JP2017505999A5 - - Google Patents
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- Publication number
- JP2017505999A5 JP2017505999A5 JP2016549269A JP2016549269A JP2017505999A5 JP 2017505999 A5 JP2017505999 A5 JP 2017505999A5 JP 2016549269 A JP2016549269 A JP 2016549269A JP 2016549269 A JP2016549269 A JP 2016549269A JP 2017505999 A5 JP2017505999 A5 JP 2017505999A5
- Authority
- JP
- Japan
- Prior art keywords
- die
- layer
- substrate
- forming
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 18
- 229910052751 metal Inorganic materials 0.000 claims 18
- 239000000758 substrate Substances 0.000 claims 14
- 238000007747 plating Methods 0.000 claims 10
- 238000000034 method Methods 0.000 claims 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- 238000000151 deposition Methods 0.000 claims 4
- 229910000679 solder Inorganic materials 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 3
- 229910052802 copper Inorganic materials 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 3
- 239000011521 glass Substances 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 238000000231 atomic layer deposition Methods 0.000 claims 1
- 238000011065 in-situ storage Methods 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461941345P | 2014-02-18 | 2014-02-18 | |
| US61/941,345 | 2014-02-18 | ||
| US14/254,494 US10971476B2 (en) | 2014-02-18 | 2014-04-16 | Bottom package with metal post interconnections |
| US14/254,494 | 2014-04-16 | ||
| PCT/US2015/014870 WO2015126638A1 (en) | 2014-02-18 | 2015-02-06 | Bottom package with metal post interconnections |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017505999A JP2017505999A (ja) | 2017-02-23 |
| JP2017505999A5 true JP2017505999A5 (enExample) | 2018-03-01 |
Family
ID=53798778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016549269A Pending JP2017505999A (ja) | 2014-02-18 | 2015-02-06 | 金属ポスト相互接続部を備えた下部パッケージ |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10971476B2 (enExample) |
| EP (1) | EP3108499B1 (enExample) |
| JP (1) | JP2017505999A (enExample) |
| CN (1) | CN106030791A (enExample) |
| WO (1) | WO2015126638A1 (enExample) |
Families Citing this family (48)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US9318452B2 (en) | 2014-03-21 | 2016-04-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor packages and methods of forming the same |
| US9735129B2 (en) * | 2014-03-21 | 2017-08-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor packages and methods of forming the same |
| US9478521B2 (en) * | 2014-09-25 | 2016-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package-on-package Structure |
| US9443799B2 (en) | 2014-12-16 | 2016-09-13 | International Business Machines Corporation | Interposer with lattice construction and embedded conductive metal structures |
| US10515884B2 (en) * | 2015-02-17 | 2019-12-24 | Advanced Semiconductor Engineering, Inc. | Substrate having a conductive structure within photo-sensitive resin |
| KR20160122020A (ko) * | 2015-04-13 | 2016-10-21 | 에스케이하이닉스 주식회사 | 기판 및 이를 구비하는 반도체 패키지 |
| US9437536B1 (en) | 2015-05-08 | 2016-09-06 | Invensas Corporation | Reversed build-up substrate for 2.5D |
| US10211160B2 (en) * | 2015-09-08 | 2019-02-19 | Invensas Corporation | Microelectronic assembly with redistribution structure formed on carrier |
| US10438881B2 (en) * | 2015-10-29 | 2019-10-08 | Marvell World Trade Ltd. | Packaging arrangements including high density interconnect bridge |
| US10707171B2 (en) | 2015-12-22 | 2020-07-07 | Intel Corporation | Ultra small molded module integrated with die by module-on-wafer assembly |
| US10204893B2 (en) | 2016-05-19 | 2019-02-12 | Invensas Bonding Technologies, Inc. | Stacked dies and methods for forming bonded structures |
| US9865566B1 (en) * | 2016-06-15 | 2018-01-09 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and manufacturing method thereof |
