|
WO2017052905A1
(en)
*
|
2015-09-22 |
2017-03-30 |
Applied Materials, Inc. |
Apparatus and method for selective deposition
|
|
KR102689380B1
(ko)
|
2016-01-26 |
2024-07-26 |
어플라이드 머티어리얼스, 인코포레이티드 |
웨이퍼 에지 링 리프팅 솔루션
|
|
US10190865B2
(en)
*
|
2016-01-27 |
2019-01-29 |
Lam Research Corporation |
Verifying end effector flatness using electrical continuity
|
|
US10521774B2
(en)
*
|
2016-03-22 |
2019-12-31 |
Asm Ip Holding B.V. |
Preventive maintenance system and preventive maintenance method
|
|
US20180061696A1
(en)
*
|
2016-08-23 |
2018-03-01 |
Applied Materials, Inc. |
Edge ring or process kit for semiconductor process module
|
|
CN108927261A
(zh)
*
|
2017-05-25 |
2018-12-04 |
郑州洁普智能环保技术有限公司 |
一种反击式破碎机
|
|
US10978333B2
(en)
*
|
2017-11-14 |
2021-04-13 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Systems and methods for robotic arm sensing
|
|
US11067515B2
(en)
*
|
2017-11-28 |
2021-07-20 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Apparatus and method for inspecting a wafer process chamber
|
|
CN109841536A
(zh)
*
|
2017-11-29 |
2019-06-04 |
长鑫存储技术有限公司 |
边缘补偿系统、晶圆载台系统及晶圆安装方法
|
|
US11538713B2
(en)
*
|
2017-12-05 |
2022-12-27 |
Lam Research Corporation |
System and method for edge ring wear compensation
|
|
CN108375608A
(zh)
*
|
2018-03-12 |
2018-08-07 |
昆山国显光电有限公司 |
基板检测装置
|
|
JP2019201125A
(ja)
*
|
2018-05-17 |
2019-11-21 |
三菱電機株式会社 |
ウエハ研削装置およびウエハ研削方法
|
|
KR102433436B1
(ko)
|
2018-07-04 |
2022-08-17 |
삼성전자주식회사 |
기판 처리 시스템, 기판 처리 시스템에서의 에지 링 정렬 검사 방법 및 이를 수행하기 위한 원반형 비젼 센서
|
|
JP6999241B2
(ja)
*
|
2018-07-25 |
2022-01-18 |
株式会社ディスコ |
プラズマエッチング装置
|
|
US10651097B2
(en)
*
|
2018-08-30 |
2020-05-12 |
Lam Research Corporation |
Using identifiers to map edge ring part numbers onto slot numbers
|
|
CN109283184A
(zh)
*
|
2018-09-03 |
2019-01-29 |
浙江大学 |
一种基于光谱共焦传感器的表面疵病测量方法
|
|
US11521872B2
(en)
*
|
2018-09-04 |
2022-12-06 |
Applied Materials, Inc. |
Method and apparatus for measuring erosion and calibrating position for a moving process kit
|
|
JP7211896B2
(ja)
*
|
2018-11-30 |
2023-01-24 |
東京エレクトロン株式会社 |
プラズマ処理装置、算出方法および算出プログラム
|
|
US12444632B2
(en)
*
|
2018-12-12 |
2025-10-14 |
Tokyo Electron Limited |
System of processing substrate, transfer method, transfer program, and holder
|
|
CN113711342B
(zh)
*
|
2019-02-14 |
2025-06-17 |
柿子技术公司 |
用于机器人系统的基于雷达的位置测量
|
|
JP7357453B2
(ja)
|
2019-03-07 |
2023-10-06 |
東京エレクトロン株式会社 |
基板処理システムおよび基板の搬送方法
|
|
WO2020205586A1
(en)
|
2019-03-29 |
2020-10-08 |
Lam Research Corporation |
Wafer placement correction in indexed multi-station processing chambers
|
|
US11279032B2
(en)
|
2019-04-11 |
2022-03-22 |
Applied Materials, Inc. |
Apparatus, systems, and methods for improved joint coordinate teaching accuracy of robots
|
|
US10964584B2
(en)
|
2019-05-20 |
2021-03-30 |
Applied Materials, Inc. |
Process kit ring adaptor
|
|
US12165905B2
