実施形態の銀含有ペーストは、さらに(メタ)アクリル基含有化合物(E)を含むことができる。
(メタ)アクリル基含有化合物(E)としては、(メタ)アクリル基を2官能以上有し、直鎖または分岐のオキシアルキレン基の繰り返し単位数が2以上である化合物であれば、本発明の効果を発揮し得る範囲で特に限定されず用いることができる。
本実施形態の銀含有ペーストは、さらにシランカップリング剤(F)を含むことができる。これにより、接着力の一層の向上を図ることができる。
2-(3,4-エポキシシクロヘキシル)エチルトリメトキシシラン、3-グリシジルオキシプロピルトリメトキシシラン、3-グリシドキシプロピルメチルジメトキシシラン、3-グリシドキシプロピルトリメトキシシラン、3-グリシドキシプロピルメチルジエトキシシラン、3-グリシドキシプロピルトリエトキシシランなどのエポキシシラン;
p-スチリルトリメトキシシランなどのスチリルシラン;
3-メタクリロキシプロピルメチルジメトキシシラン、3-メタクリロキシプロピルトリメトキシシラン、3-メタクリロキシプロピルメチルジエトキシシラン、3-メタクリロキシプロピルトリエトキシシランなどのメタクリルシラン;
メタクリル酸3-(トリメトキシシリル)プロピル、3-アクリロキシプロピルトリメトキシシランなどのアクリルシラン;
N-2-(アミノエチル)-3-アミノプロピルメチルジメトキシシラン、N-2-(アミノエチル)-3-アミノプロピルトリメトキシシラン、3-アミノプロピルトリメトキシシラン、3-アミノプロピルトリエトキシシラン、3-トリエトキシシリル-N-(1,3-ジメチル-ブチリデン)プロピルアミン、N-フェニル-γ-アミノプロピルトリメトキシシランなどのアミノシラン;
イソシアヌレートシラン;
アルキルシラン;
3-ウレイドプロピルトリアルコキシシランなどのウレイドシラン;
3-メルカプトプロピルメチルジメトキシシラン、3-メルカプトプロピルトリメトキシシランなどのメルカプトシラン;
3-イソシアネートプロピルトリエトキシシランなどのイソシアネートシランなどを挙げることができる。
シランカップリング剤(F)を用いる場合、1種のみを用いてもよいし、2種以上を併用してもよい。
本実施形態の銀含有ペーストは、ラジカル開始剤を含むことができる。
ラジカル開始剤により、例えば、硬化が不十分となることを抑えることができたり、比較的低温(例えば180℃)での硬化反応を十分に進行させることができたり、接着力を一層向上させることができたりする場合がある。
ラジカル開始剤としては、過酸化物、アゾ化合物などを挙げることができる。
p-メンタンハイドロパーオキサイド、ジイソプロピルベンゼンハイドロパーオキサイド、1,1,3,3-テトラメチルブチルハイドロパーオキサイド、クメンハイドロパーオキサイド、t-ブチルハイドロパーオキサイド等のハイドロパーオキサイド;
ジ(2-t-ブチルパーオキシイソプロピル)ベンゼン、ジクミルパーオキサイド、2,5-ジメチル-2,5-ジ(t-ブチルパーオキシ)ヘキサン、t-ブチルクミルパーオキサイド、ジ-t-へキシルパーオキサイド、2,5-ジメチル-2,5-ジ(t-ブチルパーオキシ)ヘキシン-3、ジ-t-ブチルパーオキサイド等のジアルキルパーオキサイド;
ジベンゾイルパーオキサイド、ジ(4-メチルベンゾイル)パーオキサイド等のジアシルパーオキサイド;
ジ-n-プロピルパーオキシジカーボネート、ジイソプロピルパーオキシジカーボネート等のパーオキシジカーボネート;
2,5-ジメチル-2,5-ジ(ベンゾイルパーオキシ)ヘキサン、t-へキシルパーオキシベンゾエート、t-ブチルパーオキシベンゾエート、t-ブチルパーオキシ2-エチルヘキサノネート等のパーオキシエステルなどを挙げることができる。
ラジカル開始剤を用いる場合、1種のみを用いてもよいし、2種以上を併用してもよい。
本実施形態の銀含有ペーストは、さらに硬化促進剤を含むことができる。
硬化促進剤は、典型的には2官能以上の樹脂(B)と硬化剤(D)との反応を促進させるものである。
硬化促進剤を用いる場合、1種のみを用いてもよいし、2種以上を併用してもよい。
