TWI558507B - 薄板狀工件之研磨方法及雙頭平面磨床 - Google Patents

薄板狀工件之研磨方法及雙頭平面磨床 Download PDF

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Publication number
TWI558507B
TWI558507B TW101108995A TW101108995A TWI558507B TW I558507 B TWI558507 B TW I558507B TW 101108995 A TW101108995 A TW 101108995A TW 101108995 A TW101108995 A TW 101108995A TW I558507 B TWI558507 B TW I558507B
Authority
TW
Taiwan
Prior art keywords
workpiece
grinding
polishing
pair
difference
Prior art date
Application number
TW101108995A
Other languages
English (en)
Chinese (zh)
Other versions
TW201249594A (en
Inventor
芝中篤志
Original Assignee
光洋機械工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 光洋機械工業股份有限公司 filed Critical 光洋機械工業股份有限公司
Publication of TW201249594A publication Critical patent/TW201249594A/zh
Application granted granted Critical
Publication of TWI558507B publication Critical patent/TWI558507B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/06—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent requiring comparison of the workpiece with standard gauging plugs, rings or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW101108995A 2011-03-18 2012-03-16 薄板狀工件之研磨方法及雙頭平面磨床 TWI558507B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011060521 2011-03-18
JP2011243138A JP5851803B2 (ja) 2011-03-18 2011-11-07 薄板状ワークの研削方法及び両頭平面研削盤

Publications (2)

Publication Number Publication Date
TW201249594A TW201249594A (en) 2012-12-16
TWI558507B true TWI558507B (zh) 2016-11-21

Family

ID=46757088

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101108995A TWI558507B (zh) 2011-03-18 2012-03-16 薄板狀工件之研磨方法及雙頭平面磨床

Country Status (4)

Country Link
JP (1) JP5851803B2 (ja)
KR (1) KR101891345B1 (ja)
DE (1) DE102012204092A1 (ja)
TW (1) TWI558507B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6383700B2 (ja) * 2015-04-07 2018-08-29 光洋機械工業株式会社 薄板状ワークの製造方法及び両頭平面研削装置
JP7013908B2 (ja) * 2018-02-06 2022-02-01 トヨタ自動車株式会社 磨耗量測定装置
CN109344522B (zh) * 2018-10-17 2023-07-04 沈阳透平机械股份有限公司 一种用于轴流压缩机的静叶磨削量的计算方法及系统
CN112894520B (zh) * 2021-02-20 2023-04-18 南京超图中小企业信息服务有限公司 一种木板加工用双面抛光机

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6296553B1 (en) * 1997-04-02 2001-10-02 Nippei Toyama Corporation Grinding method, surface grinder, workpiece support, mechanism and work rest
JP2005342851A (ja) * 2004-06-03 2005-12-15 Sumitomo Heavy Ind Ltd 両面加工装置
TW200903620A (en) * 2007-07-04 2009-01-16 Siltronic Ag Method for grinding semiconductor wafers

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005238444A (ja) * 1999-05-07 2005-09-08 Shin Etsu Handotai Co Ltd 両面同時研削方法および両面同時研削盤並びに両面同時ラップ方法および両面同時ラップ盤
JP2003071713A (ja) 2001-08-29 2003-03-12 Nippei Toyama Corp 研削装置及びウェーハの厚さ管理方法
JP2003236748A (ja) 2002-02-14 2003-08-26 Sumitomo Heavy Ind Ltd 研削装置
JP4670566B2 (ja) * 2005-09-29 2011-04-13 信越半導体株式会社 半導体ウェーハの両頭研削装置、静圧パッドおよびこれを用いた両頭研削方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6296553B1 (en) * 1997-04-02 2001-10-02 Nippei Toyama Corporation Grinding method, surface grinder, workpiece support, mechanism and work rest
JP2005342851A (ja) * 2004-06-03 2005-12-15 Sumitomo Heavy Ind Ltd 両面加工装置
TW200903620A (en) * 2007-07-04 2009-01-16 Siltronic Ag Method for grinding semiconductor wafers

Also Published As

Publication number Publication date
JP2012210698A (ja) 2012-11-01
KR20120106577A (ko) 2012-09-26
DE102012204092A1 (de) 2012-09-20
TW201249594A (en) 2012-12-16
KR101891345B1 (ko) 2018-08-24
JP5851803B2 (ja) 2016-02-03

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