(en)
|
2019-05-20 |
2024-12-10 |
Applied Materials, Inc. |
Process kit enclosure system
|
|
US11913777B2
(en)
|
2019-06-11 |
2024-02-27 |
Applied Materials, Inc. |
Detector for process kit ring wear
|
|
US11626305B2
(en)
|
2019-06-25 |
2023-04-11 |
Applied Materials, Inc. |
Sensor-based correction of robot-held object
|
|
KR102689653B1
(ko)
|
2019-06-26 |
2024-07-31 |
삼성전자주식회사 |
센서 모듈 및 이를 구비하는 식각 장치
|
|
KR102232666B1
(ko)
*
|
2019-06-27 |
2021-03-30 |
세메스 주식회사 |
기판 처리 장치 및 부품 상태 검출 방법
|
|
US11211269B2
(en)
|
2019-07-19 |
2021-12-28 |
Applied Materials, Inc. |
Multi-object capable loadlock system
|
|
CN120663299A
(zh)
|
2019-07-26 |
2025-09-19 |
朗姆研究公司 |
用于自动化晶片搬运机械手教导与健康检查的整合适应性定位系统及例程
|
|
CN112444210A
(zh)
*
|
2019-08-30 |
2021-03-05 |
长鑫存储技术有限公司 |
平面相对位置检测工具及其检测方法
|
|
US12215966B2
(en)
*
|
2019-12-06 |
2025-02-04 |
Applied Materials, Inc. |
Methods and systems of optical inspection of electronic device manufacturing machines
|
|
US11370114B2
(en)
|
2019-12-09 |
2022-06-28 |
Applied Materials, Inc. |
Autoteach enclosure system
|
|
CN114830317A
(zh)
*
|
2019-12-19 |
2022-07-29 |
朗姆研究公司 |
消耗性室部件中的封装式射频识别
|
|
KR20210103956A
(ko)
*
|
2020-02-13 |
2021-08-24 |
에이에스엠 아이피 홀딩 비.브이. |
수광 장치를 포함하는 기판 처리 장치 및 수광 장치의 교정 방법
|
|
US12486120B2
(en)
|
2020-03-23 |
2025-12-02 |
Applied Materials, Inc. |
Substrate processing system carrier
|
|
US12027397B2
(en)
|
2020-03-23 |
2024-07-02 |
Applied Materials, Inc |
Enclosure system shelf including alignment features
|
|
US12033838B2
(en)
*
|
2020-03-24 |
2024-07-09 |
Tokyo Electron Limited |
Plasma processing apparatus and wear amount measurement method
|
|
US11589474B2
(en)
|
2020-06-02 |
2023-02-21 |
Applied Materials, Inc. |
Diagnostic disc with a high vacuum and temperature tolerant power source
|
|
USD954769S1
(en)
|
2020-06-02 |
2022-06-14 |
Applied Materials, Inc. |
Enclosure system shelf
|
|
USD980176S1
(en)
|
2020-06-02 |
2023-03-07 |
Applied Materials, Inc. |
Substrate processing system carrier
|
|
US11924972B2
(en)
|
2020-06-02 |
2024-03-05 |
Applied Materials, Inc. |
Diagnostic disc with a high vacuum and temperature tolerant power source
|
|
JP6989980B2
(ja)
*
|
2020-06-15 |
2022-01-12 |
アダプティブ プラズマ テクノロジー コーポレーション |
半導体工程のための部品整列装置及びこれによる部品整列方法
|
|
KR102349160B1
(ko)
*
|
2020-07-03 |
2022-01-12 |
한국전력공사 |
디스크 커터의 마모도 측정 장치, 디스크 커터의 마모 관리 시스템, 및 그 구동방법
|
|
JP7507639B2
(ja)
*
|
2020-09-02 |
2024-06-28 |
東京エレクトロン株式会社 |
基板処理システム及び状態監視方法
|
|
US11284018B1
(en)
|
2020-09-15 |
2022-03-22 |
Applied Materials, Inc. |
Smart camera substrate
|
|
KR102585286B1
(ko)
*
|
2020-10-15 |
2023-10-05 |
세메스 주식회사 |
기판 처리 장치 및 소모성 부품의 마모도 측정 방법
|
|
TWI759913B
(zh)
*
|
2020-10-16 |
2022-04-01 |
天虹科技股份有限公司 |
原子層沉積薄膜厚度的檢測系統及檢測方法
|
|
JP7499142B2
(ja)
*
|
2020-10-23 |
2024-06-13 |
東京エレクトロン株式会社 |
処理システム及び処理方法
|
|
TWI759960B
(zh)
*
|
2020-11-12 |
2022-04-01 |