| US9960328B2 (en) * | 2016-09-06 | 2018-05-01 | Amkor Technology, Inc. | Semiconductor device and manufacturing method thereof |
| KR101942727B1 (ko) * | 2016-09-12 | 2019-01-28 | 삼성전기 주식회사 | 팬-아웃 반도체 패키지 |
| WO2018063171A1 (en) * | 2016-09-28 | 2018-04-05 | Intel Corporation | Thermal conductivity for integrated circuit packaging |
| US10249552B2 (en) * | 2017-02-22 | 2019-04-02 | Jmj Korea Co., Ltd. | Semiconductor package having double-sided heat dissipation structure |
| US10217720B2 (en) | 2017-06-15 | 2019-02-26 | Invensas Corporation | Multi-chip modules formed using wafer-level processing of a reconstitute wafer |
| WO2018230534A1 (ja) * | 2017-06-16 | 2018-12-20 | 株式会社村田製作所 | 回路基板および回路モジュール、ならびに回路基板の製造方法および回路モジュールの製造方法 |
| US10504854B2 (en) * | 2017-12-07 | 2019-12-10 | Intel Corporation | Through-stiffener inerconnects for package-on-package apparatus and methods of assembling same |
| CN109962152B (zh) * | 2017-12-25 | 2024-06-18 | 成都万应微电子有限公司 | 热电冷却基板及封装方法、集成电路芯片及封装方法 |
| US10468339B2 (en) | 2018-01-19 | 2019-11-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Heterogeneous fan-out structure and method of manufacture |
| KR102063470B1 (ko) * | 2018-05-03 | 2020-01-09 | 삼성전자주식회사 | 반도체 패키지 |
| US11276676B2 (en) | 2018-05-15 | 2022-03-15 | Invensas Bonding Technologies, Inc. | Stacked devices and methods of fabrication |
| US10910344B2 (en) | 2018-06-22 | 2021-02-02 | Xcelsis Corporation | Systems and methods for releveled bump planes for chiplets |
| US11158606B2 (en) | 2018-07-06 | 2021-10-26 | Invensas Bonding Technologies, Inc. | Molded direct bonded and interconnected stack |
| US11462419B2 (en) | 2018-07-06 | 2022-10-04 | Invensas Bonding Technologies, Inc. | Microelectronic assemblies |
| CN109216298A (zh) * | 2018-08-10 | 2019-01-15 | 华进半导体封装先导技术研发中心有限公司 | 一种扇出型芯片封装结构及其制造方法 |
| CN109300882A (zh) * | 2018-09-20 | 2019-02-01 | 蔡亲佳 | 堆叠嵌入式封装结构及其制作方法 |
| JP7245037B2 (ja) * | 2018-11-30 | 2023-03-23 | ローム株式会社 | 半導体装置 |
| CN109994438B (zh) * | 2019-03-29 | 2021-04-02 | 上海中航光电子有限公司 | 芯片封装结构及其封装方法 |
| US10930592B2 (en) * | 2019-05-07 | 2021-02-23 | Google Llc | Wafer level fan-out application specific integrated circuit bridge memory stack |
| US11296053B2 (en) | 2019-06-26 | 2022-04-05 | Invensas Bonding Technologies, Inc. | Direct bonded stack structures for increased reliability and improved yield in microelectronics |
| US12388061B2 (en) | 2019-08-02 | 2025-08-12 | Amkor Technology Singapore Holding Pte. Ltd. | Semiconductor device and method of manufacturing semiconductor device |
| US11171127B2 (en) * | 2019-08-02 | 2021-11-09 | Amkor Technology Singapore Holding Pte. Ltd. | Semiconductor device and method of manufacturing semiconductor device |
| US11133263B2 (en) | 2019-09-17 | 2021-09-28 | Intel Corporation | High-density interconnects for integrated circuit packages |
| US11581262B2 (en) * | 2019-10-02 | 2023-02-14 | Qualcomm Incorporated | Package comprising a die and die side redistribution layers (RDL) |
| US11631647B2 (en) | 2020-06-30 | 2023-04-18 | Adeia Semiconductor Bonding Technologies Inc. | Integrated device packages with integrated device die and dummy element |
| US11282756B2 (en) * | 2020-08-17 | 2022-03-22 | Taiwan Semiconductor Manufacturing Company Limited | Organic interposer including stress-resistant bonding structures and methods of forming the same |
| US11764177B2 (en) * | 2020-09-04 | 2023-09-19 | Adeia Semiconductor Bonding Technologies Inc. | Bonded structure with interconnect structure |
| US11728273B2 (en) | 2020-09-04 | 2023-08-15 | Adeia Semiconductor Bonding Technologies Inc. | Bonded structure with interconnect structure |
| US12341116B2 (en) * | 2021-01-06 | 2025-06-24 | Huawei Technologies Co., Ltd. | Chip package structure, preparation method, and electronic device |
