JP5851803B2 - 薄板状ワークの研削方法及び両頭平面研削盤 - Google Patents

薄板状ワークの研削方法及び両頭平面研削盤 Download PDF

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Publication number
JP5851803B2
JP5851803B2 JP2011243138A JP2011243138A JP5851803B2 JP 5851803 B2 JP5851803 B2 JP 5851803B2 JP 2011243138 A JP2011243138 A JP 2011243138A JP 2011243138 A JP2011243138 A JP 2011243138A JP 5851803 B2 JP5851803 B2 JP 5851803B2
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JP
Japan
Prior art keywords
grinding
workpiece
sharpness
difference
wheels
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011243138A
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English (en)
Japanese (ja)
Other versions
JP2012210698A (ja
JP2012210698A5 (enExample
Inventor
篤志 芝中
篤志 芝中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JTEKT Machine Systems Corp
Original Assignee
Koyo Machine Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koyo Machine Industries Co Ltd filed Critical Koyo Machine Industries Co Ltd
Priority to JP2011243138A priority Critical patent/JP5851803B2/ja
Priority to KR1020120024979A priority patent/KR101891345B1/ko
Priority to DE102012204092A priority patent/DE102012204092A1/de
Priority to TW101108995A priority patent/TWI558507B/zh
Publication of JP2012210698A publication Critical patent/JP2012210698A/ja
Publication of JP2012210698A5 publication Critical patent/JP2012210698A5/ja
Application granted granted Critical
Publication of JP5851803B2 publication Critical patent/JP5851803B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/06—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent requiring comparison of the workpiece with standard gauging plugs, rings or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2011243138A 2011-03-18 2011-11-07 薄板状ワークの研削方法及び両頭平面研削盤 Expired - Fee Related JP5851803B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011243138A JP5851803B2 (ja) 2011-03-18 2011-11-07 薄板状ワークの研削方法及び両頭平面研削盤
KR1020120024979A KR101891345B1 (ko) 2011-03-18 2012-03-12 박판형 워크의 연삭 방법 및 양두 평면 연삭반
DE102012204092A DE102012204092A1 (de) 2011-03-18 2012-03-15 Verfahren zum Schleifen von dünnen blattförmigen Werkstücken und Doppelend-Oberflächenschleifer
TW101108995A TWI558507B (zh) 2011-03-18 2012-03-16 薄板狀工件之研磨方法及雙頭平面磨床

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011060521 2011-03-18
JP2011060521 2011-03-18
JP2011243138A JP5851803B2 (ja) 2011-03-18 2011-11-07 薄板状ワークの研削方法及び両頭平面研削盤

Publications (3)

Publication Number Publication Date
JP2012210698A JP2012210698A (ja) 2012-11-01
JP2012210698A5 JP2012210698A5 (enExample) 2014-11-27
JP5851803B2 true JP5851803B2 (ja) 2016-02-03

Family

ID=46757088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011243138A Expired - Fee Related JP5851803B2 (ja) 2011-03-18 2011-11-07 薄板状ワークの研削方法及び両頭平面研削盤

Country Status (4)

Country Link
JP (1) JP5851803B2 (enExample)
KR (1) KR101891345B1 (enExample)
DE (1) DE102012204092A1 (enExample)
TW (1) TWI558507B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6383700B2 (ja) * 2015-04-07 2018-08-29 光洋機械工業株式会社 薄板状ワークの製造方法及び両頭平面研削装置
JP6749726B2 (ja) * 2016-08-09 2020-09-02 株式会社ディスコ 研削方法
JP7013908B2 (ja) * 2018-02-06 2022-02-01 トヨタ自動車株式会社 磨耗量測定装置
CN109344522B (zh) * 2018-10-17 2023-07-04 沈阳透平机械股份有限公司 一种用于轴流压缩机的静叶磨削量的计算方法及系统
CN112894520B (zh) * 2021-02-20 2023-04-18 南京超图中小企业信息服务有限公司 一种木板加工用双面抛光机
JP7601685B2 (ja) * 2021-03-31 2024-12-17 株式会社ディスコ 研削装置
CN116690338B (zh) * 2023-06-27 2026-02-24 成都裕鸢航空智能制造股份有限公司 一种打磨抛光装置及其使用方法
CN119489375B (zh) * 2024-11-20 2026-04-28 西安奕斯伟材料科技股份有限公司 一种硅片研磨装置、方法及可读存储介质

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6296553B1 (en) * 1997-04-02 2001-10-02 Nippei Toyama Corporation Grinding method, surface grinder, workpiece support, mechanism and work rest
JP2005238444A (ja) * 1999-05-07 2005-09-08 Shin Etsu Handotai Co Ltd 両面同時研削方法および両面同時研削盤並びに両面同時ラップ方法および両面同時ラップ盤
JP2003071713A (ja) 2001-08-29 2003-03-12 Nippei Toyama Corp 研削装置及びウェーハの厚さ管理方法
JP2003236748A (ja) 2002-02-14 2003-08-26 Sumitomo Heavy Ind Ltd 研削装置
JP4319092B2 (ja) * 2004-06-03 2009-08-26 住友重機械工業株式会社 両面加工装置
JP4670566B2 (ja) * 2005-09-29 2011-04-13 信越半導体株式会社 半導体ウェーハの両頭研削装置、静圧パッドおよびこれを用いた両頭研削方法
DE102007030958B4 (de) * 2007-07-04 2014-09-11 Siltronic Ag Verfahren zum Schleifen von Halbleiterscheiben

Also Published As

Publication number Publication date
JP2012210698A (ja) 2012-11-01
TWI558507B (zh) 2016-11-21
TW201249594A (en) 2012-12-16
DE102012204092A1 (de) 2012-09-20
KR20120106577A (ko) 2012-09-26
KR101891345B1 (ko) 2018-08-24

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