JP2012210698A5 - - Google Patents

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Publication number
JP2012210698A5
JP2012210698A5 JP2011243138A JP2011243138A JP2012210698A5 JP 2012210698 A5 JP2012210698 A5 JP 2012210698A5 JP 2011243138 A JP2011243138 A JP 2011243138A JP 2011243138 A JP2011243138 A JP 2011243138A JP 2012210698 A5 JP2012210698 A5 JP 2012210698A5
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JP
Japan
Prior art keywords
grinding
workpiece
thickness
relative position
measuring
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JP2011243138A
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English (en)
Japanese (ja)
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JP5851803B2 (ja
JP2012210698A (ja
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Application filed filed Critical
Priority to JP2011243138A priority Critical patent/JP5851803B2/ja
Priority claimed from JP2011243138A external-priority patent/JP5851803B2/ja
Priority to KR1020120024979A priority patent/KR101891345B1/ko
Priority to DE102012204092A priority patent/DE102012204092A1/de
Priority to TW101108995A priority patent/TWI558507B/zh
Publication of JP2012210698A publication Critical patent/JP2012210698A/ja
Publication of JP2012210698A5 publication Critical patent/JP2012210698A5/ja
Application granted granted Critical
Publication of JP5851803B2 publication Critical patent/JP5851803B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011243138A 2011-03-18 2011-11-07 薄板状ワークの研削方法及び両頭平面研削盤 Expired - Fee Related JP5851803B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011243138A JP5851803B2 (ja) 2011-03-18 2011-11-07 薄板状ワークの研削方法及び両頭平面研削盤
KR1020120024979A KR101891345B1 (ko) 2011-03-18 2012-03-12 박판형 워크의 연삭 방법 및 양두 평면 연삭반
DE102012204092A DE102012204092A1 (de) 2011-03-18 2012-03-15 Verfahren zum Schleifen von dünnen blattförmigen Werkstücken und Doppelend-Oberflächenschleifer
TW101108995A TWI558507B (zh) 2011-03-18 2012-03-16 薄板狀工件之研磨方法及雙頭平面磨床

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011060521 2011-03-18
JP2011060521 2011-03-18
JP2011243138A JP5851803B2 (ja) 2011-03-18 2011-11-07 薄板状ワークの研削方法及び両頭平面研削盤

Publications (3)

Publication Number Publication Date
JP2012210698A JP2012210698A (ja) 2012-11-01
JP2012210698A5 true JP2012210698A5 (enExample) 2014-11-27
JP5851803B2 JP5851803B2 (ja) 2016-02-03

Family

ID=46757088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011243138A Expired - Fee Related JP5851803B2 (ja) 2011-03-18 2011-11-07 薄板状ワークの研削方法及び両頭平面研削盤

Country Status (4)

Country Link
JP (1) JP5851803B2 (enExample)
KR (1) KR101891345B1 (enExample)
DE (1) DE102012204092A1 (enExample)
TW (1) TWI558507B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6383700B2 (ja) * 2015-04-07 2018-08-29 光洋機械工業株式会社 薄板状ワークの製造方法及び両頭平面研削装置
JP6749726B2 (ja) * 2016-08-09 2020-09-02 株式会社ディスコ 研削方法
JP7013908B2 (ja) * 2018-02-06 2022-02-01 トヨタ自動車株式会社 磨耗量測定装置
CN109344522B (zh) * 2018-10-17 2023-07-04 沈阳透平机械股份有限公司 一种用于轴流压缩机的静叶磨削量的计算方法及系统
CN112894520B (zh) * 2021-02-20 2023-04-18 南京超图中小企业信息服务有限公司 一种木板加工用双面抛光机
JP7601685B2 (ja) * 2021-03-31 2024-12-17 株式会社ディスコ 研削装置
CN119489375A (zh) * 2024-11-20 2025-02-21 西安奕斯伟材料科技股份有限公司 一种硅片研磨装置、方法及可读存储介质

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6296553B1 (en) * 1997-04-02 2001-10-02 Nippei Toyama Corporation Grinding method, surface grinder, workpiece support, mechanism and work rest
JP2005238444A (ja) * 1999-05-07 2005-09-08 Shin Etsu Handotai Co Ltd 両面同時研削方法および両面同時研削盤並びに両面同時ラップ方法および両面同時ラップ盤
JP2003071713A (ja) 2001-08-29 2003-03-12 Nippei Toyama Corp 研削装置及びウェーハの厚さ管理方法
JP2003236748A (ja) 2002-02-14 2003-08-26 Sumitomo Heavy Ind Ltd 研削装置
JP4319092B2 (ja) * 2004-06-03 2009-08-26 住友重機械工業株式会社 両面加工装置
JP4670566B2 (ja) * 2005-09-29 2011-04-13 信越半導体株式会社 半導体ウェーハの両頭研削装置、静圧パッドおよびこれを用いた両頭研削方法
DE102007030958B4 (de) * 2007-07-04 2014-09-11 Siltronic Ag Verfahren zum Schleifen von Halbleiterscheiben

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