JP2018037660A - 半導体素子およびこれを含む半導体素子パッケージ - Google Patents
半導体素子およびこれを含む半導体素子パッケージ Download PDFInfo
- Publication number
- JP2018037660A JP2018037660A JP2017168498A JP2017168498A JP2018037660A JP 2018037660 A JP2018037660 A JP 2018037660A JP 2017168498 A JP2017168498 A JP 2017168498A JP 2017168498 A JP2017168498 A JP 2017168498A JP 2018037660 A JP2018037660 A JP 2018037660A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor layer
- layer
- conductivity type
- type semiconductor
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
- H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34333—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34346—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser characterised by the materials of the barrier layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0137—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/816—Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
- H10H20/818—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous within the light-emitting regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
- H10H20/8252—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN characterised by the dopants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/833—Transparent materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/80—Arrangements for protection of devices protecting against overcurrent or overload, e.g. fuses or shunts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/816—Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
- H10H20/8162—Current-blocking structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2016-0112809 | 2016-09-01 | ||
| KR1020160112809A KR102582184B1 (ko) | 2016-09-01 | 2016-09-01 | 반도체 소자 및 이를 포함하는 반도체 소자 패키지 |
| KR1020160163830A KR102619743B1 (ko) | 2016-12-02 | 2016-12-02 | 반도체 소자 |
| KR10-2016-0163830 | 2016-12-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018037660A true JP2018037660A (ja) | 2018-03-08 |
| JP2018037660A5 JP2018037660A5 (https=) | 2019-04-18 |
Family
ID=59799227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017168498A Pending JP2018037660A (ja) | 2016-09-01 | 2017-09-01 | 半導体素子およびこれを含む半導体素子パッケージ |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US10340415B2 (https=) |
| EP (2) | EP3291314B1 (https=) |
| JP (1) | JP2018037660A (https=) |
| CN (2) | CN107799639B (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200027268A (ko) * | 2018-09-04 | 2020-03-12 | 엘지이노텍 주식회사 | 반도체 소자 |
| KR20200033667A (ko) * | 2018-09-20 | 2020-03-30 | 엘지이노텍 주식회사 | 발광소자 |
| JP2021057418A (ja) * | 2019-09-27 | 2021-04-08 | 旭化成株式会社 | 窒化物半導体素子 |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3428977A4 (en) | 2016-03-08 | 2019-10-02 | ALPAD Corporation | Light-emitting semiconducting element and method for producing the same |
| JP7118427B2 (ja) * | 2016-06-20 | 2022-08-16 | スージョウ レキン セミコンダクター カンパニー リミテッド | 半導体素子 |