本実施形態の銀含有ペーストは、可塑剤を含むことができる。可塑剤により、貯蔵弾性率を低く設計しやすい。そして、ヒートサイクルによる接着力の低下を一層抑えやすくなる。
可塑剤を用いる場合、1種のみを用いてもよいし、2種以上を併用してもよい。
本実施形態の銀含有ペーストは、好ましくは、20℃でペースト状である。すなわち、本実施形態の銀含有ペーストは、好ましくは、20℃で、糊のようにして基板等に塗布することができる。このことにより、本実施形態の銀含有ペーストを、半導体素子の接着剤などとして好ましく用いることができる。
もちろん、適用されるプロセスなどによっては、本実施形態の銀含有ペーストは、比較的低粘度のワニス状などであってもよい。
本実施形態の銀含有ペーストを焼結することにより高熱伝導性材料を得ることができる。
高熱伝導性材料の形状を変えることにより、自動車、電機分野において熱放散性を必要とする様々な部品に適用することができる。
前記硬化体は、動的粘弾性(DMA)測定における貯蔵弾性率が20以下、好ましくは15以下、より好ましくは10以下とすることができる。前記硬化体の貯蔵弾性率が上記範囲にあることにより、製品信頼性が改善される。
本実施形態の銀含有ペーストを用いて、半導体装置を製造することができる。例えば、本実施形態の銀含有ペーストを、金属を含む基材と半導体素子(シリコンチップ)との「接着剤」として用いることで、半導体装置を製造することができる。
本実施形態の半導体装置は、放熱拡散性に優れ、製品信頼性に優れる。
シリコンチップとしては、IC、LSI、電力用半導体素子(パワー半導体)、その他各種の素子を挙げることができる。
基板としては、リードフレーム、BGA基板、実装基板、ヒートスプレッダー、ヒートシンクなどを挙げることができ、これらの基材の金属表面と前記シリコンチップのシリコン表面とを接着層で接合することができる。
図1は、半導体装置の一例を示す断面図である。
半導体装置100は、基材30と、銀含有ペーストの熱処理体である接着層10(ダイアタッチ材)を介して基材30上に搭載された半導体素子(シリコンチップ)20と、を備える。
接着層10の厚さは、例えば100μm以下、好ましくは50μm以下である。
図2の半導体装置100において、基材30は、例えばインターポーザである。インターポーザである基材30のうち、半導体素子20が搭載される面にはAu、Cu,Ti等からなる金属層を有し、その反対側の面には、例えば複数の半田ボール52が形成される。この場合、半導体装置100は、半田ボール52を介して他の配線基板へ接続されることとなる。
まず、基材30の金属層の上に、銀含有ペーストを塗工し、次いで、その上に半導体素子20のシリコン表面が対向するように配置する。すなわち、基材30、銀含有ペースト、半導体素子20がこの順で積層される。
銀含有ペーストを塗工する方法は特に限定されない。具体的には、ディスペンシング、印刷法、インクジェット法などを挙げることができる。
表-1に示される配合量に従って、各原料成分を混合し、ワニスを得た。
次に、得られたワニス、溶剤および銀含有粒子(銀コート樹脂粒子を含む)を、表-1に示す配合量に従って配合し、常温で、3本ロールミルで混練した。これにより、銀含有ペーストを作製した。
(2官能以上の樹脂)
・エポキシ樹脂1:ビスフェノールF型液状エポキシ樹脂(日本化薬社製、RE-303S)
・フェノール硬化剤1:ビスフェノールF骨格を有するフェノール樹脂(室温25℃で固体、DIC社製、DIC-BPF)
・アクリルモノマー1:エチレングリコールジメタクリレート(共栄化学社製、ライトエステルEG)
・イミダゾール硬化剤1:2-フェニル-1H-イミダゾール-4,5-ジメタノール(四国化成工業社製、2PHZ-PW)
・ラジカル重合開始剤1:ジクミルパーオキサイド(化薬アクゾ社製、パーカドックスBC)
・銀含有粒子1:HKD-13A、D50:6μm、福田金属箔粉工業社製
・銀含有粒子2:Ag-DSB-114、D50:0.7μm、DOWAハイテック社製)
・銀含有粒子3:銀メッキシリコーン樹脂粒子(三菱マテリアル社製、耐熱・表面処理10μm品、球形状、D50:10μm、比重:2.3、銀の重量比率50wt%、樹脂の重量比率50wt%)