| US11682607B2 (en) * | 2021-02-01 | 2023-06-20 | Qualcomm Incorporated | Package having a substrate comprising surface interconnects aligned with a surface of the substrate |
| CN113130420B (zh) * | 2021-03-19 | 2024-10-18 | 南通越亚半导体有限公司 | 一种嵌埋封装结构及其制造方法 |
| US12308346B2 (en) * | 2021-06-17 | 2025-05-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor die with tapered sidewall in package |
| TWI825975B (zh) * | 2021-09-10 | 2023-12-11 | 美商愛玻索立克公司 | 已清洗的封裝用基板的製造方法以及已清洗的封裝用基板 |
| US20230094820A1 (en) | 2021-09-22 | 2023-03-30 | Rahul N. Manepalli | Microelectronic packages with embedded interposers |
| US12165952B2 (en) * | 2022-02-16 | 2024-12-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Interposer directly bonded to bonding pads on a plurality of dies |
| US20240071938A1 (en) * | 2022-08-31 | 2024-02-29 | Intel Corporation | Cavity-less interconnect component on glass core |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3798620B2 (ja) | 2000-12-04 | 2006-07-19 | 富士通株式会社 | 半導体装置の製造方法 |
| JP4056854B2 (ja) | 2002-11-05 | 2008-03-05 | 新光電気工業株式会社 | 半導体装置の製造方法 |
| JP3975194B2 (ja) | 2003-12-02 | 2007-09-12 | 株式会社フジクラ | パッケージの製造方法 |
| JP4498991B2 (ja) * | 2005-07-15 | 2010-07-07 | 新光電気工業株式会社 | 半導体装置及び電子装置 |
| US20080023805A1 (en) | 2006-07-26 | 2008-01-31 | Texas Instruments Incorporated | Array-Processed Stacked Semiconductor Packages |
| JP2008091795A (ja) | 2006-10-04 | 2008-04-17 | Shinko Electric Ind Co Ltd | 半導体装置および半導体装置の製造方法 |
| US20080136004A1 (en) * | 2006-12-08 | 2008-06-12 | Advanced Chip Engineering Technology Inc. | Multi-chip package structure and method of forming the same |
| FR2932004B1 (fr) | 2008-06-03 | 2011-08-05 | Commissariat Energie Atomique | Dispositif electronique empile et procede de realisation d'un tel dispositif electronique |
| US8587129B2 (en) | 2009-07-31 | 2013-11-19 | Stats Chippac Ltd. | Integrated circuit packaging system with through silicon via base and method of manufacture thereof |
| US20110147908A1 (en) | 2009-12-17 | 2011-06-23 | Peng Sun | Module for Use in a Multi Package Assembly and a Method of Making the Module and the Multi Package Assembly |
| KR20120007839A (ko) | 2010-07-15 | 2012-01-25 | 삼성전자주식회사 | 적층형 반도체 패키지의 제조방법 |
| JP2012079734A (ja) | 2010-09-30 | 2012-04-19 | Teramikros Inc | 半導体装置及び半導体デバイス並びにそれらの製造方法 |
| US20120080787A1 (en) | 2010-10-05 | 2012-04-05 | Qualcomm Incorporated | Electronic Package and Method of Making an Electronic Package |
| KR20120048991A (ko) * | 2010-11-08 | 2012-05-16 | 삼성전자주식회사 | 반도체 장치 및 그 제조 방법 |
| US8941222B2 (en) * | 2010-11-11 | 2015-01-27 | Advanced Semiconductor Engineering Inc. | Wafer level semiconductor package and manufacturing methods thereof |
| US20130181359A1 (en) | 2012-01-13 | 2013-07-18 | TW Semiconductor Manufacturing Company, Ltd. | Methods and Apparatus for Thinner Package on Package Structures |
| US9412689B2 (en) | 2012-01-24 | 2016-08-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor packaging structure and method |
| TWI508249B (zh) | 2012-04-02 | 2015-11-11 | 矽品精密工業股份有限公司 | 封裝件、半導體封裝結構及其製法 |
| JP6038517B2 (ja) | 2012-07-13 | 2016-12-07 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
| US9735087B2 (en) * | 2012-09-20 | 2017-08-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer level embedded heat spreader |
| US9252065B2 (en) * | 2013-11-22 | 2016-02-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Mechanisms for forming package structure |
-
2014
- 2014-04-16 US US14/254,494 patent/US10971476B2/en active Active
-
2015
- 2015-02-06 JP JP2016549269A patent/JP2017505999A/ja active Pending
- 2015-02-06 WO PCT/US2015/014870 patent/WO2015126638A1/en not_active Ceased
- 2015-02-06 CN CN201580008881.4A patent/CN106030791A/zh active Pending
- 2015-02-06 EP EP15704689.7A patent/EP3108499B1/en active Active
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