| US10340415B2 (en) | 2016-09-01 | 2019-07-02 | Lg Innotek Co., Ltd. | Semiconductor device and semiconductor device package including the same |
| WO2018048275A1 (ko) | 2016-09-10 | 2018-03-15 | 엘지이노텍 주식회사 | 반도체 소자 |
| EP3514840A4 (en) * | 2016-09-13 | 2019-08-21 | LG Innotek Co., Ltd. | SEMICONDUCTOR COMPONENT AND SEMICONDUCTOR COMPONENT HOUSING THEREWITH |
| US10903395B2 (en) | 2016-11-24 | 2021-01-26 | Lg Innotek Co., Ltd. | Semiconductor device having varying concentrations of aluminum |
| KR102390828B1 (ko) | 2017-08-14 | 2022-04-26 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 |
| KR102502335B1 (ko) | 2018-04-04 | 2023-02-22 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 |
| CN108933340A (zh) * | 2018-05-25 | 2018-12-04 | 宁夏中科天际防雷研究院有限公司 | 一种抗腐蚀性防雷接地极及其制备方法 |
| KR102575569B1 (ko) * | 2018-08-13 | 2023-09-07 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 |
| US10879419B2 (en) * | 2018-08-17 | 2020-12-29 | Seoul Viosys Co., Ltd. | Light emitting device |
| JP7262965B2 (ja) | 2018-10-17 | 2023-04-24 | スタンレー電気株式会社 | 半導体発光素子 |
| CN111668697B (zh) * | 2019-03-07 | 2023-04-18 | 旭化成株式会社 | 氮化物半导体元件 |
| US20230238419A1 (en) * | 2021-01-21 | 2023-07-27 | Photon Wave Co., Ltd. | Ultraviolet light-emitting device |
| CN114883361A (zh) * | 2022-06-06 | 2022-08-09 | Tcl华星光电技术有限公司 | 显示面板及其制作方法 |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005101532A1 (ja) * | 2004-04-16 | 2005-10-27 | Nitride Semiconductors Co., Ltd. | 窒化ガリウム系発光装置 |
| JP2008285758A (ja) * | 2008-06-02 | 2008-11-27 | Nippon Steel Corp | 一方向性電磁鋼板 |
| JP2010171272A (ja) * | 2009-01-23 | 2010-08-05 | Shin Etsu Handotai Co Ltd | 発光素子 |
| JP2012049337A (ja) * | 2010-08-26 | 2012-03-08 | Sharp Corp | 窒化物半導体素子および半導体光学装置 |
| JP2012216603A (ja) * | 2011-03-31 | 2012-11-08 | Sharp Corp | 窒化物半導体発光素子およびその製造方法 |
| JP2013105917A (ja) * | 2011-11-14 | 2013-05-30 | Dowa Electronics Materials Co Ltd | 半導体発光素子およびその製造方法 |
| JP2013149889A (ja) * | 2012-01-23 | 2013-08-01 | Stanley Electric Co Ltd | GaN系半導体発光素子 |
| US20140103289A1 (en) * | 2010-04-30 | 2014-04-17 | Yitao Liao | High efficiency ultraviolet light emitting diode with band structure potential fluctuations |
| WO2014123092A1 (ja) * | 2013-02-05 | 2014-08-14 | 株式会社トクヤマ | 窒化物半導体発光素子 |
| JP2015216352A (ja) * | 2014-04-24 | 2015-12-03 | 国立研究開発法人理化学研究所 | 紫外発光ダイオードおよびそれを備える電気機器 |
| JP2016044095A (ja) * | 2014-08-21 | 2016-04-04 | 三菱化学株式会社 | GaN基板およびGaN基板の製造方法 |
Family Cites Families (90)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3884659T2 (de) * | 1987-04-21 | 1994-05-05 | Nippon Electric Co | Optische Halbleiteranordnung. |
| US5153889A (en) * | 1989-05-31 | 1992-10-06 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device |
| JP2927158B2 (ja) | 1993-09-29 | 1999-07-28 | サンケン電気株式会社 | 半導体発光素子 |
