KR20100046285A - 미소 은 입자 함유 조성물, 그 제조방법, 미소 은 입자의 제조방법 및 미소 은 입자를 갖는 페이스트 - Google Patents
미소 은 입자 함유 조성물, 그 제조방법, 미소 은 입자의 제조방법 및 미소 은 입자를 갖는 페이스트 Download PDFInfo
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Abstract
Description
도 2는 비교 예 2의 SEM 사진을 나타내는 도면이다.
도 3은 보호제가 없는 경우의 비교 예의 SEM 사진을 나타내는 도면이다.
도 4는 본 발명의 실시 예의 TEM 사진을 나타내는 도면이다.
도 5는 보호제를 헵탄산으로 한 비교 예의 TEM 사진을 나타내는 도면이다.
도 6은 비교 예 2의 TEM 사진을 나타내는 도면이다.
도 7은 보호제가 없는 경우의 비교 예의 TEM 사진을 나타내는 도면이다.
도 8은 용매와 분산성의 관계를 나타내는 그래프이다.
도 9는 사용 가능시간(pot life)과 점도의 관계를 나타내는 도면이다.
Claims (14)
- 탄소 수 6 이하의 직쇄 지방산(直鎖 脂肪酸)과 결합한 은 입자를 포함하는 미소 은 입자 함유 조성물.
- 제 1 항에 있어서,
상기 직쇄 지방산이 헥산 산인 미소 은 입자 함유 조성물. - 제 1 항 또는 2 항에 있어서,
상기 조성물이 극성용매에 분산되어 있는 미소 은 입자 함유 조성물. - 제 3 항에 있어서,
상기 극성용매가 물, 테르피네올 중 어느 일방 또는 쌍방인 미소 은 입자 함유 조성물. - 물과 암모니아수와 헥산 산과 히드라진 수화수용액을 포함하는 환원액을 조정하는 조액(調液)공정과,
질산은 수용액을 상기 환원액에 첨가하여 반응시키는 은 반응공정과,
상기 은 반응공정의 생성물을 회수하여 물로 세정하는 여과 및 세정공정을 포함하는 미소 은 입자의 제조방법. - 제 5 항에 있어서,
상기 은 반응공정은 40℃에서 80℃ 사이로 승온시킨 환원액에 상기 질산은 수용액을 첨가하는 공정인 미소 은 입자의 제조방법. - 제 5 항 또는 제 6 항에 있어서,
상기 은 반응공정은 첨가하는 질산은 수용액을 한번에 첨가하는 공정인 미소 은 입자의 제조방법. - 물과 암모니아수와 헥산 산과 히드라진 수화수용액을 포함하는 환원액을 조정하는 조액 공정과,
질산은 수용액을 상기 환원액에 첨가하여 반응시키는 은 반응공정과,
상기 은 반응공정의 생성물을 회수하여 물로 세정해서 미소 은 입자를 얻는 여과 및 세정공정과,
극성용매에 상기 미소 은 입자를 분산시키는 공정을 포함하는 미소 은 입자 함유 조성물의 제조방법. - 제 8 항에 있어서,
상기 은 반응공정은 40℃에서 80℃ 사이로 승온시킨 환원액에 상기 질산은 수용액을 첨가하는 공정인 미소 은 입자 함유 조성물의 제조방법. - 제 8 항 또는 제 9 항에 있어서,
상기 은 반응공정은 첨가하는 질산은 수용액을 한번에 첨가하는 공정인 미소 은 입자 함유 조성물의 제조방법. - 제 1 항 내지 3 항 중 어느 한 항에 기재된 미소 은 입자 함유 조성물에 포함되는 미소 은 입자를 갖는 페이스트.
- 제 1 항 내지 4 항 중 어느 한 항에 있어서,
TEM 관측으로 측정한 1차 입자 평균 직경이 1~100㎚의 범위 내에 있는 것을 특징으로 하는 미소 은 입자 함유 조성물. - 제 12 항에 있어서,
순수 100 질량부에 대하여 SDBS 20 질량부 및 건조한 상태의 상기 미소 은 입자 0.9 질량부로 이루어지는 분산액을 1시간 초음파 처리한 경우의 쿨터 직경이 5㎛ 미만인 것을 특징으로 하는 미소 은 입자 함유 조성물. - 제 12 항 또는 제 13 항에 있어서,
보류(保留) 입경 1㎛의 여과지에 액을 통과시켰을 때, (포집된 입자질량/분산액에 포함되는 입자질량)으로 나타내는 여과지에 포집된 입자질량의 백분율 비율이 10 질량% 미만인 것을 특징으로 하는 미소 은 입자 함유 조성물.
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KR1020107019213A KR101239563B1 (ko) | 2007-10-24 | 2008-10-23 | 미소 은 입자 함유 조성물 및 미소 은 입자를 갖는 페이스트 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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EP2311586A4 (en) * | 2008-06-30 | 2015-06-03 | Dowa Electronics Materials Co | COMPOSITION CONTAINING METAL MICROPARTICLES AND PROCESS FOR PRODUCING THE SAME |
US9980393B2 (en) | 2011-12-13 | 2018-05-22 | Electronics And Telecommunications Research Institute | Pattern-forming method for forming a conductive circuit pattern |
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Publication number | Publication date |
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EP3042727B1 (en) | 2017-08-30 |
CN101835557A (zh) | 2010-09-15 |
KR101239563B1 (ko) | 2013-03-05 |
EP2208559A1 (en) | 2010-07-21 |
US20110278508A1 (en) | 2011-11-17 |
JP2009120949A (ja) | 2009-06-04 |
US8293144B2 (en) | 2012-10-23 |
US8293142B2 (en) | 2012-10-23 |
US8486310B2 (en) | 2013-07-16 |
EP2208559B1 (en) | 2016-04-20 |
JP4344001B2 (ja) | 2009-10-14 |
KR20100110884A (ko) | 2010-10-13 |
CN101835557B (zh) | 2015-01-07 |
US20100243967A1 (en) | 2010-09-30 |
KR101004553B1 (ko) | 2011-01-03 |
WO2009054453A1 (ja) | 2009-04-30 |
US20110272642A1 (en) | 2011-11-10 |
EP2208559A4 (en) | 2011-08-10 |
TW200930482A (en) | 2009-07-16 |
TWI402118B (zh) | 2013-07-21 |
EP3042727A1 (en) | 2016-07-13 |
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