WO2009054453A1 - 微小銀粒子含有組成物、その製造方法、微小銀粒子の製造方法および微小銀粒子を有するペースト - Google Patents

微小銀粒子含有組成物、その製造方法、微小銀粒子の製造方法および微小銀粒子を有するペースト Download PDF

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Publication number
WO2009054453A1
WO2009054453A1 PCT/JP2008/069234 JP2008069234W WO2009054453A1 WO 2009054453 A1 WO2009054453 A1 WO 2009054453A1 JP 2008069234 W JP2008069234 W JP 2008069234W WO 2009054453 A1 WO2009054453 A1 WO 2009054453A1
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WO
WIPO (PCT)
Prior art keywords
silver
solution
microparticle
silver microparticle
composition
Prior art date
Application number
PCT/JP2008/069234
Other languages
English (en)
French (fr)
Inventor
Yutaka Hisaeda
Toshihiko Ueyama
Original Assignee
Dowa Electronics Materials Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Application filed by Dowa Electronics Materials Co., Ltd. filed Critical Dowa Electronics Materials Co., Ltd.
Priority to CN200880113477.3A priority Critical patent/CN101835557B/zh
Priority to US12/739,239 priority patent/US8293144B2/en
Priority to EP08843155.6A priority patent/EP2208559B1/en
Priority to KR1020107019213A priority patent/KR101239563B1/ko
Publication of WO2009054453A1 publication Critical patent/WO2009054453A1/ja
Priority to US13/187,141 priority patent/US8293142B2/en
Priority to US13/187,159 priority patent/US8486310B2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/0545—Dispersions or suspensions of nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/14—Treatment of metallic powder
    • B22F1/148—Agglomerating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/62—Metallic pigments or fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/03—Particle morphology depicted by an image obtained by SEM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/04—Particle morphology depicted by an image obtained by TEM, STEM, STM or AFM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/11—Powder tap density
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Abstract

粒度が均一で微細な描画パターンを形成でき、環境負荷が小さい微小銀粒子含有組成物、その製造方法、微小銀粒子の製造方法および微小銀粒子を有するペーストを提供することを目的とする。水とアンモニア水とヘキサン酸とヒドラジン水和水溶液とを含む還元液を調整する調液工程と、硝酸銀水溶液を添加して反応させる銀反応工程と、ろ過・洗浄工程とを行い微小銀粒子を製造する。反応工程は、４０℃から８０℃の間に昇温させた還元液に硝酸銀水溶液を添加して行う。硝酸銀水溶液は一挙に添加する。更に、極性溶媒に前記微小銀粒子含有組成物を分散させて微小銀粒子含有組成物を製造する。炭素数６以下の直鎖脂肪酸と結合した銀粒子を含む微小銀粒子含有組成物が得られる。
PCT/JP2008/069234 2007-10-24 2008-10-23 微小銀粒子含有組成物、その製造方法、微小銀粒子の製造方法および微小銀粒子を有するペースト WO2009054453A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN200880113477.3A CN101835557B (zh) 2007-10-24 2008-10-23 含微小银粒子的组合物、其制造方法、微小银粒子的制造方法及具有微小银粒子的糊料
US12/739,239 US8293144B2 (en) 2007-10-24 2008-10-23 Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles
EP08843155.6A EP2208559B1 (en) 2007-10-24 2008-10-23 Silver microparticle-containing composition, process for production of the composition, process for production of the silver microparticle, and paste containing the silver microparticle
KR1020107019213A KR101239563B1 (ko) 2007-10-24 2008-10-23 미소 은 입자 함유 조성물 및 미소 은 입자를 갖는 페이스트
US13/187,141 US8293142B2 (en) 2007-10-24 2011-07-20 Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles
US13/187,159 US8486310B2 (en) 2007-10-24 2011-07-20 Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007276099 2007-10-24
JP2007-276099 2007-10-24

Related Child Applications (3)

Application Number Title Priority Date Filing Date
US12/739,239 A-371-Of-International US8293144B2 (en) 2007-10-24 2008-10-23 Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles
US13/187,159 Division US8486310B2 (en) 2007-10-24 2011-07-20 Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles
US13/187,141 Division US8293142B2 (en) 2007-10-24 2011-07-20 Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles

Publications (1)

Publication Number Publication Date
WO2009054453A1 true WO2009054453A1 (ja) 2009-04-30

Family

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Family Applications (1)

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PCT/JP2008/069234 WO2009054453A1 (ja) 2007-10-24 2008-10-23 微小銀粒子含有組成物、その製造方法、微小銀粒子の製造方法および微小銀粒子を有するペースト

Country Status (7)

Country Link
US (3) US8293144B2 (ja)
EP (2) EP3042727B1 (ja)
JP (1) JP4344001B2 (ja)
KR (2) KR101004553B1 (ja)
CN (1) CN101835557B (ja)
TW (1) TWI402118B (ja)
WO (1) WO2009054453A1 (ja)

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CN101996699A (zh) * 2009-08-14 2011-03-30 施乐公司 在降低的加工温度下由银纳米颗粒形成高导电部件的新方法
US20110155968A1 (en) * 2008-06-30 2011-06-30 Dowa Electronics Materials Co., Ltd. Fine metal particle-containing composition and method for manufacturing the same
JP2013196997A (ja) * 2012-03-22 2013-09-30 Toray Ind Inc 導電性組成物
US10941304B2 (en) 2016-04-04 2021-03-09 Nichia Corporation Metal powder sintering paste and method of producing the same, and method of producing conductive material

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KR20130050906A (ko) * 2010-08-27 2013-05-16 피켐 어소시에이츠, 인코퍼레이티드 저온 소결성 은 나노 입자 조성물 및 상기 조성물을 이용하여 형성된 전자 물품
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KR102158290B1 (ko) 2010-11-22 2020-09-21 도와 일렉트로닉스 가부시키가이샤 접합재료, 접합체, 및 접합방법
WO2012098643A1 (ja) 2011-01-18 2012-07-26 Ｄｏｗａエレクトロニクス株式会社 金属粒子粉末およびそれを用いたペースト組成物
TWI509631B (zh) 2011-02-25 2015-11-21 Henkel IP & Holding GmbH 用於電子裝置之可燒結銀薄片黏著劑
WO2012169076A1 (ja) 2011-06-10 2012-12-13 Ｄｏｗａエレクトロニクス株式会社 接合材およびそれを用いて作成された接合体
DE102011085642A1 (de) * 2011-11-03 2013-05-08 Bayer Materialscience Aktiengesellschaft Verfahren zur Herstellung einer Metallnanopartikeldispersion, Metallnanopartikeldispersion sowie deren Verwendung
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CN111521623B (zh) * 2020-04-28 2023-04-07 广西大学 一种提高粉末样品透射电镜原位加热芯片制样成功率的方法
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Cited By (6)

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Publication number Priority date Publication date Assignee Title
US20110155968A1 (en) * 2008-06-30 2011-06-30 Dowa Electronics Materials Co., Ltd. Fine metal particle-containing composition and method for manufacturing the same
CN101996699A (zh) * 2009-08-14 2011-03-30 施乐公司 在降低的加工温度下由银纳米颗粒形成高导电部件的新方法
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JP2013196997A (ja) * 2012-03-22 2013-09-30 Toray Ind Inc 導電性組成物
US10941304B2 (en) 2016-04-04 2021-03-09 Nichia Corporation Metal powder sintering paste and method of producing the same, and method of producing conductive material
US11634596B2 (en) 2016-04-04 2023-04-25 Nichia Corporation Metal powder sintering paste and method of producing the same, and method of producing conductive material

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US8486310B2 (en) 2013-07-16
US8293144B2 (en) 2012-10-23
EP3042727B1 (en) 2017-08-30
TW200930482A (en) 2009-07-16
CN101835557A (zh) 2010-09-15
TWI402118B (zh) 2013-07-21
KR101239563B1 (ko) 2013-03-05
KR101004553B1 (ko) 2011-01-03
EP2208559B1 (en) 2016-04-20
US20110272642A1 (en) 2011-11-10
KR20100110884A (ko) 2010-10-13
CN101835557B (zh) 2015-01-07
JP4344001B2 (ja) 2009-10-14
EP3042727A1 (en) 2016-07-13
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KR20100046285A (ko) 2010-05-06
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