| US6340824B1 (en) | 1997-09-01 | 2002-01-22 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
| JP3033564B2 (ja) * | 1997-10-02 | 2000-04-17 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
| JP3279266B2 (ja) * | 1998-09-11 | 2002-04-30 | 日本電気株式会社 | 窒化ガリウム系半導体発光素子 |
| JP3614070B2 (ja) | 2000-01-17 | 2005-01-26 | 日亜化学工業株式会社 | 窒化物半導体発光ダイオード |
| JP3786114B2 (ja) | 2000-11-21 | 2006-06-14 | 日亜化学工業株式会社 | 窒化物半導体素子 |
| US6777253B2 (en) * | 2000-12-20 | 2004-08-17 | Matsushita Electric Industrial Co., Ltd. | Method for fabricating semiconductor, method for fabricating semiconductor substrate, and semiconductor light emitting device |
| JP4161603B2 (ja) | 2001-03-28 | 2008-10-08 | 日亜化学工業株式会社 | 窒化物半導体素子 |
| US6958497B2 (en) | 2001-05-30 | 2005-10-25 | Cree, Inc. | Group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures |
| JP5055678B2 (ja) | 2001-09-28 | 2012-10-24 | 日亜化学工業株式会社 | 窒化物半導体発光素子 |
| EP1437776B1 (en) * | 2001-10-12 | 2011-09-21 | Nichia Corporation | Light emitting device and method for manufacture thereof |
| US7358522B2 (en) | 2001-11-05 | 2008-04-15 | Nichia Corporation | Semiconductor device |
| JP4236840B2 (ja) * | 2001-12-25 | 2009-03-11 | 富士フイルム株式会社 | 半導体レーザ素子 |
| TWI278995B (en) | 2002-01-28 | 2007-04-11 | Nichia Corp | Nitride semiconductor element with a supporting substrate and a method for producing a nitride semiconductor element |
| KR101030068B1 (ko) | 2002-07-08 | 2011-04-19 | 니치아 카가쿠 고교 가부시키가이샤 | 질화물 반도체 소자의 제조방법 및 질화물 반도체 소자 |
| US7521693B2 (en) * | 2003-10-16 | 2009-04-21 | Alis Corporation | Ion sources, systems and methods |
| KR100541102B1 (ko) | 2004-02-13 | 2006-01-11 | 삼성전기주식회사 | 오믹 접촉을 개선한 질화물 반도체 발광소자 및 그 제조방법 |
| JP2006032779A (ja) | 2004-07-20 | 2006-02-02 | Sanyo Electric Co Ltd | 窒化物半導体発光素子 |
| WO2006043422A1 (ja) | 2004-10-19 | 2006-04-27 | Nichia Corporation | 半導体素子 |
| JP4925580B2 (ja) * | 2004-12-28 | 2012-04-25 | 三菱化学株式会社 | 窒化物半導体発光素子およびその製造方法 |
| EP1865564B1 (en) * | 2005-03-18 | 2014-11-19 | Mitsubishi Chemical Corporation | Light-emitting device, white light-emitting device, illuminator, and image display |
| US20060260671A1 (en) | 2005-05-17 | 2006-11-23 | Rohm Co., Ltd. | Semiconductor device and semiconductor light emitting device |
| JP4968617B2 (ja) | 2005-11-11 | 2012-07-04 | 日亜化学工業株式会社 | 半導体発光素子及びその製造方法 |
| TWI318013B (en) | 2006-09-05 | 2009-12-01 | Epistar Corp | A light emitting device and the manufacture method thereof |
| KR100820546B1 (ko) | 2006-09-07 | 2008-04-07 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
| CN102779918B (zh) | 2007-02-01 | 2015-09-02 | 日亚化学工业株式会社 | 半导体发光元件 |
| KR101330898B1 (ko) | 2007-04-05 | 2013-11-18 | 엘지전자 주식회사 | 반도체 레이저 다이오드 |
| US20100006884A1 (en) | 2007-08-07 | 2010-01-14 | Epistar Corporation | Light Emitting Device and Manufacturing Method Therof |
| KR20100003321A (ko) | 2008-06-24 | 2010-01-08 | 삼성전자주식회사 | 발광 소자, 이를 포함하는 발광 장치, 상기 발광 소자 및발광 장치의 제조 방법 |
