TWI558507B - 薄板狀工件之研磨方法及雙頭平面磨床 - Google Patents
薄板狀工件之研磨方法及雙頭平面磨床 Download PDFInfo
- Publication number
- TWI558507B TWI558507B TW101108995A TW101108995A TWI558507B TW I558507 B TWI558507 B TW I558507B TW 101108995 A TW101108995 A TW 101108995A TW 101108995 A TW101108995 A TW 101108995A TW I558507 B TWI558507 B TW I558507B
- Authority
- TW
- Taiwan
- Prior art keywords
- workpiece
- grinding
- polishing
- pair
- difference
- Prior art date
Links
- 238000000227 grinding Methods 0.000 title claims description 390
- 238000000034 method Methods 0.000 title claims description 23
- 238000005498 polishing Methods 0.000 claims description 165
- 238000005520 cutting process Methods 0.000 claims description 150
- 230000003068 static effect Effects 0.000 claims description 96
- 238000012937 correction Methods 0.000 claims description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 23
- 230000014509 gene expression Effects 0.000 claims description 19
- 230000008859 change Effects 0.000 claims description 8
- 238000007517 polishing process Methods 0.000 claims description 2
- 239000004576 sand Substances 0.000 description 9
- 239000000523 sample Substances 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 230000002950 deficient Effects 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/06—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent requiring comparison of the workpiece with standard gauging plugs, rings or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011060521 | 2011-03-18 | ||
| JP2011243138A JP5851803B2 (ja) | 2011-03-18 | 2011-11-07 | 薄板状ワークの研削方法及び両頭平面研削盤 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201249594A TW201249594A (en) | 2012-12-16 |
| TWI558507B true TWI558507B (zh) | 2016-11-21 |
Family
ID=46757088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101108995A TWI558507B (zh) | 2011-03-18 | 2012-03-16 | 薄板狀工件之研磨方法及雙頭平面磨床 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5851803B2 (enExample) |
| KR (1) | KR101891345B1 (enExample) |
| DE (1) | DE102012204092A1 (enExample) |
| TW (1) | TWI558507B (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6383700B2 (ja) * | 2015-04-07 | 2018-08-29 | 光洋機械工業株式会社 | 薄板状ワークの製造方法及び両頭平面研削装置 |
| JP6749726B2 (ja) * | 2016-08-09 | 2020-09-02 | 株式会社ディスコ | 研削方法 |
| JP7013908B2 (ja) * | 2018-02-06 | 2022-02-01 | トヨタ自動車株式会社 | 磨耗量測定装置 |
| CN109344522B (zh) * | 2018-10-17 | 2023-07-04 | 沈阳透平机械股份有限公司 | 一种用于轴流压缩机的静叶磨削量的计算方法及系统 |
| CN112894520B (zh) * | 2021-02-20 | 2023-04-18 | 南京超图中小企业信息服务有限公司 | 一种木板加工用双面抛光机 |
| JP7601685B2 (ja) * | 2021-03-31 | 2024-12-17 | 株式会社ディスコ | 研削装置 |
| CN119489375A (zh) * | 2024-11-20 | 2025-02-21 | 西安奕斯伟材料科技股份有限公司 | 一种硅片研磨装置、方法及可读存储介质 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6296553B1 (en) * | 1997-04-02 | 2001-10-02 | Nippei Toyama Corporation | Grinding method, surface grinder, workpiece support, mechanism and work rest |
| JP2005342851A (ja) * | 2004-06-03 | 2005-12-15 | Sumitomo Heavy Ind Ltd | 両面加工装置 |
| TW200903620A (en) * | 2007-07-04 | 2009-01-16 | Siltronic Ag | Method for grinding semiconductor wafers |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005238444A (ja) * | 1999-05-07 | 2005-09-08 | Shin Etsu Handotai Co Ltd | 両面同時研削方法および両面同時研削盤並びに両面同時ラップ方法および両面同時ラップ盤 |
| JP2003071713A (ja) | 2001-08-29 | 2003-03-12 | Nippei Toyama Corp | 研削装置及びウェーハの厚さ管理方法 |
| JP2003236748A (ja) | 2002-02-14 | 2003-08-26 | Sumitomo Heavy Ind Ltd | 研削装置 |
| JP4670566B2 (ja) * | 2005-09-29 | 2011-04-13 | 信越半導体株式会社 | 半導体ウェーハの両頭研削装置、静圧パッドおよびこれを用いた両頭研削方法 |
-
2011
- 2011-11-07 JP JP2011243138A patent/JP5851803B2/ja not_active Expired - Fee Related
-
2012
- 2012-03-12 KR KR1020120024979A patent/KR101891345B1/ko active Active
- 2012-03-15 DE DE102012204092A patent/DE102012204092A1/de not_active Ceased
- 2012-03-16 TW TW101108995A patent/TWI558507B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6296553B1 (en) * | 1997-04-02 | 2001-10-02 | Nippei Toyama Corporation | Grinding method, surface grinder, workpiece support, mechanism and work rest |
| JP2005342851A (ja) * | 2004-06-03 | 2005-12-15 | Sumitomo Heavy Ind Ltd | 両面加工装置 |
| TW200903620A (en) * | 2007-07-04 | 2009-01-16 | Siltronic Ag | Method for grinding semiconductor wafers |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120106577A (ko) | 2012-09-26 |
| DE102012204092A1 (de) | 2012-09-20 |
| JP5851803B2 (ja) | 2016-02-03 |
| JP2012210698A (ja) | 2012-11-01 |
| TW201249594A (en) | 2012-12-16 |
| KR101891345B1 (ko) | 2018-08-24 |
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