南韓商自適應等離子體技術公司 |
半導體部件的更換監控裝置以及其部件更換監控方法
|
|
KR102867342B1
(ko)
|
2020-11-26 |
2025-10-01 |
삼성전자주식회사 |
플라즈마 처리 장치 및 이를 이용한 반도체 소자 제조방법
|
|
JP7153362B2
(ja)
*
|
2020-12-08 |
2022-10-14 |
アダプティブ プラズマ テクノロジー コーポレーション |
半導体部品の交換監視装置及びこれによる部品交換監視方法
|
|
CN114613657B
(zh)
|
2020-12-09 |
2025-11-07 |
细美事有限公司 |
用于晶片型传感器的充电和自动校准的控制程序、容器及半导体元件制造设备
|
|
KR102591723B1
(ko)
*
|
2020-12-09 |
2023-10-20 |
세메스 주식회사 |
기판 처리 시스템 및 이를 포함하는 오토 티칭 시스템
|
|
CN114628298A
(zh)
*
|
2020-12-10 |
2022-06-14 |
自适应等离子体技术公司 |
半导体部件的更换监控装置以及其部件更换监控方法
|
|
JP7534048B2
(ja)
*
|
2021-01-20 |
2024-08-14 |
東京エレクトロン株式会社 |
プラズマ処理システム及びプラズマ処理方法
|
|
US12159795B2
(en)
|
2021-03-08 |
2024-12-03 |
Applied Materials, Inc. |
Enclosure system having walls comprising sidewalls and radio-frequency identifier holder coupled to rear wall
|
|
JP7616941B2
(ja)
*
|
2021-05-11 |
2025-01-17 |
東京エレクトロン株式会社 |
基板処理システム及び環状部材の高さ推定方法
|
|
CN115527825A
(zh)
*
|
2021-06-25 |
2022-12-27 |
中微半导体设备(上海)股份有限公司 |
一种用于等离子体处理设备的检测装置及等离子体处理设备
|
|
US20230008072A1
(en)
*
|
2021-07-08 |
2023-01-12 |
Applied Materials, Inc. |
Method and mechanism for contact-free process chamber characterization
|
|
KR102632552B1
(ko)
|
2021-07-23 |
2024-02-02 |
한국표준과학연구원 |
플라즈마 진단기능 및 유전체 두께 측정기능을 갖는 센서, 이를 구비하는 공정장치 및 공정시스템
|
|
KR20240051153A
(ko)
*
|
2021-08-17 |
2024-04-19 |
도쿄엘렉트론가부시키가이샤 |
반도체 플라즈마 공정 챔버 내의 소모성 부품의 특성을 측정하기 위한 광센서
|
|
US20230089982A1
(en)
*
|
2021-09-10 |
2023-03-23 |
Applied Materials, Inc. |
Methods and mechanisms for coupling sensors to transfer chamber robot
|
|
US12216455B2
(en)
|
2022-01-25 |
2025-02-04 |
Applied Materials, Inc. |
Chamber component condition estimation using substrate measurements
|
|
US12339645B2
(en)
*
|
2022-01-25 |
2025-06-24 |
Applied Materials, Inc. |
Estimation of chamber component conditions using substrate measurements
|
|
JP7692853B2
(ja)
*
|
2022-01-31 |
2025-06-16 |
東京エレクトロン株式会社 |
エッチング制御方法およびエッチング制御システム
|
|
JP7305076B1
(ja)
*
|
2022-09-01 |
2023-07-07 |
三菱電機株式会社 |
データ収集分析システム、測定データ収集ユニット、および、データ収集分析方法
|
|
DE102022209644B3
(de)
*
|
2022-09-14 |
2024-02-01 |
Carl Zeiss Smt Gmbh |
Verfahren zum Charakterisieren eines Abschirmelements einer Teilchenstrahlvorrichtung, Mittel zum Charakterisieren des Abschirmelements, eine Teilchenstrahlvorrichtung und ein entsprechendes Computerprogramm
|
|
TW202507913A
(zh)
|
2023-02-13 |
2025-02-16 |
日商東京威力科創股份有限公司 |
基板處理裝置及基板處理方法
|
|
WO2024219076A1
(ja)
*
|
2023-04-21 |
2024-10-24 |
東京エレクトロン株式会社 |
基板処理システム
|
|
KR20250046754A
(ko)
*
|
2023-09-27 |
2025-04-03 |
주식회사 더블유지에스 |
플라즈마를 이용한 기판 검사 장치 및 방법
|
|
CN119361407A
(zh)
*
|
2023-10-23 |
2025-01-24 |
芯恩（青岛）集成电路有限公司 |
等离子刻蚀腔的加工时间预测方法、系统及维护方法
|
|
WO2025127100A1
(ja)
*
|
2023-12-15 |
2025-06-19 |
東京エレクトロン株式会社 |
情報処理方法、コンピュータプログラム、情報処理装置及び基板処理システム
|
|
CN119863650B
(zh)
*
|
2024-12-09 |
2025-08-22 |
中国石油大学(北京) |
一种钻头磨损检测方法、装置及设备
|