| JP5305790B2 (ja) | 2008-08-28 | 2013-10-02 | 株式会社東芝 | 半導体発光素子 |
| US8008683B2 (en) | 2008-10-22 | 2011-08-30 | Samsung Led Co., Ltd. | Semiconductor light emitting device |
| WO2010067845A1 (ja) * | 2008-12-10 | 2010-06-17 | 古河電気工業株式会社 | 半導体レーザ素子およびその製造方法 |
| WO2010146808A1 (ja) | 2009-06-18 | 2010-12-23 | パナソニック株式会社 | 窒化ガリウム系化合物半導体発光ダイオード |
| KR101007087B1 (ko) * | 2009-10-26 | 2011-01-10 | 엘지이노텍 주식회사 | 발광소자 및 그 제조방법 |
| US8154042B2 (en) | 2010-04-29 | 2012-04-10 | Koninklijke Philips Electronics N V | Light emitting device with trenches and a top contact |
| JP5659966B2 (ja) | 2010-06-29 | 2015-01-28 | 日亜化学工業株式会社 | 半導体素子及びその製造方法 |
| KR101252032B1 (ko) * | 2010-07-08 | 2013-04-10 | 삼성전자주식회사 | 반도체 발광소자 및 이의 제조방법 |
| DE102010044986A1 (de) | 2010-09-10 | 2012-03-15 | Osram Opto Semiconductors Gmbh | Leuchtdiodenchip und Verfahren zur Herstellung eines Leuchtdiodenchips |
| US20120112218A1 (en) * | 2010-11-04 | 2012-05-10 | Agency For Science, Technology And Research | Light Emitting Diode with Polarized Light Emission |
| CN103347982B (zh) | 2010-12-01 | 2016-05-25 | 日东电工株式会社 | 具有掺杂浓度梯度的发射性陶瓷材料及其制造方法和使用方法 |
| JP5175918B2 (ja) * | 2010-12-01 | 2013-04-03 | 株式会社東芝 | 半導体発光素子 |
| CN103797591A (zh) * | 2011-08-17 | 2014-05-14 | 三星电子株式会社 | 制造氮化物半导体发光器件的方法以及由此制造出的氮化物半导体发光器件 |
| US9252329B2 (en) | 2011-10-04 | 2016-02-02 | Palo Alto Research Center Incorporated | Ultraviolet light emitting devices having compressively strained light emitting layer for enhanced light extraction |
| JP5857786B2 (ja) | 2012-02-21 | 2016-02-10 | 日亜化学工業株式会社 | 半導体発光素子の製造方法 |
| EP2942822A1 (en) * | 2012-04-02 | 2015-11-11 | Asahi Kasei E-materials Corporation | Optical substrate, semiconductor light-emitting element and method of manufacturing semiconductor light-emitting element |
| KR102005236B1 (ko) * | 2012-07-05 | 2019-07-31 | 삼성전자주식회사 | 반사 전극 형성을 위한 콘택층을 포함하는 반도체 발광 소자 |
| KR101941033B1 (ko) | 2012-07-05 | 2019-01-22 | 엘지이노텍 주식회사 | 발광소자 |
| TWI544658B (zh) | 2012-08-01 | 2016-08-01 | 晶元光電股份有限公司 | 發光二極體結構 |
| KR101953716B1 (ko) * | 2012-08-23 | 2019-03-05 | 엘지이노텍 주식회사 | 발광소자, 발광 소자 패키지 및 조명 시스템 |
| US9401452B2 (en) * | 2012-09-14 | 2016-07-26 | Palo Alto Research Center Incorporated | P-side layers for short wavelength light emitters |
| KR20140038886A (ko) * | 2012-09-21 | 2014-03-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 소자 |
| WO2014110197A1 (en) * | 2013-01-09 | 2014-07-17 | Sensor Electronic Technology, Inc. | Ultraviolet reflective rough adhesive contact |
| JP2016084822A (ja) | 2013-01-21 | 2016-05-19 | ジヤトコ株式会社 | マルチディスク変速機 |
| KR102037865B1 (ko) | 2013-02-01 | 2019-10-30 | 삼성전자주식회사 | 반도체 발광소자 및 반도체 발광소자 제조방법 |
| JP6118575B2 (ja) | 2013-02-12 | 2017-04-19 | 日亜化学工業株式会社 | 発光装置 |
| JP6287317B2 (ja) | 2013-02-28 | 2018-03-07 | 日亜化学工業株式会社 | 半導体発光素子 |
