JP2018024832A - 半導体封止用エポキシ樹脂組成物および半導体装置 - Google Patents

半導体封止用エポキシ樹脂組成物および半導体装置 Download PDF

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Publication number
JP2018024832A
JP2018024832A JP2017112860A JP2017112860A JP2018024832A JP 2018024832 A JP2018024832 A JP 2018024832A JP 2017112860 A JP2017112860 A JP 2017112860A JP 2017112860 A JP2017112860 A JP 2017112860A JP 2018024832 A JP2018024832 A JP 2018024832A
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Japan
Prior art keywords
epoxy resin
resin composition
semiconductor
curing agent
semiconductor encapsulation
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Pending
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JP2017112860A
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Japanese (ja)
Inventor
千織 篠▲崎▼
chiori Shinozaki
千織 篠▲崎▼
真 高本
Makoto Takamoto
真 高本
鈴木　達
Tatsu Suzuki
達 鈴木
昌也 光田
Masaya Mitsuta
昌也 光田
和彦 嶽出
Kazuhiko Dakede
和彦 嶽出
隆秀 松永
Takahide Matsunaga
隆秀 松永
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of JP2018024832A publication Critical patent/JP2018024832A/ja
Priority to JP2022024581A priority Critical patent/JP2022066237A/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2017112860A 2016-07-29 2017-06-07 半導体封止用エポキシ樹脂組成物および半導体装置 Pending JP2018024832A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022024581A JP2022066237A (ja) 2016-07-29 2022-02-21 半導体封止用エポキシ樹脂組成物および半導体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016150431 2016-07-29
JP2016150431 2016-07-29

Related Child Applications (1)

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JP2022024581A Division JP2022066237A (ja) 2016-07-29 2022-02-21 半導体封止用エポキシ樹脂組成物および半導体装置

Publications (1)

Publication Number Publication Date
JP2018024832A true JP2018024832A (ja) 2018-02-15

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JP2017112860A Pending JP2018024832A (ja) 2016-07-29 2017-06-07 半導体封止用エポキシ樹脂組成物および半導体装置
JP2022024581A Pending JP2022066237A (ja) 2016-07-29 2022-02-21 半導体封止用エポキシ樹脂組成物および半導体装置

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Country Status (4)

Country Link
JP (2) JP2018024832A (ko)
KR (1) KR102340215B1 (ko)
CN (1) CN107663357B (ko)
TW (1) TW201815954A (ko)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021153691A1 (ja) * 2020-01-30 2021-08-05 昭和電工マテリアルズ株式会社 コンパウンド、成形体、及びコンパウンドの硬化物
WO2021241521A1 (ja) * 2020-05-26 2021-12-02 昭和電工マテリアルズ株式会社 コンパウンド、成型体及び硬化物
WO2021241515A1 (ja) * 2020-05-26 2021-12-02 昭和電工マテリアルズ株式会社 コンパウンド、成型体及び硬化物
WO2021241513A1 (ja) * 2020-05-26 2021-12-02 昭和電工マテリアルズ株式会社 コンパウンド、成型体、及び硬化物

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102307666B1 (ko) * 2018-04-16 2021-10-05 스미또모 베이크라이트 가부시키가이샤 전자 장치의 제조 방법
KR102408992B1 (ko) * 2019-09-11 2022-06-14 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자

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JP2008133450A (ja) * 2006-10-30 2008-06-12 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
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JP2010159401A (ja) * 2008-12-10 2010-07-22 Sumitomo Bakelite Co Ltd 半導体封止用樹脂組成物、半導体装置の製造方法及び半導体装置
JP2012077214A (ja) * 2010-10-01 2012-04-19 Namics Corp エポキシ樹脂組成物及びそれを使用した半導体装置
WO2015005275A1 (ja) * 2013-07-11 2015-01-15 住友ベークライト株式会社 半導体装置の製造方法および半導体装置
JP2015098521A (ja) * 2013-11-19 2015-05-28 住友ベークライト株式会社 封止用樹脂組成物及び電子部品装置

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021153691A1 (ja) * 2020-01-30 2021-08-05 昭和電工マテリアルズ株式会社 コンパウンド、成形体、及びコンパウンドの硬化物
WO2021241521A1 (ja) * 2020-05-26 2021-12-02 昭和電工マテリアルズ株式会社 コンパウンド、成型体及び硬化物
WO2021241515A1 (ja) * 2020-05-26 2021-12-02 昭和電工マテリアルズ株式会社 コンパウンド、成型体及び硬化物
WO2021241513A1 (ja) * 2020-05-26 2021-12-02 昭和電工マテリアルズ株式会社 コンパウンド、成型体、及び硬化物

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Publication number Publication date
KR20180013751A (ko) 2018-02-07
KR102340215B1 (ko) 2021-12-17
CN107663357A (zh) 2018-02-06
TW201815954A (zh) 2018-05-01
CN107663357B (zh) 2021-12-31
JP2022066237A (ja) 2022-04-28

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