JP5851803B2 - 薄板状ワークの研削方法及び両頭平面研削盤 - Google Patents
薄板状ワークの研削方法及び両頭平面研削盤 Download PDFInfo
- Publication number
- JP5851803B2 JP5851803B2 JP2011243138A JP2011243138A JP5851803B2 JP 5851803 B2 JP5851803 B2 JP 5851803B2 JP 2011243138 A JP2011243138 A JP 2011243138A JP 2011243138 A JP2011243138 A JP 2011243138A JP 5851803 B2 JP5851803 B2 JP 5851803B2
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- workpiece
- sharpness
- difference
- wheels
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/06—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent requiring comparison of the workpiece with standard gauging plugs, rings or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
M1,M2 測定値
X 相対位置
X0 研削基準位置
M1r,M2r 基準値
R1,R2 側面の位置
Xabs 絶対位置
1,2 静圧パッド
5,6 研削砥石
9,10 測定ヘッド
20 研削制御装置
22 位置演算手段
23 研削基準位置設定手段
24 位置比較手段
25 後退端補正手段
26 切れ味比較手段
27 研削条件補正手段
Claims (7)
- 一対の静圧パッド間の略中心に静圧保持された薄板状ワークの両側面を、一対の静圧パッド間の中心に対して略対称に配置され、且つ研削後退端からワークの研削精度が基準精度内に収まる研削前進端へと略同一速度で移動する一対の研削砥石により略同時に研削するに際し、
研削中のワークの両側面の静圧パッド間の中心に対する位置を測定して両研削砥石の切れ味を判断し、
両研削砥石間に切れ味差があるときに、両研削砥石の切れ味差がなくなるように、研削砥石の切れ味の変化に関係する研削条件を切れ味差に応じて補正する
ことを特徴とする薄板状ワークの研削方法。 - 研削中のワークの両側面の位置を比較してその差分により両研削砥石の砥石摩耗量の違いを算出し、
この砥石摩耗量の違いに基づいて両研削砥石の切れ味差を判断する
ことを特徴とする請求項1に記載の薄板状ワークの研削方法。 - 事前の研削においてワークの研削精度が基準精度内に収まったときのワークの両側面の位置を基準値とし、
この基準値と研削中のワークの両側面の位置の測定値との減算によりワークの両側面の位置を算出する
ことを特徴とする請求項1又は2に記載の薄板状ワークの研削方法。 - 研削中のワークの相対位置を算出し、
この相対位置と静圧パッド間にワークが適正に保持されるべき研削基準位置とを比較しその差分により切れ味差を判断する
ことを特徴とする請求項1に記載の薄板状ワークの研削方法。 - 当該ワークの研削中に研削砥石とワークとの間に供給される研削水の流量を切れ味差に応じて調整する
ことを特徴とする請求項1〜4の何れかに記載の薄板状ワークの研削方法。 - 当該ワークの研削において定寸装置からワークの定寸を示すゼロ信号を受信したときの研削砥石の切れ味差に応じて、当該ワークの研削後に研削砥石の回転数及び/又は切り込み速度を調整する
ことを特徴とする請求項1〜5の何れかに記載の薄板状ワークの研削方法。 - 一対の静圧パッド間の略中心に静圧保持された薄板状ワークの両側面を、一対の静圧パッド間の中心に対して略対称に配置され、且つ研削後退端からワークの研削精度が基準精度内に収まる研削前進端へと略同一速度で移動する一対の研削砥石により略同時に研削する両頭平面研削盤において、
研削中のワークの両側面の静圧パッド間の中心に対する位置を測定する一対の測定ヘッドと、
ワークの両側面の基準値と各測定ヘッドの測定値との減算により算出したワークの両側面の位置を比較して両研削砥石の切れ味差を求める切れ味比較手段と、
両研削砥石に切れ味差があるときに、両研削砥石の切れ味が同じになるように、研削砥石の切れ味に関係する研削条件を切れ味差に応じて補正する研削条件補正手段とを備えた
ことを特徴とする両頭平面研削盤。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011243138A JP5851803B2 (ja) | 2011-03-18 | 2011-11-07 | 薄板状ワークの研削方法及び両頭平面研削盤 |
KR1020120024979A KR101891345B1 (ko) | 2011-03-18 | 2012-03-12 | 박판형 워크의 연삭 방법 및 양두 평면 연삭반 |
DE102012204092A DE102012204092A1 (de) | 2011-03-18 | 2012-03-15 | Verfahren zum Schleifen von dünnen blattförmigen Werkstücken und Doppelend-Oberflächenschleifer |
TW101108995A TWI558507B (zh) | 2011-03-18 | 2012-03-16 | 薄板狀工件之研磨方法及雙頭平面磨床 |
Applications Claiming Priority (3)
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---|---|---|---|