| KR20140130618A (ko) | 2013-05-01 | 2014-11-11 | 서울바이오시스 주식회사 | 솔더 페이스트를 통해 접착된 발광 다이오드를 갖는 발광 다이오드 모듈 및 발광 다이오드 |
| JP6466653B2 (ja) | 2013-05-17 | 2019-02-06 | スタンレー電気株式会社 | 窒化物半導体発光素子、および窒化物半導体ウェーハ |
| JP6192378B2 (ja) | 2013-06-18 | 2017-09-06 | 学校法人 名城大学 | 窒化物半導体発光素子 |
| US9847457B2 (en) | 2013-07-29 | 2017-12-19 | Seoul Viosys Co., Ltd. | Light emitting diode, method of fabricating the same and LED module having the same |
| KR101804493B1 (ko) * | 2013-09-03 | 2017-12-04 | 센서 일렉트로닉 테크놀로지, 인크 | 변조 도핑을 갖는 광전자 디바이스 |
| EP3043395B1 (en) | 2013-09-05 | 2018-11-07 | Panasonic Intellectual Property Management Co., Ltd. | Light-emitting device |
| JP5818853B2 (ja) * | 2013-10-15 | 2015-11-18 | 株式会社トクヤマ | n型窒化アルミニウム単結晶基板を用いた縦型窒化物半導体デバイス |
| CN103682012A (zh) * | 2013-10-17 | 2014-03-26 | 武汉光电工业技术研究院有限公司 | 一种深紫外发光二极管及其制备方法 |
| KR102070089B1 (ko) | 2013-10-23 | 2020-01-29 | 삼성전자주식회사 | 반도체 발광소자 패키지 및 이를 이용한 조명장치 |
| KR102098245B1 (ko) | 2014-02-11 | 2020-04-07 | 삼성전자 주식회사 | 광원 패키지 및 그를 포함하는 표시 장치 |
| US9397309B2 (en) | 2014-03-13 | 2016-07-19 | Universal Display Corporation | Organic electroluminescent devices |
| KR101458389B1 (ko) | 2014-04-01 | 2014-11-06 | (주)유비쿼스 | G.hn 기술을 엑세스 네트워크에 적용하기 위한 장치 |
| WO2015156588A1 (ko) | 2014-04-07 | 2015-10-15 | 엘지이노텍 주식회사 | 발광소자 및 조명시스템 |
| US10361343B2 (en) | 2014-07-02 | 2019-07-23 | Trustees Of Boston University | Ultraviolet light emitting diodes |
| EP2988339B1 (en) | 2014-08-20 | 2019-03-27 | LG Innotek Co., Ltd. | Light emitting device |
| KR102282141B1 (ko) | 2014-09-02 | 2021-07-28 | 삼성전자주식회사 | 반도체 발광소자 |
| JP6330604B2 (ja) | 2014-09-24 | 2018-05-30 | 日亜化学工業株式会社 | 半導体発光素子 |
| KR20160062659A (ko) | 2014-11-25 | 2016-06-02 | 서울바이오시스 주식회사 | 자외선 발광 다이오드 |
| US10193020B2 (en) | 2014-12-19 | 2019-01-29 | Seoul Viosys Co., Ltd. | Semiconductor light emitting device and method of manufacturing the same |
| US9865772B2 (en) * | 2015-01-06 | 2018-01-09 | Apple Inc. | LED structures for reduced non-radiative sidewall recombination |
| KR20160105126A (ko) | 2015-02-27 | 2016-09-06 | 서울바이오시스 주식회사 | 스트레인 강화된 웰층을 갖는 발광 다이오드 |
| KR102239627B1 (ko) | 2015-03-26 | 2021-04-12 | 엘지이노텍 주식회사 | 발광 소자 패키지 |
| KR102416010B1 (ko) | 2015-03-31 | 2022-07-05 | 서울바이오시스 주식회사 | 자외선 발광 소자 |
| DE112016001618T5 (de) | 2015-04-09 | 2017-12-14 | Panasonic Intellectual Property Management Co., Ltd. | Lichtemittierende Nitridhalbleitervorrichtung |
| JP6860293B2 (ja) | 2015-04-28 | 2021-04-14 | 日機装株式会社 | 発光素子および発光素子の製造方法 |
| KR102388284B1 (ko) | 2015-05-26 | 2022-04-19 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자 |
| US9540252B1 (en) | 2015-06-08 | 2017-01-10 | Rayvio Corporation | Ultraviolet disinfection system |
| US9680057B2 (en) | 2015-09-17 | 2017-06-13 | Crystal Is, Inc. | Ultraviolet light-emitting devices incorporating two-dimensional hole gases |