・有機溶剤1:ブチルプロピレントリグリコール(BFTG)
得られた銀含有ペーストを、テフロン板上に塗布し、窒素雰囲気下で、30℃から200℃まで60分間かけて昇温し、続けて200℃で120分間熱処理した。これにより、厚さ1mmの、銀含有ペーストの熱処理体を得た(「テフロン」は、フッ素樹脂に関する登録商標である)。
次いで、レーザーフラッシュ法により、熱処理体の厚み方向の熱拡散係数αを測定した。測定温度は25℃とした。
また、示差走査熱量(Differential scanning calorimetry:DSC)測定により、比熱Cpを測定した。
さらに、JIS K 6911に準拠して、密度ρを測定した。
これらの値を用いて、以下の式に基づいて、熱伝導率λを算出した。
熱伝導率λ[W/(m・K)]=α[m2/sec]×Cp[J/kg・K]×ρ[g/cm3]
図3に示すように、2つのシリコンチップ間の熱伝導率を測定した。
まず、一方のシリコンチップ表面に、得られた銀含有ペーストを塗布し、他方のシリコンチップで塗付された銀含有ペーストを押圧した。次いで、窒素雰囲気下で、30℃から200℃まで60分間かけて昇温し、続けて200℃で120分間熱処理した。これにより、2つのシリコンチップ間に、厚さ20μmの、銀含有ペーストの熱処理体を含む試験サンプルを得た。
次いで、レーザーフラッシュ法により、熱処理体の厚み方向の熱拡散係数αを測定した。測定温度は25℃とした。
ペースト状重合性組成物の熱処理体を用いて約0.1mm×約10mm×約4mmに切り出し、評価用の短冊状サンプルを得た。このサンプルを用いて25℃における貯蔵弾性率(E’)を、DMA(動的粘弾性測定、引張モード)により昇温速度5℃/min、周波数1Hzの条件で測定した。
10 接着層
20 半導体素子
30 基材
32 ダイパッド
34 アウターリード
40 ボンディングワイヤ
50 封止樹脂
52 半田ボール
Claims (11)
- シリコンチップのシリコン表面と、金属表面と、を接着する銀含有ペーストであって、
(A)銀含有粒子と、
(B)2官能以上の樹脂と、
(C)有機溶剤と、を含み、
有機溶剤(C)を除いた当該銀含有ペースト100質量%に対して、銀含有粒子(A)の含有量が88質量%以上98質量%以下である、銀含有ペースト。 - 銀含有粒子(A)が、銀粒子および銀被覆樹脂粒子から選択される少なくとも1種を含む、請求項1に記載の銀含有ペースト。
- 銀含有粒子(A)が、銀被覆樹脂粒子を含み、
銀含有粒子(A)の体積分率aに対する、前記銀被覆樹脂粒子の体積分率bの比b/aが、0.6未満である、請求項1または2に記載の銀含有ペースト。 - 銀含有粒子(A)が、銀被覆樹脂粒子を含み、
銀含有粒子(A)の重量分率cに対する、前記銀被覆樹脂粒子の重量分率dの比d/cが、0.25未満である、請求項1~3のいずれかに記載の銀含有ペースト。 - 2官能以上の樹脂(B)が、2官能以上のエポキシ樹脂を含む、請求項1~4のいずれかに記載の銀含有ペースト。
- さらに硬化剤(D)を含む、請求項1~5のいずれかに記載の銀含有ペースト。
- さらに(メタ)アクリル基含有化合物(E)を含む、請求項1~6のいずれかに記載の銀含有ペースト。
- さらにシランカップリング剤(F)を含む、請求項1~7のいずれかに記載の銀含有ペースト。
- 請求項1~8のいずれかに記載の銀含有ペーストを焼結して得られる高熱伝導性材料。
- シリコンチップのシリコン表面と金属表面とが請求項1~8のいずれかに記載の銀含有ペーストの硬化体で接着された接合体であって、
動的粘弾性(DMA)測定における前記硬化体の貯蔵弾性率が1,000~20,000MPaである接合体。 - 金属を含む基材と、
シリコンチップと、
前記基材の金属表面と前記シリコンチップのシリコン表面とを接合する接着層と、を備え、
前記接着層は、請求項1~8のいずれかに記載の銀含有ペーストを焼結してなる、半導体装置。
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