JP2011060521 | 2011-03-18 | ||
JP2011060521 | 2011-03-18 | ||
JP2011243138A JP5851803B2 (ja) | 2011-03-18 | 2011-11-07 | 薄板状ワークの研削方法及び両頭平面研削盤 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012210698A JP2012210698A (ja) | 2012-11-01 |
JP2012210698A5 JP2012210698A5 (ja) | 2014-11-27 |
JP5851803B2 true JP5851803B2 (ja) | 2016-02-03 |
Family
ID=46757088
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Application Number | Title | Priority Date | Filing Date |
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JP2011243138A Expired - Fee Related JP5851803B2 (ja) | 2011-03-18 | 2011-11-07 | 薄板状ワークの研削方法及び両頭平面研削盤 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5851803B2 (ja) |
KR (1) | KR101891345B1 (ja) |
DE (1) | DE102012204092A1 (ja) |
TW (1) | TWI558507B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6383700B2 (ja) * | 2015-04-07 | 2018-08-29 | 光洋機械工業株式会社 | 薄板状ワークの製造方法及び両頭平面研削装置 |
JP7013908B2 (ja) * | 2018-02-06 | 2022-02-01 | トヨタ自動車株式会社 | 磨耗量測定装置 |
CN109344522B (zh) * | 2018-10-17 | 2023-07-04 | 沈阳透平机械股份有限公司 | 一种用于轴流压缩机的静叶磨削量的计算方法及系统 |
CN112894520B (zh) * | 2021-02-20 | 2023-04-18 | 南京超图中小企业信息服务有限公司 | 一种木板加工用双面抛光机 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6296553B1 (en) * | 1997-04-02 | 2001-10-02 | Nippei Toyama Corporation | Grinding method, surface grinder, workpiece support, mechanism and work rest |
JP2005238444A (ja) * | 1999-05-07 | 2005-09-08 | Shin Etsu Handotai Co Ltd | 両面同時研削方法および両面同時研削盤並びに両面同時ラップ方法および両面同時ラップ盤 |
JP2003071713A (ja) | 2001-08-29 | 2003-03-12 | Nippei Toyama Corp | 研削装置及びウェーハの厚さ管理方法 |
JP2003236748A (ja) | 2002-02-14 | 2003-08-26 | Sumitomo Heavy Ind Ltd | 研削装置 |
JP4319092B2 (ja) * | 2004-06-03 | 2009-08-26 | 住友重機械工業株式会社 | 両面加工装置 |
JP4670566B2 (ja) * | 2005-09-29 | 2011-04-13 | 信越半導体株式会社 | 半導体ウェーハの両頭研削装置、静圧パッドおよびこれを用いた両頭研削方法 |
DE102007030958B4 (de) * | 2007-07-04 | 2014-09-11 | Siltronic Ag | Verfahren zum Schleifen von Halbleiterscheiben |
-
2011
- 2011-11-07 JP JP2011243138A patent/JP5851803B2/ja not_active Expired - Fee Related
-
2012
- 2012-03-12 KR KR1020120024979A patent/KR101891345B1/ko active IP Right Grant
- 2012-03-15 DE DE102012204092A patent/DE102012204092A1/de active Pending
- 2012-03-16 TW TW101108995A patent/TWI558507B/zh active
Also Published As
Publication number | Publication date |
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TWI558507B (zh) | 2016-11-21 |
TW201249594A (en) | 2012-12-16 |
KR20120106577A (ko) | 2012-09-26 |
DE102012204092A1 (de) | 2012-09-20 |
JP2012210698A (ja) | 2012-11-01 |
KR101891345B1 (ko) | 2018-08-24 |
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