| KR102391513B1 (ko) * | 2015-10-05 | 2022-04-27 | 삼성전자주식회사 | 물질막 적층체, 발광 소자, 발광 패키지, 및 발광 소자의 제조 방법 |
| CN120091672A (zh) | 2016-06-24 | 2025-06-03 | 苏州立琻半导体有限公司 | 半导体器件和包括半导体器件的半导体器件封装 |
| US10340415B2 (en) | 2016-09-01 | 2019-07-02 | Lg Innotek Co., Ltd. | Semiconductor device and semiconductor device package including the same |
| US10903395B2 (en) | 2016-11-24 | 2021-01-26 | Lg Innotek Co., Ltd. | Semiconductor device having varying concentrations of aluminum |
-
2017
- 2017-08-31 US US15/692,617 patent/US10340415B2/en active Active
- 2017-09-01 JP JP2017168498A patent/JP2018037660A/ja active Pending
- 2017-09-01 EP EP17188926.4A patent/EP3291314B1/en active Active
- 2017-09-01 EP EP22188346.5A patent/EP4102580A1/en active Pending
- 2017-09-01 CN CN201710780660.XA patent/CN107799639B/zh active Active
- 2017-09-01 CN CN202210482686.7A patent/CN114864772B/zh active Active
-
2019
- 2019-05-17 US US16/415,245 patent/US10937923B2/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005101532A1 (ja) * | 2004-04-16 | 2005-10-27 | Nitride Semiconductors Co., Ltd. | 窒化ガリウム系発光装置 |
| JP2008285758A (ja) * | 2008-06-02 | 2008-11-27 | Nippon Steel Corp | 一方向性電磁鋼板 |
| JP2010171272A (ja) * | 2009-01-23 | 2010-08-05 | Shin Etsu Handotai Co Ltd | 発光素子 |
| US20140103289A1 (en) * | 2010-04-30 | 2014-04-17 | Yitao Liao | High efficiency ultraviolet light emitting diode with band structure potential fluctuations |
| JP2012049337A (ja) * | 2010-08-26 | 2012-03-08 | Sharp Corp | 窒化物半導体素子および半導体光学装置 |
| JP2012216603A (ja) * | 2011-03-31 | 2012-11-08 | Sharp Corp | 窒化物半導体発光素子およびその製造方法 |
| JP2013105917A (ja) * | 2011-11-14 | 2013-05-30 | Dowa Electronics Materials Co Ltd | 半導体発光素子およびその製造方法 |
| JP2013149889A (ja) * | 2012-01-23 | 2013-08-01 | Stanley Electric Co Ltd | GaN系半導体発光素子 |
| WO2014123092A1 (ja) * | 2013-02-05 | 2014-08-14 | 株式会社トクヤマ | 窒化物半導体発光素子 |
| JP2015216352A (ja) * | 2014-04-24 | 2015-12-03 | 国立研究開発法人理化学研究所 | 紫外発光ダイオードおよびそれを備える電気機器 |
| JP2016044095A (ja) * | 2014-08-21 | 2016-04-04 | 三菱化学株式会社 | GaN基板およびGaN基板の製造方法 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200027268A (ko) * | 2018-09-04 | 2020-03-12 | 엘지이노텍 주식회사 | 반도체 소자 |
| KR102594206B1 (ko) | 2018-09-04 | 2023-10-26 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 |
| KR20200033667A (ko) * | 2018-09-20 | 2020-03-30 | 엘지이노텍 주식회사 | 발광소자 |
| KR102600336B1 (ko) | 2018-09-20 | 2023-11-09 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자 |
| JP2021057418A (ja) * | 2019-09-27 | 2021-04-08 | 旭化成株式会社 | 窒化物半導体素子 |
| JP7388859B2 (ja) | 2019-09-27 | 2023-11-29 | 旭化成株式会社 | 窒化物半導体素子 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107799639B (zh) | 2022-05-20 |
| CN114864772A (zh) | 2022-08-05 |
| EP4102580A1 (en) | 2022-12-14 |
| US20190280154A1 (en) | 2019-09-12 |
| CN114864772B (zh) | 2025-03-25 |
| US10937923B2 (en) | 2021-03-02 |
| US20180069150A1 (en) | 2018-03-08 |
| EP3291314A1 (en) | 2018-03-07 |
| US10340415B2 (en) | 2019-07-02 |
| EP3291314B1 (en) | 2022-08-31 |
| CN107799639A (zh) | 2018-03-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10937923B2 (en) | Semiconductor device and semiconductor device package including the same | |
| JP7290849B2 (ja) | 半導体素子及びこれを含む半導体素子パッケージ | |
| JP7403797B2 (ja) | 半導体素子およびこれを含む半導体素子パッケージ | |
| JP7287641B2 (ja) | 半導体素子 | |
| US11227973B2 (en) | Semiconductor device | |
| CN114864781B (zh) | 半导体器件 | |
| US11075321B2 (en) | Semiconductor device | |
| US11527677B2 (en) | Semiconductor device | |
| KR102582184B1 (ko) | 반도체 소자 및 이를 포함하는 반도체 소자 패키지 | |
| KR20180086068A (ko) | 반도체 소자 및 이를 포함하는 반도체 소자 패키지 | |
| KR102466006B1 (ko) | 반도체 소자 | |
| KR102648472B1 (ko) | 반도체 소자 및 이를 포함하는 반도체 소자 패키지 | |
| KR20190015036A (ko) | 반도체 소자 및 이를 포함하는 반도체 소자 패키지 | |
| KR102619743B1 (ko) | 반도체 소자 | |
| KR102430086B1 (ko) | 반도체 소자 | |
| KR102552889B1 (ko) | 반도체 소자, 반도체 소자 패키지, 및 반도체 소자 제조방법 | |
| KR20210030718A (ko) | 반도체 소자 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190311 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190311 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20190311 |
|
| A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20190313 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190402 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190701 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190903 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20191202 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200131 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20200324 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200722 |
|
| C60 | Trial request (containing other claim documents, opposition documents) |
Free format text: JAPANESE INTERMEDIATE CODE: C60 Effective date: 20200722 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20200805 |
|
| C21 | Notice of transfer of a case for reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C21 Effective date: 20200811 |
|
| A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20201106 |
|
| C211 | Notice of termination of reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C211 Effective date: 20201110 |
|
| C22 | Notice of designation (change) of administrative judge |
Free format text: JAPANESE INTERMEDIATE CODE: C22 Effective date: 20201215 |
|
| C22 | Notice of designation (change) of administrative judge |
Free format text: JAPANESE INTERMEDIATE CODE: C22 Effective date: 20210406 |
|
| C23 | Notice of termination of proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C23 Effective date: 20210615 |
|
| C03 | Trial/appeal decision taken |
Free format text: JAPANESE INTERMEDIATE CODE: C03 Effective date: 20210720 |
|
| C30A | Notification sent |
Free format text: JAPANESE INTERMEDIATE CODE: C3012 Effective date: 20210720 |